Patents by Inventor Ming

Ming has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250101072
    Abstract: Present invention teaches the method of using a keratin hydrolysis peptide (“KHP”) solution to enhance sweetness and flavors of tea leaves. By selectively choosing specific weights of feathers and water, and treating the mixture to a high-temperature high-pressure hydrolysis process, the resulting solution is confirmed to contain at least 253 peptides and then applied to the surface of tea leaves during sprouting stage and infused to the soil around the tea trees/plants; the increased content of L-theanine and polyphenol is separately tested and confirmed. Optionally, the KHP solution can be diluted by water, as taught in the specification, before applying to the tea leaves and the soil as taught herein.
    Type: Application
    Filed: December 8, 2023
    Publication date: March 27, 2025
    Applicant: CH Biotech R&D Co., Ltd.
    Inventors: Iou-Zen CHEN, Meng-Ying LI, Pei-Chun LIAO, Nai-Hua YE, Ming-Yuan LEE
  • Publication number: 20250102770
    Abstract: An imaging lens system includes a lens barrel element and an imaging lens assembly disposed on the lens barrel element and including a first imaging lens element, a spacer element and a second imaging lens element. The spacer element has a second object-side contact surface corresponding to a first image-side contact surface of the first imaging lens element. The second imaging lens element has a third object-side contact surface corresponding to a second image-side contact surface of the spacer element. The lens barrel element and the spacer element form a buffer structure closer to an optical axis than the first image-side contact surface and including a first gap and a second gap located closer to the optical axis than the first gap. The first gap overlaps the third object-side contact surface in a direction parallel to the optical axis. A step difference is between the first and second gaps.
    Type: Application
    Filed: December 6, 2024
    Publication date: March 27, 2025
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Hsuan-Chin HUANG, Lin An CHANG, Ming-Ta CHOU, Chun-Tang TSAI
  • Publication number: 20250102554
    Abstract: Provided are a method, an apparatus, and a system for risk assessment of an insulation state of electrical equipment and a storage medium. The method includes measuring partial discharge data of electrical equipment using multiple types of sensors, and performing clustering of discharge types; establishing, based on a clustering result of each discharge type, a regression model between sensor response amplitude and apparent discharge energy during a discharge development process; calculating, based on the regression model, the accumulated value of apparent discharge energy of current partial discharge of the electrical equipment, and using the accumulated value as an index of risk assessment to assess an insulation state of the electrical equipment.
    Type: Application
    Filed: October 11, 2023
    Publication date: March 27, 2025
    Inventors: Tao ZHANG, Ming REN, Jin MIAO, Haobin GUAN, Kai WANG
  • Publication number: 20250105536
    Abstract: A connector and a manufacturing method thereof. The connector includes at least one circuit substrate, at least one contact and a first elastic body. The at least one circuit substrate has a first surface. The at least one contact includes a fixed part and a first contact part that are connected to each other. The fixed part is disposed on the at least one circuit substrate. The first contact part protrudes out of the first surface and covers a part of the first surface. The first elastic body is disposed on the first surface and is electrically insulated. At least a part of the first elastic body is located between the first contact part and the first surface.
    Type: Application
    Filed: March 14, 2024
    Publication date: March 27, 2025
    Applicant: UNIMICRON TECHNOLOGY CORP.
    Inventors: Ra-Min TAIN, Chunhsien CHIEN, Ching-Ho HSIEH, Ming-Hsing WU
  • Publication number: 20250102540
    Abstract: A probe assembly includes a multilayer structure including probe contact pads, an upper guide plate including an array of upper holes therethrough, a lower guide plate including an array of lower holes therethrough, a vertical stack of a plurality of dielectric spacer plates located between the upper guide plate and the lower guide plate and including a respective opening therethrough, and an array of probes attached to the probe contact pads, vertically extending through the array of upper holes and the array of lower holes, and vertically extending through the openings through the vertical stack of the plurality of dielectric spacer plates.
