Patents by Inventor Ming-Fa Yang

Ming-Fa Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240087967
    Abstract: An integrated circuit component includes a semiconductor substrate, conductive pads, a passivation layer and conductive vias. The semiconductor substrate has an active surface. The conductive pads are located on the active surface of the semiconductor substrate and electrically connected to the semiconductor substrate, and the conductive pads each have a contact region and a testing region, where in each of the conductive pads, an edge of the contact region is in contact with an edge of the testing region. The passivation layer is located on the semiconductor substrate, where the conductive pads are located between the semiconductor substrate and the passivation layer, and the testing regions and the contact regions of the conductive pads are exposed by the passivation layer. The conductive vias are respectively located on the contact regions of the conductive pads.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzuan-Horng Liu, Chao-Hsiang Yang, Hsien-Wei Chen, Ming-Fa Chen
  • Publication number: 20060046327
    Abstract: A LED device with high heat dissipation capability has heat dissipating package formed by transparent epoxy and heat dissipating packing epoxy which is a mixture of heat dissipating particles and packing epoxy; during packing process the upper light emitting portion of the LED device is firstly packed with transparent packing epoxy which will not influence the illumination function of the LED device, and then the lower heat dissipating portion of the LED device is packed with heat dissipating packing epoxy through which the heat generated by the LED device may be dissipated to the ambient air when the LED device is lit by high electric current, so that the LED device of this invention may greatly improve the heat accumulation problem and increase light emission efficiency when it is lit; and, since the manufacturing method disclosed in the invention is suitable for the production of the frame type LED device, the process and equipment for producing the conventional frame type LED device could be directly empl
    Type: Application
    Filed: August 30, 2004
    Publication date: March 2, 2006
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Sung-Yueh Shieh, Dein-Run Fung, Chi-Ming Chang, Ming-Fa Yang
  • Publication number: 20050057145
    Abstract: A method for producing white light emission by means of secondary light excitation comprising the application of a light source such as Light Emitting diode (LED) or Laser Diode (LD) which may generate ultra violet light or violet light, with wavelength between 360˜420 nm, to excite blue phosphor to produce the broadband first exciting light spectrum having blue light as the main wave crest; the first exciting light in turn excites the yellow phosphor having lower energy level to produce the broadband secondary exciting light having yellow light as the main wave crest; the amount of the two phosphors are adjusted to some specific ratio so that the first exciting light spectrum and the secondary exciting light spectrum emitted by the phosphors enable the light-blend and complementary effect to produce a complete white light spectrum; Besides, red phosphor or green phosphor which may be excited by ultra violet or violet light may be added to adjust the color rendering effect and color temperature of the white l
    Type: Application
    Filed: March 12, 2004
    Publication date: March 17, 2005
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Sung-Yueh Shieh, Dein-Run Fung, Chi-Ming Chang, Ming-Fa Yang