Abstract: Optical devices and methods of manufacture are presented in which a mirror structure is utilized to transmit and receive optical signals to and from an optical device. In embodiments the mirror structure receives optical signals from outside of an optical device and directs the optical signals through at least one mirror to an optical component of the optical device.

Abstract: An integrated circuit package and the method of forming the same are provided. The integrated circuit package may include a first die having a first substrate and a first through via extending through the first substrate, a first gap-fill layer along a sidewall of the first substrate, an isolation layer on a surface of the first substrate and a surface of the first gap-fill layer, a first bonding layer over the isolation layer, and a first bonding pad in the first bonding layer. The isolation layer may overlap an interface between the sidewall of the first substrate and a sidewall of the first gap-fill layer, and may extend on sidewalls of the first through via.

Abstract: The present disclosure describes fabricating devices with tunable gate height and effective capacitance. A method includes forming a first metal gate stack in a dummy region of a semiconductor substrate and a second metal gate stack in an active device region of the semiconductor substrate, and performing a chemical mechanical polishing (CMP) process using a slurry including charged abrasive nanoparticles. The first and second metal gate stacks are different in composition. The charged abrasive nanoparticles include a first concentration in the active device region different from a second concentration in the dummy region.

Abstract: A device includes a first die, an interconnect structure, a RDL layer, a guard structure and an underfill layer. The interconnect structure is electrically connected to the first die. The RDL layer is disposed in a dielectric layer. The guard structure is disposed in the dielectric layer to define a connector region, wherein the guard structure and the interconnect structure are disposed on opposite sides of the die. The underfill layer surrounds the interconnect structure, the first die and the guard structure, wherein the underfill layer is kept outside of the connector region by the guard structure.

Abstract: A light-transmissible element and a lamp device using the light-transmissible element are provided. The light-transmissible element includes a light-inputting surface, a first light-outputting surface, a second light-outputting surface and plural microstructures. The first light-outputting surface and the second light-outputting surface are located beside two opposite sides of the light-inputting surface. The plural microstructures are formed on the second light-outputting surface. The plural light beams from the light-inputting surface are received and refracted by the plural microstructures. Consequently, a luminous flux of the light beams received and refracted by each first refractive surface is higher than a luminous flux of the light beams received and refracted by each second refractive surface. Due to this design, the light extraction efficiency of the overall lamp device is increased, the light output range is adjustable and the generation of the light spots is reduced.

Abstract: A motion sensitive lamp with a coupling mechanism is provided. The motion sensitive lamp is installed on a wall or a ceiling. The motion sensitive lamp at least includes a lamp body, a base and a coupling mechanism. A coupling mechanism includes an engaging structure, a positioning structure and a limiting element. One of the engaging structure and the positioning structure is installed on the lamp body. The other of the engaging structure and the positioning structure is installed on the base. The engaging structure is inserted into the positioning structure, so that the lamp body is locked on or coupled with the base. When an external force is applied to the limiting element, the external force results in a displacement of the limiting element, so that the limiting element is inserted into one of the base and the lamp body.

Abstract: A motion sensitive lamp with a coupling mechanism is provided. The motion sensitive lamp is installed on a wall or a ceiling. The motion sensitive lamp at least includes a lamp body, a base and a coupling mechanism. A coupling mechanism includes an engaging structure, a positioning structure and a limiting element. One of the engaging structure and the positioning structure is installed on the lamp body. The other of the engaging structure and the positioning structure is installed on the base. The engaging structure is inserted into the positioning structure, so that the lamp body is locked on or coupled with the base. When an external force is applied to the limiting element, the external force results in a displacement of the limiting element, so that the limiting element is inserted into one of the base and the lamp body.

Abstract: A light-transmissible element and a lamp device with the light-transmissible element are provided. The light-transmissible element is applied to a lamp device and a light-transmissible panel. The light-transmissible element at least includes a light-inputting surface, a first light-outputting surface, a second light-outputting surface and plural microstructures. The first light-outputting surface and the second light-outputting surface are located beside two opposite sides of the light-inputting surface. The plural microstructures are formed on the second light-outputting surface. The plural light beams from the light-inputting surface are received and refracted by the plural microstructures. Consequently, a luminous flux of the light beams received and refracted by each first refractive surface is higher than a luminous flux of the light beams received and refracted by each second refractive surface.