    Type: Application
    Filed: December 8, 2024
    Publication date: March 27, 2025
    Inventors: Ming-Cheng HSU, Wen-Chun TU
  • Publication number: 20250101465
    Abstract: Provided herein, inter alia, are compositions and methods related to correcting intron 22 inversion in the F8 gene using AAVHSC-mediated nuclease-free genome-editing.
    Type: Application
    Filed: May 11, 2022
    Publication date: March 27, 2025
    Inventors: Saswati Chatterjee, Lakshmi Bugga, Ka Ming Pang, Jeff Lynn Ellsworth
  • Publication number: 20250107299
    Abstract: A light emitting diode package structure and a method for manufacturing the same are provided. The LED package structure includes a substrate having a first and a second surface opposite to each other, a conductive structure including a first and a second conductive structure electrically connected with each other, a first gold layer disposed on the first conductive structure, a second gold layer disposed on the second conductive structure, an LED chip disposed on the first gold layer, and a package layer disposed on the first surface and encapsulating the first conductive structure, the first gold layer, and the LED chip. The first conductive structure is disposed on the first surface. The second conductive structure is disposed on the second surface. A thickness of the first gold layer is greater than 1 ?m. The second conductive structure is completely covered by the second gold layer.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 27, 2025
    Inventors: HAO-EN HUNG, SHIH-HAN WU, JHIH-WEI LAI, JIAN-YU SHIH, MING-YEN PAN
  • Publication number: 20250107196
    Abstract: A method according to the present disclosure includes receiving a workpiece that includes a gate structure, a first gate spacer feature, a second gate spacer feature, a gate-top dielectric feature over the gate structure, the first gate spacer feature and the second gate spacer feature, a first source/drain feature over a first source/drain region, a second source/drain feature over a second source/drain region, a first dielectric layer over the first source/drain feature, and a second dielectric layer over the second source/drain feature. The method further includes replacing a top portion of the first dielectric layer with a first hard mask layer, forming a second hard mask layer over the first hard mask layer while the second dielectric layer is exposed, etching the second dielectric layer to form a source/drain contact opening and to expose the second source/drain feature, and forming a source/drain contact over the second source/drain feature.
    Type: Application
    Filed: December 9, 2024
    Publication date: March 27, 2025
    Inventors: Ting Fang, Chia-Hsien Yao, Jui-Ping Lin, Chen-Ming Lee, Chung-Hao Cai, Fu-Kai Yang, Mei-Yun Wang
  • Publication number: 20250107454
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on a first sidewall of the MTJ, and a second spacer on a second sidewall of the MTJ. Preferably, the first spacer and the second spacer are asymmetric, the first spacer and the second spacer have different heights, and a top surface of the MTJ includes a reverse V-shape.
    Type: Application
    Filed: December 11, 2024
    Publication date: March 27, 2025
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Ying-Cheng Liu, Yi-An Shih, Yi-Hui Lee, Chen-Yi Weng, Chin-Yang Hsieh, I-Ming Tseng, Jing-Yin Jhang, Yu-Ping Wang
  • Publication number: 20250107130
    Abstract: A semiconductor structure includes a substrate, a channel layer on the substrate, a barrier layer on the channel layer, a first passivation layer on the insulating layer, a contact structure disposed on the first passivation layer and extending through the first passivation layer to directly contact a portion of the barrier layer, and an insulating layer interposed between the barrier layer and the first passivation layer and comprising an extending portion protruding toward a bottom corner of the contact structure.
    Type: Application
    Filed: December 10, 2024
    Publication date: March 27, 2025
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Ming-Hua Chang, Po-Wen Su, Chih-Tung Yeh
  • Publication number: 20250107244
    Abstract: A semiconductor device includes a first diode having a first cathode and a first anode, wherein the first cathode is floating. The semiconductor device includes a second diode having a second cathode and a second anode, wherein the first anode is coupled to the second anode with the second cathode connected to a first supply voltage. The semiconductor device includes a third diode having a third cathode and a third anode, wherein the third cathode is connected to the first anode at an input/output pin, with the third anode connected to a second supply voltage. The second anode is coupled to a circuit that is powered by the first supply voltage and the second supply voltage. The first diode has a first size and the second diode has a second size, and the first size is substantially greater than the second size.
