Abstract: A thermally conductive structure is provided. The thermally conductive structure includes a thermally conductive plate and a first capillary structure formed by using an electrochemical deposition process. The first capillary structure is disposed on a side that is of the thermally conductive plate and that is opposite to a heat source. The first capillary structure has a plurality of media pores with different pore sizes, the plurality of media pores all extend along a thickness direction of the first capillary structure, and the plurality of media pores all run through the first capillary structure. The thermally conductive structure in this application can prevent untimely liquid flowback and resolve a problem of an excessively high temperature difference at a high heat flux density, thereby improving applicability and heat dissipation effect of the thermally conductive structure.