Patents by Inventor MINGDI WANG

MINGDI WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12137519
    Abstract: A planar lightwave circuit structure based on a printed circuit board and its manufacturing method are provided. The manufacturing method includes: S1, preparing the printed circuit board; S2, adhering the lower cladding layer to one side of the printed circuit board, and then annealing process carried out; S3, jetting a lightwave circuit material on an upper surface of the lower cladding layer in a predetermined route through an electrohydrodynamic jet printing device to form lightwave circuit lines to be cured, the lightwave circuit material being a slurry containing silver ions and an ultraviolet (UV) curing agent; S4, curing the lightwave circuit lines through irradiation of UV light, the UV light irradiating onto the lightwave circuit lines through a lens assembly with slits; and S5, depositing an upper cladding layer on the lower cladding layer and the lightwave circuit lines, and then solidifying treatment carried out.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: November 5, 2024
    Assignee: SOOCHOW UNIVERSITY
    Inventors: Mingdi Wang, Zilin Tang
  • Publication number: 20240352241
    Abstract: The invention belongs to the field of insulating materials, in particular cable insulating materials, and particularly relates to a modified flexible polypropylene insulating material, and preparation method and use thereof. The modified flexible polypropylene insulating material comprises a propylene-based continuous phase, and a rubber phase and a grafted phase derived from an unsaturated bond-containing polymerizable monomer dispersed in the propylene-based continuous phase; wherein, the modified flexible polypropylene insulating material has a content of xylene solubles of 10-55 wt %, preferably 15-45 wt %, more preferably 18-40 wt %, and still more preferably 20-40 wt %, based on the total weight of the modified flexible polypropylene insulating material; the content of structural units derived from the unsaturated bond-containing polymerizable monomer and in a grafted state in the modified flexible polypropylene insulating material is 0.3-6 wt %, and preferably 0.
    Type: Application
    Filed: August 3, 2022
    Publication date: October 24, 2024
    Inventors: Qing SHAO, Jinliang HE, Hao YUAN, Qi LI, Yaru ZHANG, Jun HU, Mingdi WANG, Shangshi HUANG, Juan LI, Shixun HU, Qi ZHANG, Dali GAO, Hongwei SHI
  • Publication number: 20230240003
    Abstract: A planar lightwave circuit structure based on a printed circuit board and its manufacturing method are provided. The manufacturing method includes: S1, preparing the printed circuit board; S2, adhering the lower cladding layer to one side of the printed circuit board, and then annealing process carried out; S3, jetting a lightwave circuit material on an upper surface of the lower cladding layer in a predetermined route through an electrohydrodynamic jet printing device to form lightwave circuit lines to be cured, the lightwave circuit material being a slurry containing silver ions and an ultraviolet (UV) curing agent; S4, curing the lightwave circuit lines through irradiation of UV light, the UV light irradiating onto the lightwave circuit lines through a lens assembly with slits; and S5, depositing an upper cladding layer on the lower cladding layer and the lightwave circuit lines, and then solidifying treatment carried out.
    Type: Application
    Filed: August 30, 2022
    Publication date: July 27, 2023
    Inventors: MINGDI WANG, ZILIN TANG