Abstract: An infrared-sensitive lighting device includes a host, a light-emitting module and an infrared sensing module. The light-emitting module is disposed on the host. The infrared sensing module includes a casing, a circuit board, a sensor and a lens cover. The casing is installed on the host and has an opening. The circuit board is disposed within the casing. The sensor is installed on the circuit board and aligned with the opening. The lens cover is rotatably mounted on the opening. The lens cover has a lens pattern. When the lens cover is in a first state, the sensor performs a sensing operation at a first direction angle through the lens pattern. When the lens cover is in a second state, the sensor performs the sensing operation at a second direction angle through the lens pattern.

Abstract: An infrared-sensitive lighting device includes a host, a light-emitting module and an infrared sensing module. The light-emitting module is disposed on the host. The infrared sensing module includes a casing, a circuit board, a sensor and a lens cover. The casing is installed on the host and has an opening. The circuit board is disposed within the casing. The sensor is installed on the circuit board and aligned with the opening. The lens cover is rotatably mounted on the opening. The lens cover has a lens pattern. When the lens cover is in a first state, the sensor performs a sensing operation at a first direction angle through the lens pattern. When the lens cover is in a second state, the sensor performs the sensing operation at a second direction angle through the lens pattern.

Abstract: A lighting device and a lighting device assembling and disassembling method complying with safety regulations are provided. The lighting device includes a main body, a circuit module, a fixing module, and a backside plate. The backside plate includes a first electric connection slot corresponding to the fixing module and a second electric connection slot corresponding to a first electric connection part of the circuit module. In the assembling process, the fixing module is initially connected with the first electric connection slot, and the electric connection between these two components is established. While the fixing module is connected with the first electric connection slot, the electric connection between the first electric connection part and the second electric connection slot is established. Afterwards, the fixing module and the first electric connection slot are structurally connected with each other.

Abstract: An optically controlled lighting group includes a plurality of optically controlled lighting devices, each of which includes a lighting main body, a dimming time controller and an optical detector. The light source is turned on during an on period corresponding to an on dimming signal, and the light source is turned off during an off period corresponding to the off dimming signal. If the ambient light intensity detected by the optical detector is different from a predetermined value, the light source is controlled by the dimming time controller. The light sources of the optically controlled lighting devices are sequentially and alternately enabled to illuminate at specified time intervals, and each of the specified time interval is shorter than the time period for producing persistence of vision.

Abstract: Any defects in the reflective multilayer coating or absorber layer of an EUV mask are problematic in transferring a pattern of the EUV mask to a wafer since they produce errors in integrated circuit patterns on the wafer. In this regard, a method of manufacturing an EUV mask is provided according to various embodiments of the present disclosure. To repair the defect, a columnar reflector, which acts as a Bragg reflector, is deposited according to various embodiments so as to locally compensate and repair the defect. According to the embodiments of the present disclosure, the reflective loss due to the defect can be compensated and recover the phase different due to the defect from, so as to form a desirable wafer printed image.

Abstract: A sensing type lighting device includes a lighting main body, a sensing element, and an electromagnetic wireless communication module. The lighting main body includes a controlling circuit and a light source set. The sensing element and the electromagnetic wireless communication module are disposed within the lighting main body. A controlling method for a sensing type lighting group includes the following steps. Firstly, a first lighting device with a first sensing element and a first electromagnetic wireless communication module is provided. Then, a second lighting device with a second electromagnetic wireless communication module is provided. According to an environmental sensing result of the first sensing element, a communication channel between the first and second electromagnetic wireless communication modules is established. Consequently, a light intensity of the first lighting device and/or the second lighting device is correspondingly controlled.

Abstract: Any defects in the reflective multilayer coating or absorber layer of an EUV mask are problematic in transferring a pattern of the EUV mask to a wafer since they produce errors in integrated circuit patterns on the wafer. In this regard, a method of manufacturing an EUV mask is provided according to various embodiments of the present disclosure. To repair the defect, a columnar reflector, which acts as a Bragg reflector, is deposited according to various embodiments so as to locally compensate and repair the defect. According to the embodiments of the present disclosure, the reflective loss due to the defect can be compensated and recover the phase different due to the defect from, so as to form a desirable wafer printed image.