Abstract: A method of manufacturing pre-molded lead frame for packaging is disclosed. A first patterned aluminum metal layer is formed on a temporary carrier. A displacement reaction procedure is performed, in which at least part of the first patterned aluminum metal layer is replaced by copper metal so as to form a first copper metal wiring layer. A first molding compound is formed around the first copper metal wiring layer. The temporary carrier is removed.

Abstract: The present disclosure provides an optical sensor module. An example optical sensor module comprises: a substrate comprising first conductive pads; a module cap assembled on the substrate; a connecting flex incorporated in the module cap, the connecting flex being adapted to electrically couple at least one of the first conductive pads to at least one component mounted on and/or inside the module cap; and the connecting flex comprising at least one metal layer covered by, or encapsulated in, at least one dielectric layer.

Abstract: A process gas is flowed from an input metal gas line that is electrically grounded to an output metal gas line via a connecting tube which is electrically insulating. Couplings between the metal gas lines and the connecting tube are sealed with gas couplings. Each gas coupling includes a sealing gasket, and a clamp compressing the sealing gasket between an end of the respective metal gas line and a corresponding end of the connecting tube. The process gas is delivered to a semiconductor processing tool via the output metal gas line. At least one operation is performed at the semiconductor processing tool that utilizes both the process gas delivered to the process tool via the output metal gas line and an electrical voltage of at least 2 kilovolts. The connecting tube may be sapphire. The sealing gaskets may be polytetrafluoroethylene (PTFE) sealing gaskets.

Abstract: An embedded flash memory structure, including a semiconductor substrate, an erase gate on the semiconductor substrate, two floating gates respectively at two sides of the erase gate on the semiconductor substrate, two word lines respectively at outer sides of the two floating gates, and two metal control gates respectively on the two floating gates, wherein a sacrificial layer is at at least one side of the metal control gate, and the sacrificial layer is between the metal control gate and the erase gate or between the metal control gate and the word line.

Abstract: A method for processing a substrate loading the substrate onto a plurality of lift pins passing through a pedestal arranged in a processing chamber. The plurality of lift pins are lowered to rest the substrate on the pedestal. A deposition gas mixture is supplied to deposit film on the substrate. The supply of the deposition gas mixture is stopped. The substrate is raised above the pedestal in the processing chamber using the plurality of lift pins. An etch gas mixture is supplied. Plasma is struck in the processing chamber between the substrate and the surface of the pedestal to remove residual film.

Abstract: Cell-free DNA molecules in a mixture of a biological sample can be analyzed to detect viral DNA. Methylation of viral DNA molecules at one or more sites in the viral genome can be determined. Mixture methylation level(s) can be measured based on one or more amounts of the plurality of cell-free DNA molecules methylated at a set of site(s) of the particular viral genome. The mixture methylation level(s) can be determined in various ways, e.g., as a density of cell-free DNA molecules that are methylated at a site or across multiple sites or regions. The mixture methylation level(s) can be compared to reference methylation level(s), e.g., determined from at least two cohorts of other subjects. The cohorts can have different classifications (including the first condition) associated with the particular viral genome. A first classification of whether the subject has the first condition can be determined based on the comparing.

Abstract: Train a text-to-image machine learning model by using a training dataset. The training dataset includes images and respective natural language descriptions of those images. The training causes the text-to-image machine learning model to be overfit on the training dataset. Store the trained overfit text-to-image machine learning model. Submit a given natural language description to the stored overfit text-to-image machine learning model. In response to the submitting, receive as output from the overfit text-to-image learning machine learning model an output image. The output image is a reproduction of a corresponding image from the training dataset and corresponds to the submitted natural language description.

Abstract: A measuring system includes a first chamber, a sound sensing device, a sound source and a top cover. A first cavity exists inside the first chamber. The sound sensing device is configured to sense a sound in the first cavity. The sound source is configured to generate a sound wave propagating towards the first cavity. The top cover is disposed on the first chamber. The measuring system is configured to measure a degree of opening of a vent formed by a venting device. The venting device is disposed between the first chamber and the top cover and connected to the first cavity of the first chamber for being measured the degree of opening, the first cavity of the first chamber is between the venting device and the sound sensing device, and the degree of opening is obtained according to a result generated by the sound sensing device.

Abstract: A described example includes: a heat slug coupled to a package substrate, the heat slug configured to conduct a current between terminals of the package substrate; a first magnetic shield mounted to a top surface of the package substrate, the first magnetic shield including a die mount area; a semiconductor die flip chip mounted to the die mount area; a second magnetic shield mounted to the package substrate, the second magnetic shield having a cantilever portion extending over a portion of the semiconductor die including a Hall element; electrical connections of wire bonds or ribbon bonds between bond pads of the semiconductor die and leads on the package substrate; and mold compound covering the electrical connections, the semiconductor die, the first magnetic shield, and the second magnetic shield, while a portion of the heat slug is exposed forming a thermal pad for a semiconductor device package.

Abstract: An antenna array and a ground station are provided, the antenna array includes at least one radiation module and a feed module, the radiation module includes a radiation layer and a dielectric layer arranged in stack, the radiation layer includes a plurality of radiators, each radiator radiates signals, the dielectric layer is made of non-conductive material; the feed module is arranged on a side of the radiation module closes to the dielectric layer, including a first feed layer and a second feed layer arranged in a stack, the first feed layer is provided with a plurality of first feed lines, the second feed layer is provided with a plurality of second feed lines, the first feed lines and the second feed lines are arranged in one-to-one correspondence, forming a plurality of feed line units, the feed line units are corresponding to the radiators one-to-one for providing feed signals for the corresponding radiators.

