Patents by Inventor Ming-Chuan Wang

Ming-Chuan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250141554
    Abstract: An optical transceiver includes a printed circuit board, a transceiver module, a plurality of filtering capacitors and a noise absorber. The printed circuit board is provided with a plurality of signal lines and a plurality of gold fingers each connecting one of the plurality of signal lines. The transceiver module is disposed on the printed circuit board and connecting the plurality of signal lines. Each of the plurality of filtering capacitors is located on one of the plurality of signal lines. The noise absorber covers at least one surface of the plurality of filtering capacitors opposite to the printed circuit board.
    Type: Application
    Filed: October 25, 2023
    Publication date: May 1, 2025
    Inventors: Chao-Hung TSAI, Che-Shou YEH, Ming-Chuan WANG
  • Publication number: 20230048168
    Abstract: A method for repairing a substrate and an electronic device are disclosed, wherein the electronic device includes: a substrate; a patterned metal layer disposed on the substrate, and the patterned metal layer including a first metal section and a second metal section which is disconnected to the first metal section, wherein at least one of the first metal section and the second metal section has a through hole; and a first conductive layer electrically connected to one of the first metal section and the second section by the through hole; wherein the first conductive layer has a protrusion, the protrusion locating outside the through hole.
    Type: Application
    Filed: October 27, 2022
    Publication date: February 16, 2023
    Inventors: Ming-Chuan WANG, Shang-Yen TSAI, Wei-Hang CHANG
  • Publication number: 20200243564
    Abstract: A method for repairing a substrate and an electronic device are disclosed, wherein the electronic device includes: a substrate; a patterned metal layer disposed on the substrate, and the patterned metal layer including a first metal section and a second metal section which is disconnected to the first metal section, wherein at least one of the first metal section and the second metal section has a through hole; and a first conductive layer electrically connected to one of the first metal section and the second section by the through hole; wherein the first conductive layer has a protrusion, the protrusion locating outside the through hole.
    Type: Application
    Filed: December 30, 2019
    Publication date: July 30, 2020
    Inventors: Ming-Chuan WANG, Shang-Yen TSAI, Wei-Hang CHANG
  • Patent number: 8007576
    Abstract: A chrome-free corrosion inhibitor composition includes: titanium chloride; a stabilizer including a mixture of hydrogen peroxide and at least a compound selected from nitric acid, persulfate, nitrate, and chlorate; and a film-forming enhancer selected from monosaccharide, oligosaccharide, polysaccharide, derivatives of saccharide, and combinations thereof.
    Type: Grant
    Filed: May 22, 2008
    Date of Patent: August 30, 2011
    Assignee: Ya Thai Chemical Co., Ltd.
    Inventors: Jyh-Rong Liang, Po-Ya Hsu, Ming-Chuan Wang, Chia-Chih Ou, Wen-Chieh Lin, I-Lin Cheng
  • Publication number: 20090139429
    Abstract: A chrome-free corrosion inhibitor composition includes: titanium chloride; a stabilizer including a mixture of hydrogen peroxide and at least a compound selected from nitric acid, persulfate, nitrate, and chlorate; and a film-forming enhancer selected from monosaccharide, oligosaccharide, polysaccharide, derivatives of saccharide, and combinations thereof.
    Type: Application
    Filed: May 22, 2008
    Publication date: June 4, 2009
    Applicant: YA THAI CHEMICAL CO., LTD.
    Inventors: Jyh-Rong LIANG, Po-Ya HSU, Ming-Chuan WANG, Chia-Chih OU, Wen-Chieh LIN, I-Lin CHENG
  • Publication number: 20030232283
    Abstract: A method for forming photoresist layers on a substrate. First, a first photoresist material is coated on the substrate. Next, a second photoresist material is coated on the first photoresist material before the first photoresist material is baked. Thereafter, the substrate is baked at 100˜140° C. for 50˜80 seconds to simultaneously form a first photoresist layer and a second photoresist layer thereon. The method further includes a step of cooling the first and the second photoresist layers to room temperature after the baking is performed.
    Type: Application
    Filed: June 18, 2002
    Publication date: December 18, 2003
    Inventors: Chen-Cheng Yung, Ming-Chuan Wang, Chang-Hao Yang