Patents by Inventor Mingchuan Han

Mingchuan Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package and method to manufacture the integrated circuit package to reduce bond wire defects in the integrated circuit package
    Patent number: 11784112
    Abstract: An integrated circuit package is formed by positioning an integrated circuit die on a die pad of a leadframe; connecting a bond wire between the die and a bond pad of the leadframe; encapsulating the bond wire, die, and bond pad with an encapsulant material to form a first mold cap of the integrated circuit package; after the encapsulating, bending one or more leads of the leadframe to form one or more bent leads; and encapsulating the first mold cap and a portion of a bend of the one or more bent leads with the encapsulant material to form a second mold cap.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: October 10, 2023
    Assignee: NXP USA, Inc.
    Inventors: Jian Song, Jun Li, Xingshou Pang, Mingchuan Han, Jinzhong Yao, Xuesong Xu
  • INTEGRATED CIRCUIT PACKAGE AND METHOD TO MANUFACTURE THE INTEGRATED CIRCUIT PACKAGE TO REDUCE BOND WIRE DEFECTS IN THE INTEGRATED CIRCUIT PACKAGE
    Publication number: 20220399257
    Abstract: An integrated circuit package is formed by positioning an integrated circuit die on a die pad of a leadframe; connecting a bond wire between the die and a bond pad of the leadframe; encapsulating the bond wire, die, and bond pad with an encapsulant material to form a first mold cap of the integrated circuit package; after the encapsulating, bending one or more leads of the leadframe to form one or more bent leads; and encapsulating the first mold cap and a portion of a bend of the one or more bent leads with the encapsulant material to form a second mold cap.
    Type: Application
    Filed: August 30, 2021
    Publication date: December 15, 2022
    Inventors: Jian Song, Jun Li, Xingshou Pang, Mingchuan Han, Jinzhong Yao, Xuesong Xu