    Type: Application
    Filed: September 25, 2023
    Publication date: March 27, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li-Wei Chu, Jam-Wem Lee, Wun-Jie Lin, Shou Ming Liu
  • Publication number: 20250104195
    Abstract: The present invention relates to an ultrasound image enhancement processing system and method thereof. The ultrasound image enhancement processing system includes at least one first ultrasound device and at least one server apparatus. The server apparatus receives a first ultrasound original image file, processes the first ultrasound original image file through a speckle reduction algorithm to generate a first processed image file, and performs a deep learning training on the first ultrasound original image file and the first processed image file to generate a first neural network model. The first neural network learning module is used to output a first speckle reduction enhancement image file. The image content of the first speckle reduction enhancement image file is approximating to the image content of the first processed image file.
    Type: Application
    Filed: September 22, 2023
    Publication date: March 27, 2025
    Inventors: Ting Lin, Chih-Hung WANG, Ming-Hsiao YAO, Kuan-Chieh WANG, Szu-Tien YU
  • Publication number: 20250102725
    Abstract: The present pertains to an optical module including an optical shell, a plurality of first light-emitting diodes, a plurality of light guide plates, and a plurality of second light-emitting diodes. The optical shell includes a plurality of recessed portions and a flat portion surrounding the recessed portions. One of the first light-emitting diodes is disposed in the recessed portions. Each of the light guide plates has a top surface and a sidewall, and the top surface of the light guide plate is substantially at the same level as the flat portion of the optical shell. One of the second light-emitting diodes is disposed below the top surface of the light guide plates and is adjacent to the sidewall of the light guide plates.
    Type: Application
    Filed: September 23, 2024
    Publication date: March 27, 2025
    Inventors: Jia-Jie PAN, Wei-Yi HSU, Jung-Tang CHU, Ming-Jing LEE
  • Publication number: 20250099274
    Abstract: A lumen stent, including a mesh support structure. The mesh support structure includes a first mesh region and a second mesh region connected to the first mesh region in a circumferential direction in a naturally deployed state. The first mesh region includes a plurality of rows of intersecting units formed by a plurality of first direction support wires spaced apart and a plurality of second direction support wires spaced apart overlapping each other. The second mesh region includes at least one row of hooking units, each row of the hooking units including a plurality of hooking units axially spaced apart, and the hooking unit including a first hooking member and a second hooking member. The first hooking member and the second hooking member are mutually hooked substantially in an axial direction. The lumen stent is less prone to shortening during release and has superior flexibility.
    Type: Application
    Filed: December 9, 2022
    Publication date: March 27, 2025
    Applicant: LIFETECH SCIENTIFIC (SHENZHEN) CO., LTD.
    Inventors: Tingbo MING, Benhao XIAO, Wulong YANG
  • Publication number: 20250102127
    Abstract: Disclosed is an illuminating device, including first and second light sources, first and second light receiving elements, a display module, and a projection module. The first and second light sources are for generating first and second light beam respectively. The first and second light receiving elements, located on the optical paths of the first and second light beams respectively, are for converging the first and second light beams respectively. The display module, located on the optical paths of the first and the second light beams, receives the first and second light beams and generates corresponding first and second image beams respectively. The projection module, located on the optical paths of the first and second image beams, projects the first and second image beams. A first etendue of the first light beam is greater than a second etendue of the second light beam.
    Type: Application
    Filed: September 10, 2024
    Publication date: March 27, 2025
    Applicant: Qisda Corporation
    Inventors: Chih-Shiung Chien, Ming-Kuen Lin, Tsung-Hsun Wu
  • Publication number: 20250100927
    Abstract: Reaction schemes involving acids and bases; reactors comprising spatially varying chemical composition gradients (e.g., spatially varying pH gradients), and associated systems and methods, are generally described.