Abstract: A multi-layer cap shingle for installation along a ridge, hip, or rake of a roof includes a forward exposure area and a rear headlap area, and at least two layers of shingle material bonded together with patches of lamination adhesive adjacent their opposed edges. The bottom layer is configured with a deformation-absorbing mechanism such as a pair of slots extending from a forward edge rearwardly. When the multi-layer cap shingle is bent over a roof ridge, the slots of the bottom layer of shingle material narrow in width so that the bottom layer bends around an arc of slightly smaller radius than the top layer of shingle material. As a result, the opposed edges of the bottom and top layers remain aligned, and the edges of the top layer are laminated to the bottom layer to increase wind lift resistance of the installed multi-layer cap shingle.

Abstract: A cellulose-based all-solid-state polymer electrolyte separator, a preparation method thereof and an application thereof are provided. The cellulose separator is used as a skeleton, and solid-state polymer electrolyte is injected into pores of the separator using atomic layer deposition and dipping-coating processes. In addition, the polymer electrolyte remains in an amorphous structure at high temperatures by using an instantaneous quenching method, and ionic conductivity of the solid-state polymer electrolyte at room temperature is improved. After a surface of the solid-state polymer electrolyte separator is further coated with an alumina nanolayer, an electrochemical window width of the separator is significantly increased, and the solid-state polymer electrolyte separator is prevented from decomposing under a high voltage.

Abstract: A method for tracking an object in a dynamic scene and a system are provided. The object-tracking system acquires continuous frames and identifies one or more objects in each of the frames. A target object is chosen from a first frame. An object distance between the target object and each of the objects identified in a second frame is calculated. Word strings on the target object and every object identified in the second frame are recognized. A string similarity between the string on the target object and the string on each of the objects in the second frame is calculated. An overall score of the object distance and the string similarity is calculated and is referred to for determining if the target object is present in the second frame. Object-tracking is implemented when the target object is determined to be present in the second frame and subsequent frames.

Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes an integrated circuit (IC) component, an insulating layer laterally encapsulating the IC component, a redistribution structure disposed on the insulating layer and the IC component, and a warpage control portion coupling to a back side of the IC component opposite to the redistribution structure. The redistribution structure is electrically connected to the IC component. The warpage control portion includes a substrate, a patterned dielectric layer disposed between the substrate and the IC component, and a metal pattern embedded in the patterned dielectric layer and electrically isolated from the IC component.

Abstract: The present disclosure provides an optical sensor module. An example optical sensor module comprises: a light-emitting device; a module cap adapted to at least partially cover the light-emitting device, the module cap comprising a first opening located over the light-emitting device; at least a conductive strip assembled with, or included in, the module cap; a glass positioned in the first opening and/or covering the first opening, and adapted to transmit light signals emitted by the light-emitting device, the glass including a conductive trace; and at least a conductive wire formed by wire bonding, the at least one conductive wire electrically connecting the conductive trace to the at least one conductive strip.

Abstract: An environment detection apparatus is provided. In one embodiment, the detection apparatus comprises: a first sensing device, a second sensing device in fluid communication with the first sensing device and a spectrum analyzer electrically connected to the first sensing device and the second sensing device. The first sensing device includes a pair of first electrodes configured to provide a first alternating current signal directly to a gas flowing into the first sensing device. The second sensing device includes a first filter configured to capture a solid in the gas flowing into the second sensing device and a pair of second electrodes configured to provide a second alternating current signal directly to the first filter with the solid captured by the first filter.

Abstract: A recommendation method is provided, where the method includes: determining a user-event graph UEG based on training data, where the UEG includes a user node, an item node, a context node, and an intent node, and the intent node is separately connected to the user node, the item node, and the context node; performing graph convolution on a user feature, an item feature, a context feature, and an intent feature based on the UEG, to obtain a target feature set, where the target feature set includes a target user feature, a target item feature, and a target context feature; and recommending a target item to a target user based on the target feature set and a context feature of the target user in a target environment, where the target item is an item that matches the context feature in the target environment.

Abstract: An electronic device receives a first operation; detects that a first thread is in a runnable state on a first processing unit, and a second thread runs on the first processing unit; and migrates a first task of the first thread to a second processing unit, so that the first thread executes, on the second processing unit, the first task associated with the first operation, where the first task includes a layer composition task or a send-for-display task. The first thread includes a composition thread or a send-for-display thread, and a priority of the first thread is lower than a priority of the second thread.

Abstract: A time division duplexed (TDD) frequency modulation continuous wave (FMCW) radar system includes P transmitter circuit chains and M receiver circuit chains. The P transmitter circuit chains are used to transmit a plurality of FMCW signals. A pth transmitter circuit chain is coupled to a single pole Op throw (SPQPT) radio frequency (RF) switch, the SPOT RF switch is coupled to Op antennas, Qp and P are positive integers, and p is a positive integer not larger than P. The M receiver circuit chains are used to receive a plurality of reflected FMCW signals. An mth receiver circuit chain is coupled to a single pole Nm throw (SPNmT) radio frequency (RF) switch, the SPNmT RF switch is coupled to Nm antennas, Nm and M are positive integers, and m is a positive integer not larger than M.

Abstract: A contact structure according to the present disclosure includes a conductive feature, an etch stop layer (ESL) over the conductive feature, a dielectric layer over the ESL, and a contact feature extending through the dielectric layer and the ESL to contact the conductive feature. The dielectric layer includes a low-k dielectric matrix material, and nano-pipes disposed in the low-k dielectric matrix material and configured to reduce a thermal resistance of the dielectric layer.