Patents by Inventor Ming Dong Cui

Ming Dong Cui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reducing input capacitance of high speed integrated circuits
    Patent number: 7535689
    Abstract: An integrated circuit with reduced pad capacitance, having a trench formed in the silicon substrate below the pad to reduce the pad capacitance. In another embodiment, an encapsulated air cavity is formed underneath the pad.
    Type: Grant
    Filed: June 21, 2007
    Date of Patent: May 19, 2009
    Assignee: Intel Corporation
    Inventors: Xiang Yin Zeng, Ming Dong Cui, Gregory V. Christensen, Mostafa Naguib Abdulla, Daoqiang Lu, Jiangqi He, Jiamiao Tang
  • Reducing input capacitance for high speed integrated circuits
    Publication number: 20080316662
    Abstract: An integrated circuit with reduced pad capacitance, having a trench formed in the silicon substrate below the pad to reduce the pad capacitance. In another embodiment, an encapsulated air cavity if formed underneath the pad. Other embodiments are described and claimed.
    Type: Application
    Filed: June 21, 2007
    Publication date: December 25, 2008
    Inventors: Xiang Yin Zeng, Ming Dong Cui, Gregory V. Christensen, Mostafa Naguib Abdulla, Daoqiang Lu, Jiangqi He, Jiamiao Tang