Abstract: In a method of manufacturing a semiconductor device, a first interlayer dielectric (ILD) layer is formed over a substrate, a chemical mechanical polishing (CMP) stop layer is formed over the first ILD layer, a trench is formed by patterning the CMP stop layer and the first ILD layer, a metal layer is formed over the CMP stop layer and in the trench, a sacrificial layer is formed over the metal layer, a CMP operation is performed on the sacrificial layer and the metal layer to remove a portion of the metal layer over the CMP stop layer, and a remaining portion of the sacrificial layer over the trench is removed.

Abstract: Implementation of large temperature-insensitive resistance in CMOS using short-duty-clock cycle is provided herein. Operations of a method can comprise boosting a resistance level of a switched-resistor circuit to a defined resistance level. The boosting can comprise using a short-duty-cycle clock to facilitate the boosting. Also provided is a sensor system that can comprise a short-duty-cycle clock and a switched-resistor circuit. The short-duty cycle clock boosts a resistance level of the switched-resistor circuit to a defined resistance level.

Abstract: Embodiments of the present disclosure disclose example full-duplex data transmission methods and an example full-duplex data transmission apparatus. One example method includes: A first signal is sent by an access point to at least one first station. Information used to indicate at least one full-duplex TXOP is included in the first signal. A first data frame to the first station is sent by the access point based on the first signal. A second data frame is received by the access point from at least one second station. Transmission time intervals of the first data frame and the second data frame are included in a same full-duplex TXOP among the at least one full-duplex TXOP, and the transmission time intervals of the first data frame and the second data frame have a nonempty intersection set.

Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.

Abstract: A resistance of configurable termination circuitry located at an interface between a memory component and a processing device is adjusted. The configurable termination circuitry includes a plurality of transistors, a plurality of switches coupled to the plurality of transistors, and a plurality of resistors coupled to the plurality of switches. The resistance of the configurable termination circuitry is adjusted based on a mode of the configurable termination circuitry.

Abstract: The present invention relates to methods of repairing tissue. More specifically, the present invention relates to methods of using cells and an implantable support for the repair of tissue defects, where the implantable support and cells are implanted into the tissue defect less than 2 hours after the cells are applied to the support.

Abstract: A light-emitting device is provided. The light-emitting device includes a circuit substrate, an array substrate, a plurality of light-emitting units and a driver. The circuit substrate has a top surface and a bottom surface. A top circuit is disposed on the top surface. A bottom circuit is disposed on the bottom surface and electrically connected to the top circuit. The array substrate is disposed on the top surface of the circuit substrate and electrically connected to the top circuit. The light-emitting units are disposed on the array substrate. The driver is disposed on the bottom surface of the circuit substrate and electrically connected to the bottom circuit.

Abstract: In some embodiments, the present disclosure relates to a method that includes aligning a stealth laser apparatus over a wafer using an infrared camera coupled to the stealth laser apparatus. The stealth laser apparatus is used to form a stealth damage region within the wafer that is continuously connected around the wafer and separates an inner region from an outer region of the wafer. The stealth damage region is also arranged at a first distance from an edge of the wafer and extends from a first depth to a second depth beneath a top surface of the wafer. Further, the method includes forming a groove in the wafer to separate the outer region from the inner region of the wafer. The outer region of the wafer is removed using a blade, and a top portion of the inner region of the wafer is removed using a grinding apparatus.

Abstract: Apparatus and methods are provided for sidelink measurement configuration and report for open-loop sidelink power control. In one embodiment, the SL measurement report configuration configures a first measurement report, and wherein the reference threshold is an absolute reference threshold. In another embodiment, the reference threshold is an SL measurement result in an SL measurement report previously sent to the transmitting UE. In some embodiments, the reporting condition is the L3 filtered SL RSRP measurement being the offset higher or lower than the reference threshold. In yet another embodiment, the reporting condition is an explicit request of measurement report from the transmitting UE. In one embodiment, the SL measurement report includes one or more elements comprising a Boolean indicator, a delta value between the L3 filtered SL RSRP measurement and the reference threshold, and an absolute value of the L3 filtered SL RSRP measurement.

