Abstract: According to various aspects, exemplary embodiments are disclosed of shields (e.g., board level shields, etc.). In an exemplary embodiment, a shield generally includes one or more sidewalls. An upper portion of the one or more sidewalls define an opening having a perimeter. A lower portion of the one or more sidewalls is configured for installation to a substrate generally about one or more components on the substrate. An electrically-conductive material is disposed along the upper portion of the one or more sidewalls and around the perimeter of the opening. The electrically-conductive material is configured to establish an electrically-conductive pathway between the one or more sidewalls and a device housing when a portion of the device housing is positioned over the opening.

Abstract: According to various aspects, exemplary embodiments are disclosed of shielding apparatus or assemblies including electrically-conductive foam. Also disclosed are exemplary embodiments of methods relating to making shielding apparatus or assemblies including electrically-conductive foam. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.

Abstract: According to various aspects, exemplary embodiments are disclosed of shielding apparatus or assemblies including electrically-conductive foam frames and covers or lids attachable to the frames. Also disclosed are exemplary embodiments of electrically-conductive foam frames for shielding apparatus or assemblies. Further, exemplary embodiments are disclosed of methods relating to making shielding apparatus or assemblies including electrically-conductive foam frames. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.

Abstract: According to various aspects, exemplary embodiments are disclosed of shielding apparatus or assemblies including electrically-conductive foam frames and covers or lids attachable to the frames. Also disclosed are exemplary embodiments of electrically-conductive foam frames for shielding apparatus or assemblies. Further, exemplary embodiments are disclosed of methods relating to making shielding apparatus or assemblies including electrically-conductive foam frames. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.

Abstract: A hot embossing auto-leveling apparatus which has an air-floating spherical bearing between a lower mold and a base, placed in a depression on the base, with the base housing an air inlet and an air outlet. A hot embossing auto-leveling method, comprising the steps of (1) performing an upward and downward coupling movement of the lower and upper molds; (2) adjusting the lower mold against the upper mold using the air-floating spherical bearing; (3) fixing the lower mold by under pressure in an orientation parallel to the upper mold; (4) placing a molded part on the lower mold; (5) evacuating, heating and pressurizing a working chamber; (6) cooling; and (7) opening.

Abstract: The present invention relates to a high-transmission polarization module composed of sub-wavelength structures, which comprises: a transmission substrate and a plurality of collimation units. The transmission substrate possesses a top and a bottom surfaces. The top surface has a plurality of projecting and sunken parts, wherein the sunken part has a first sub-wavelength structure while the projecting part has a second sub-wavelength structure. The collimation units are arranged on the bottom surface according to the positions of the sunken parts capable of guiding the light into the sunken part. The first sub-wavelength structure is capable of separating the light with different polarizations while the second sub-wavelength structure is capable of shifting the phase of the light so that the light can pass the polarization module with a high efficiency and producing a light with a specific polarization.

Abstract: A method for manufacturing a 3-D high aspect-ratio microneedle array device, comprising steps of: providing a substrate, with a photoresist layer coated thereon; performing photolithography on the photoresist layer by using a gray-tone mask so as to form a patterned photoresist layer; performing high-selectivity etching on the patterned photoresist layer and the substrate by using inductively coupled plasma etching so as to transfer the pattern onto the substrate and form a structure; applying a material on the structure; and de-molding the structure from the substrate.

Abstract: The present invention relates to a high-transmission polarization module composed of sub-wavelength structures, which comprises: a transmission substrate and a plurality of collimation units. The transmission substrate possesses a top and a bottom surfaces. The top surface has a plurality of projecting and sunken parts, wherein the sunken part has a first sub-wavelength structure while the projecting part has a second sub-wavelength structure. The collimation units are arranged on the bottom surface according to the positions of the sunken parts capable of guiding the light into the sunken part. The first sub-wavelength structure is capable of separating the light with different polarizations while the second sub-wavelength structure is capable of shifting the phase of the light so that the light can pass the polarization module with a high efficiency and producing a light with a specific polarization.

Abstract: A method for manufacturing a 3-D high aspect-ratio microneedle array device, comprising steps of: providing a substrate, with a photoresist layer coated thereon; performing photolithography on the photoresist layer by using a gray-tone mask so as to form a patterned photoresist layer; performing high-selectivity etching on the patterned photoresist layer and the substrate by using inductively coupled plasma etching so as to transfer the pattern onto the substrate and form a structure; applying a material on the structure; and de-molding the structure from the substrate.

Abstract: A hot embossing auto-leveling apparatus which has an air-floating spherical bearing between a lower mold and a base, placed in a depression on the base, with the base housing an air inlet and an air outlet. A hot embossing auto-leveling method, comprising the steps of (1) performing an upward and downward coupling movement of the lower and upper molds; (2) adjusting the lower mold against the upper mold using the air-floating spherical bearing; (3) fixing the lower mold by under pressure in an orientation parallel to the upper mold; (4) placing a molded part on the lower mold; (5) evacuating, heating and pressurizing a working chamber; (6) cooling; and (7) opening.

Abstract: An optical fiber alignment element using integrated micro ball lens includes a substrate and a plurality of V-shaped grooves or waveguides formed on the substrate by lithography and etching. The substrate surface is coated with a first polymer layer and a high transparency second polymer layer, then is processed through a lithography process and heating process to form at least a base pad and a spherical micro ball lens between the V-shaped grooves or waveguides. Then dispose optical fibers in the V-shaped grooves. And encase an upper cap over the micro ball lens, grooves, and optical fibers or waveguides. Through suitable configuration and positioning of the micro ball lens, grooves or waveguides, the micro ball lens may be aligned precisely between two sides of the optical fibers or waveguides. The process is simpler, more accurate, and may produce the optical fiber alignment element in an integrated and batch fashion.

Abstract: An optical fiber alignment element using integrated micro ball lens includes a substrate and a plurality of V-shaped grooves or waveguides formed on the substrate by lithography and etching. The substrate surface is coated with a first polymer layer and a high transparency second polymer layer, then is processed through a lithography process and heating process to form at least a base pad and a spherical micro ball lens between the V-shaped grooves or waveguides. Then dispose optical fibers in the V-shaped grooves. And encase an upper cap over the micro ball lens, grooves, and optical fibers or waveguides. Through suitable configuration and positioning of the micro ball lens, grooves or waveguides, the micro ball lens may be aligned precisely between two sides of the optical fibers or waveguides. The process is simpler, more accurate, and may produce the optical fiber alignment element in an integrated and batch fashion.