Abstract: In a method of manufacturing a semiconductor device, an interlayer dielectric (ILD) layer is formed over an underlying structure. The underlying structure includes gate structures, each having a metal gate and a cap insulating layer disposed over the metal gate, source/drain epitaxial layers disposed between two adjacent gate structures, and an etching-stop layer (ESL) covering the source/drain epitaxial layers. An opening is formed in the ILD layer by etching. A dielectric filling layer is formed in the opening. By using wet etching, the ILD layer disposed above the source/drain epitaxial layers is removed. The ESL disposed on the source/drain epitaxial layers is removed, thereby at least partially exposing the source/drain epitaxial layers. A conductive material is formed over the exposed source/drain epitaxial layers.

Abstract: A combustion supporting device is provided to use with a combustion furnace. The combustion supporting device includes a cone body, a tubular member, a frusto-conically shaped member, a base plate and a supporting portion. An upper end of the tubular member is connected to the cone body. The tubular member defines a plurality of gas holes around an upper portion thereof. The frusto-conically shaped member defines an insertion opening thereon. The diameter of the insertion opening corresponds to the outer diameter of the tubular member. A lower portion of the tubular member is passing through the insertion opening and received in the frusto-conically shaped member. The base plate defines a hole corresponding to the tubular member. The base plate is connected to a bottom of the frusto-conically shaped member. The hole communicates with a lower opening of the tubular member. The supporting portion is connected to the base plate.

Abstract: A mechanism for providing secure feature and key management in integrated circuits is described. An example method includes receiving, by a root authority system, data identifying a command that affects operation of an integrated circuit, singing, by the root authority system, the command using a root authority key to create a root signed block (RSB), and providing the RSB to a security manager of the integrated circuit.

Abstract: A memory module, comprising: a first pin, arranged to receive a first signal; a second pin, arranged to receive a second signal; a first conducting path, having a first end coupled to the first pin; at least one memory chip, coupled to the first conducting path for receiving the first signal; a predetermined resistor, having a first terminal coupled to a second end of the first conducting path; and a second conducting path, having a first end coupled to second pin for conducting the second to a second terminal of the predetermined resistor; wherein the first signal and the second are synchronous and configured to be a differential signal, for enabling a selected memory chip from the at least one memory chip to be accessed.

Abstract: A method includes forming a gate, a first dielectric layer, a first contact structure, and a second contact structure over a substrate. The first contact structure and the second contact structure are over a source region and a drain region respectively. The first dielectric layer surrounds the gate, the first contact structure, and the second contact structure. The method includes forming a second dielectric layer over the first dielectric layer. The second dielectric layer has an opening exposing the gate, the first contact structure, and the second contact structure. A conductive layer is formed in the opening to electrically connect the gate to the first contact structure and the second contact structure.

Abstract: An electrical connector includes an insulative housing an insulative housing enclosing two row of conductive terminals. Each of the terminals includes a front contacting section, a front spring section behind the front contacting section, a middle retaining section and a rear tail section along the front-to-back direction. In each row, the terminals include a pair of outer grounding terminals, a pair inner power terminals respectively beside the pair of outer grounding terminals, and a plurality of other terminals between the pair of power terminals in the transverse direction wherein for each of the pair of outer grounding terminals and the pair of inner power terminals, the front contacting section, the middle retaining section and the rear tails section are wider than the front contacting section in the transverse direction.

Abstract: A speed control switch includes a base. An upper end of the base is provided with a switch assembly. A side of the base is provided with a PCB board and a slide terminal. The PCB board is provided with a first contact plate. The slide terminal is slidably connected with the first contact plate. The base is provided with a trigger assembly for driving the slide terminal to slide along the first contact plate and to close the switch assembly. The speed control switch can regulate the speed of a motor precisely. The structure is compact to reduce the size of the switch, so that it is convenient for operation.

Abstract: The curing agent for coatings includes at least 1,3,5-triglycidyl benzenetricarboxylate and 1,3,5-diglycidyl benzenetricarboxylate. To produce the curing agent, 1,3,5-benzenetricarboxylic acid reacts with a base and chloropropene to produce triallyl benzene-1,3,5-tricarboxylate. Then the triallyl benzene-1,3,5-tricarboxylate reacts with a surfactant, hydrogen peroxide and a catalyst to produce 1,3,5-triglycidyl benzenetricarboxylate and/or 1,3,5-diglycidyl benzenetricarboxylate. The 1,3,5-triglycidyl benzenetricarboxylate can be applied to coatings as a curing agent.

Abstract: Provided are a method and apparatus for sending a Device-to-Device Synchronization Signal (D2D SS), and a User Equipment (UE). The method includes: selecting, by a source UE one Zadoff-Chu (ZC) sequence from M predetermined ZC sequences of which a length is N; mapping, by the source UE the selected ZC sequence to a predefined D2D SS source; and sending, by the source UE a D2D SS obtained after the mapping to a target UE. The method effectively reduces mutual interferences between a Demodulation-Reference Signal (DM-RS) and a Sounding Reference Signal (SRS) sent by the target UE and the D2D SS. The apparatus includes: a selection component, a mapping component, and a sending component. The apparatus may also include: a storage component, and a processing component.

Abstract: The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untreated side, based on the L*a*b color system, in the range of 75 to 90 and (b) a normal tensile strength in the range of 40 kgf/mm2 to 55 kgf/mm2. The disclosure further relates to flexible printed circuit boards and electronic devices using the above-mentioned copper foils for forming conductive lines therein.