Abstract: A battery controller includes an auxiliary measurement energy-storing component, a control unit, a measuring unit and a protection unit. The auxiliary measurement energy-storing component is coupled in series to a battery module outside the controller, and configured to provide an open-circuited voltage. The control unit is configured to output a power value of the battery module according to the open-circuited voltage or a value of current flowing through the battery module. The measuring unit is configured to measure the current flowing through the battery module and transmit the measuring result to the control unit. The protection unit is configured to limit the value of current measured by the measuring unit to a predetermined value. A battery level measurement method of the battery controller is also disclosed.

Abstract: A thin film deposition system deposits a thin film on a substrate in a thin film deposition chamber. The thin film deposition system deposits the thin film by flowing a fluid into the thin film deposition chamber. The thin film deposition system includes a byproducts sensor that senses byproducts of the fluid in an exhaust fluid. The thin film deposition system adjusts the flow rate of the fluid based on the byproducts.

Abstract: An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.

Abstract: A computer-implemented method for processing and/or analyzing nucleic acid sequencing data comprises receiving a first data input and a second data input. The first data input comprises untargeted sequencing data generated from a first nucleic acid sample obtained from a subject. The second data input comprises target-specific sequencing data generated from a second nucleic acid sample obtained from the subject. Next, with the aid of a computer processor, the first data input and the second data input are combined to produce a combined data set. Next, an output derived from the combined data set is generated. The output is indicative of the presence or absence of one or more polymorphisms of the first nucleic acid sample and/or the second nucleic acid sample.

Abstract: A dual sensor imaging system and an imaging method thereof are provided. The dual sensor imaging system includes at least one color sensor, at least one infrared ray (IR) sensor, a storage device, and a processor. The processor is configured to load and execute a computer program stored in the storage device to: identify an imaging scene of the dual sensor imaging system; control the color sensor and the IR sensor to respectively capture multiple color images and multiple IR images by adopting multiple exposure conditions suitable for the imaging scene; adaptively select a combination of the color image and the IR image that can reveal details of the imaging scene; and fuse the selected color image and IR image to generate a scene image with details of the imaging scene.

Abstract: A multi-leaf collimator can include a first carriage, a second carriage, a drive device, a first set of leaves disposed on the first carriage, and a second set of leaves disposed on the second carriage, wherein the first set of leaves and the second set of leaves are disposed oppositely to each other, and each leaf in each of the sets of leaves is movable relative to the carriage; and the drive device is configured to drive the first carriage and the second carriage to move in the same direction synchronously.

Abstract: The present invention discloses a multi-dimensional vibration grinding cavity body. By adjusting amplitudes (power) and frequencies of the multi-dimensional ultrasonic vibration source, such that the multi-directional macroscopic flow is formed in the cavity body while keeping the vibration medium to have the original characteristics to improve the performance of grinding of slurry.

Abstract: The present invention provides a device or medical device comprising a graphene coating. Particularly, the graphene coating features substantially high transmittance, biointegrity and biocompatibility.

Abstract: A pixel structure including a substrate, a first conductor, a second conductor, and a plurality of dies is provided. The first conductor is disposed on the substrate and includes a plurality of first body portions extending along a first direction, a plurality of first branch portions extending along a second direction, and a plurality of second branch portions extending along the first direction. The second conductor is disposed on the substrate and includes a plurality of second body portions extending along the second direction and a plurality of third branch portions extending along the first direction. The die includes two electrodes, wherein the first branch portions are connected between the first body portions and the second branch portions, and the two electrodes are respectively connected to the first branch portions and the second body portions or respectively connected to the second branch portions and the third branch portions.

Abstract: The present invention discloses an autonomous vessel simulation system, comprising an environment model building system, a vessel model building system and a central processing system. The environment model building system builds at least one environment model; the vessel model building system builds at least one vessel model and an operation module of the central processing system integrates the environment model and the vessel model. The vessel model is navigated in the environment model according to at least one navigational parameter, and a display module displays the navigation status of the vessel model. In addition, an operating method of the autonomous vessel simulation system is also provided.

Abstract: An association establishment method and apparatus for carrying out the method are described. The association establishment method includes broadcasting, by an access point (AP), a trigger frame, wherein the trigger frame is used to trigger one or more unassociated stations STAs to perform uplink data transmission and indicate one or more available subchannels for random accessing of the unassociated STAs. The method further comprises receiving, by the AP, one or more association request messages sent on available subchannels acquired by the unassociated STAs. Thereafter, the AP broadcasts a multi-block acknowledgement M-BA frame, wherein the M-BA frame includes one or more pieces of association acknowledgement information and the association acknowledgement information is acknowledgement information of the association request message.