    Type: Application
    Filed: December 6, 2024
    Publication date: March 27, 2025
    Applicant: Massachusetts Institute of Technology
    Inventors: Yet-Ming Chiang, Leah Ellis, Andres Badel
  • Publication number: 20250100957
    Abstract: Described herein are compositions having an eight-membered monocyclic unsaturated hydrocarbon, methods and system to separate the eight-membered monocyclic unsaturated hydrocarbon at from a hydrocarbon mixture including additional nonlinear unsaturated C8H2m hydrocarbons with 4?m?8, by contacting the hydrocarbon mixture with a 10-ring pore molecular sieve having a sieving channel with a 10-ring sieving aperture with a minimum crystallographic free diameter greater than 3 ? and a ratio of the maximum crystallographic free diameter to the minimum crystallographic free diameter between 1 and 2, the molecular sieve having a T1/T2 ratio ?20:1 wherein T1 is an element independently selected from Si and Ge, and T2 is an element independently selected from Al, B and Ga, the 10-ring pore molecular sieve further having a counterion selected from NH4+, Li+, Na+, K+ and Ca++.
    Type: Application
    Filed: December 6, 2024
    Publication date: March 27, 2025
    Inventors: Julia A. KORNFIELD, Mark E. DAVIS, Ming-Hsin WEI, Simon C. JONES
  • Publication number: 20250107117
    Abstract: A Schottky diode includes a substrate with an epitaxy layer on which a cathode region and an anode region are defined. A cathode structure and an anode structure are formed in the cathode region and the anode region respectively and horizontally separated by a distance. The anode structure includes a plurality of p-type doped regions diffused from the epitaxy layer toward the substrate, with an interval is formed between adjacent two p-type doped regions. A backside metal film and a backside protection layer are sequentially formed on a back surface of the substrate. Since the manufacturing of the Schottky diode does not involve wire bonding and molding processes, the overall thickness of the Schottky diode is reduced and heat dissipation is improved. With the backside metal film on the back side of the substrate, an equivalent resistance and a forward voltage of the Schottky diode can be reduced.
    Type: Application
    Filed: November 15, 2023
    Publication date: March 27, 2025
    Inventors: CHUNG-HSIUNG HO, CHI-HSUEH LI, CHIA-WEI CHEN, YU-MING HSU, WEN-LIANG HUANG, MING-KUN HSIN, SHIH-MING CHEN
  • Publication number: 20250103284
    Abstract: An electronic device includes a first buffer, a second buffer, and a multiplexer. The first buffer receives and stores first data when the first buffer is not full, and performs a First-In-First-Out (FIFO) operation on the first data. The second buffer receives and stores second data when the first buffer is full, and performs the FIFO operation on the second data. The multiplexer is electrically connected between the first buffer and the second buffer. The multiplexer receives the first data from outside of the electronic device, or it receives the second data from the second buffer. A depth of the first buffer is less than that of the second buffer.
    Type: Application
    Filed: September 12, 2024
    Publication date: March 27, 2025
    Inventors: Ming-Hung HSIEH, Pei-Lun WU, Hsin-Yu CHANG, Yu-Cheng WU
  • Publication number: 20250103796
    Abstract: Example embodiments relate to expanding textual content using transfer learning and iterative inference. An example method includes receiving, by a computing device, a snippet of text that contains one or more terms expressed using succinct representations. The method also includes performing an iterative expansion, by the computing device, using the snippet of text as an input snippet of text. The iterative expansion includes receiving, by the computing device, the input snippet of text. The iterative expansion also includes determining, by the computing device using a machine-learned model, a set of intermediate expanded snippets. Each of the intermediate expanded snippets has an associated score based on the machine-learned model.
    Type: Application
    Filed: February 23, 2023
    Publication date: March 27, 2025
    Inventors: Alvin Rajkomar, Eric Loreaux, Yuchen Liu, Ming-Jun Chen, Yi Zhang, Afroz Mohiuddin, Juraj Gottweis