Abstract: A Static Random Access Memory (SRAM) cell includes a first pull-up transistor and a first pull-down transistor, a second pull-up transistor and a second pull-down transistor, and first and second pass-gate transistors. A first buried contact electrically connects a drain region of the first pull-up transistor and gate electrodes of the second pull-up transistor and the second pull-down transistor, and includes a first metal layer formed in a region confined by spacers of a first gate layer and a first electrically conductive path formed at a level below the spacers. A second buried contact electrically connects a drain region of the second pull-up transistor and gate electrodes of the first pull-up transistor and the first pull-down transistor, and includes a second metal layer formed in a region confined by spacers of a second gate layer and a second electrically conductive path formed at the level below the spacers.

Abstract: Some embodiments relate to a die that has been formed by improved dicing techniques. The die includes a substrate which includes upper and lower substrate surfaces with a vertical substrate sidewall extending therebetween. The vertical substrate sidewall corresponds to an outermost edge of the substrate. A device layer is arranged over the upper substrate surface. A crack stop is arranged over an upper surface of the device layer and has an outer perimeter that is spaced apart laterally from the vertical substrate sidewall. The die exhibits a tapered sidewall extending downward through at least a portion of the device layer to meet the vertical substrate sidewall.

Abstract: A luminous keyboard with a gaming function includes a gaming program, plural keys, plural light-emitting elements and a control unit. When one of the plural keys is pressed down, a corresponding pressing signal is generated. When one of the plural light-emitting elements is turned on to emit a light beam, the corresponding key is illuminated. The control unit is connected with the plural keys, the plural light-emitting elements and the gaming program. The control unit turns on or turns off the plural light-emitting elements according to settings of the gaming program. Alternatively, the control unit turns off the light-emitting element corresponding to the illuminated key when the control unit receives the pressing signal corresponding to the illuminated key. In such way, the luminous keyboard can be used to play a game.

Abstract: Target optimization methods are disclosed herein for enhancing lithography printability. An exemplary method includes receiving an IC design layout for a target pattern, wherein the target pattern has a corresponding target contour; modifying the target pattern, wherein the modified target pattern has a corresponding modified target contour; and generating an optimized target pattern when the modified target contour achieves functionality of the target pattern as defined by a constraint layer. The method can further include defining a cost function based on the constraint layer, where the cost function correlates a spatial relationship between a contour of the target pattern and the constraint layer.

Abstract: A method for improving application sharing by dynamic partitioning can include partitioning a screen display of an application into grid regions and, in response to detecting that an application image in the plurality of grid regions have changed, offsetting positions of the grid regions, so that the changed portions of the application image are in fewer grid regions using a computer system. The method also can include transmitting image data in the offset grid regions involving the changed portions of the application image and identifications and offset data of the offset grid regions to an application sharing client.

Abstract: Provided are a powdery diacetal clarifying agent and a method of preparing the same. The powdery diacetal clarifying agent comprises a diacetal compound and an inorganic silicon-containing compound having a pH value equal to or more than 6 and equal to or less than 12. The powdery diacetal clarifying agent of the composition can have excellent flowability, dispersability, thermal resistance, and color stability. Accordingly, the powdery diacetal clarifying agent does not release stinking odor and incur yellowing at high temperature, allowing the plastic articles to have improved appearance and visual appeal.

Abstract: A method includes generating, by a transmitter, an original OFDM signal having at least one OFDM symbol, the at least one OFDM symbol having an associated time domain tail; truncating, by the transmitter, at least a portion of the time domain tail to produce a truncated OFDM signal; and transmitting, by the transmitter, the truncated OFDM signal.

Abstract: A mechanism for linking a chair and a footrest of a stairlift to each other includes: a base; a chair mounted on the base and having a seat swingably connected to the base and a cord control portion; a footrest having a plate pivotally connected to the base; a link unit having a first link and a footrest pivotal portion for driving the footrest to swing, wherein the first link has a base pivotal connection portion pivotally connected to the base, a cord-penetrable portion, and a spring-hooked portion; a control cable having a cord penetrating the cord-penetrable portion, wherein the cord has a first end connected to the cord control portion of the chair, a second end, and a link-pressing portion for pressing against the cord-penetrable portion; and a cable-connected spring with two ends hooked to the base and the second end of the control cable, respectively.

Abstract: A method of forming a semiconductor device includes providing a substrate structure having a semiconductor substrate and a fin structure on the semiconductor substrate. The fin structure includes a semiconductor layer and a hard mask layer on top of the semiconductor layer. The method also includes forming a spacer layer on sidewalls of the fin structure. Next, using the hard mask layer and the spacer layer as a mask, the semiconductor substrate is etched to form recesses on both sides of the fin structure that extend partially to underneath the bottom of the fin structure. The method further includes forming a filler material to fill at least the recesses, thereby forming the first filler layer. The first filler layer may be oxidized to form a porous oxide layer and the remaining portion of the substrate under the fin structures may be oxidized to form an oxide layer.

Abstract: Under layer composition and methods of manufacturing semiconductor devices are disclosed. The method of manufacturing semiconductor device includes the following steps. A layer of an under layer composition is formed, wherein the under layer composition includes a polymeric material and a cross-linker, and the cross-linker includes at least one decomposable functional group. A curing process is performed on the layer of the under layer composition to form an under layer, wherein the cross-linker is crosslinked with the polymeric material to form a crosslinked polymeric material having the at least one decomposable functional group. A patterned photoresist layer is formed over the under layer. An etching process is performed to transfer a pattern of the patterned photoresist layer to the under layer. The under layer is removed by decomposing the decomposable functional group.