Patents by Inventor Ming-Fang Wu

Ming-Fang Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240355782
    Abstract: In an embodiment, a device includes: a bottom integrated circuit die having a first front side and a first back side; a top integrated circuit die having a second front side and a second back side, the second back side being bonded to the first front side, the top integrated circuit die being free from through substrate vias (TSVs); a dielectric layer surrounding the top integrated circuit die, the dielectric layer being disposed on the first front side, the dielectric layer and the bottom integrated circuit die being laterally coterminous; and a through via extending through the dielectric layer, the through via being electrically coupled to the bottom integrated circuit die, surfaces of the through via, the dielectric layer, and the top integrated circuit die being planar.
    Type: Application
    Filed: June 27, 2024
    Publication date: October 24, 2024
    Inventors: Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih, Sung-Feng Yeh, Nien-Fang Wu
  • Patent number: 12119328
    Abstract: A die stack structure including a first semiconductor die, a second semiconductor die, an insulating encapsulation and a redistribution circuit structure is provided. The first semiconductor die includes a first semiconductor substrate including a first portion and a second portion, a first interconnect structure and a first bonding structure. The first interconnect structure is disposed on a top surface of the second portion, a lateral dimension of the first portion is greater than a lateral dimension of the top surface of the second portion. The second semiconductor die is disposed on the first semiconductor die and includes a second bonding structure, the second semiconductor die is electrically connected with the first semiconductor die through the first and second bonding structures. The insulating encapsulation is disposed on the first portion and laterally encapsulating the second portion and the second semiconductor die.
    Type: Grant
    Filed: August 1, 2023
    Date of Patent: October 15, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu
  • Publication number: 20240331862
    Abstract: The present invention provides a data analytic scheme for screening biomarkers for differential diagnosis of the status of Parkinson's disease, Parkinson's disease with mild cognitive impairment, Parkinson's disease dementia, Alzheimer's disease, and/or multiple system atrophy, the methodology implementing the same and the results of the screening thereof. Biomedical Oriented Logistic Dantzig Selector (BOLD Selector) was developed to identify candidate microRNAs and extracellular vesicle proteins effective at discerning between any two of the above mentioned disease categories from profiling results. The prediction models are finalized by establishing logistic regression formula for each pair of patient group differentiation.
    Type: Application
    Filed: March 29, 2024
    Publication date: October 3, 2024
    Inventors: Shau-Ping LIN, Ruey-Meei WU, Frederick Kin Hing Phoa, Ming-Che KUO, Yi-Tzang TSAI, Jing-Wen HUANG, Yan-Han LIN, Hsiang-Hsuan LIN WANG, Chia-Lang HSU, Ya-Fang HSU, Pin-Jui KUNG
  • Publication number: 20240322561
    Abstract: An electrostatic discharge protection circuit includes an electrostatic discharge clamp between a first rail and a second rail, a trigger device configured to activate the electrostatic discharge clamp in response to an electrostatic discharge event, and a charge dissipation element between the first rail and the second rail to dissipate a residual charge at an input of the trigger device.
    Type: Application
    Filed: May 24, 2024
    Publication date: September 26, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Ming-Fang Lai, Yi-Hsun Wu, Ching-Yun Chang
  • Patent number: 12083138
    Abstract: Provided are methods of treating joint pain, comprising administering to a subject in need of joint pain treatment an effective amount of a pharmaceutical composition comprising a lipid mixture comprising one or more lipids; and an effective amount of an intra-articular steroid or a pharmaceutically acceptable salt thereof, wherein the therapeutic efficacy of the intra-articular steroid is sustained but the side effects associated with the intra-articular steroid are reduced.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: September 10, 2024
    Assignees: Taiwan Liposome Co., Ltd., TLC Biopharmaceuticals, Inc.
    Inventors: Sheue-Fang Shih, Po-Chun Chang, Ming-Ju Wu
  • Publication number: 20240297151
    Abstract: A die stack structure including a first semiconductor die, a second semiconductor die, an insulating encapsulation and a redistribution circuit structure is provided. The first semiconductor die includes a first semiconductor substrate including a first portion and a second portion, a first interconnect structure and a first bonding structure. The first interconnect structure is disposed on a top surface of the second portion, a lateral dimension of the first portion is greater than a lateral dimension of the top surface of the second portion. The second semiconductor die is disposed on the first semiconductor die and includes a second bonding structure, the second semiconductor die is electrically connected with the first semiconductor die through the first and second bonding structures. The insulating encapsulation is disposed on the first portion and laterally encapsulating the second portion and the second semiconductor die.
    Type: Application
    Filed: May 13, 2024
    Publication date: September 5, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu
  • Patent number: 12057439
    Abstract: In an embodiment, a device includes: a bottom integrated circuit die having a first front side and a first back side; a top integrated circuit die having a second front side and a second back side, the second back side being bonded to the first front side, the top integrated circuit die being free from through substrate vias (TSVs); a dielectric layer surrounding the top integrated circuit die, the dielectric layer being disposed on the first front side, the dielectric layer and the bottom integrated circuit die being laterally coterminous; and a through via extending through the dielectric layer, the through via being electrically coupled to the bottom integrated circuit die, surfaces of the through via, the dielectric layer, and the top integrated circuit die being planar.
    Type: Grant
    Filed: November 10, 2022
    Date of Patent: August 6, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih, Sung-Feng Yeh, Nien-Fang Wu
  • Patent number: 10493126
    Abstract: The invention generally relates to an immunomodulatory protein and a chemotherapeutic agent for simultaneous, contemporaneous or sequential use in the treatment of diseases, more particularly of proliferative diseases, still more particularly of cancer(s), to a combination of an FIP and a chemotherapeutic agent, as well as to the medical and biotechnological applications thereof, more particularly in the field of the treatment of diseases, more particularly of proliferative diseases, still more particularly of cancer(s).
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: December 3, 2019
    Assignee: YEASTERN BIOTECH CO., LTD.
    Inventors: Jiunn-Liang Ko, Ting-Yi Hou, Ming-Fang Wu, Tzu-Chih Chen
  • Patent number: 10446010
    Abstract: The present disclosure relates to a grouped multi-device anti-loss warning system with multiple warning devices categorized as one group in which the warning devices granted an identical Group ID and not divided into mater/slave devices communicate with one another; a warning message can be activated among these warning devices in which contacts are disabled for broadcasting a notification that a group member (warning device) is considered as being out-of-touch within a preset period and fulfilling an anti-loss effect by mutual reminders among warning devices in the same group.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: October 15, 2019
    Assignee: KUN SHAN UNIVERSITY
    Inventors: Ping-Tsung Wang, Han-Chiang Chen, Ming-Fang Wu
  • Publication number: 20180286214
    Abstract: The present disclosure relates to a grouped multi-device anti-loss warning system with multiple warning devices categorized as one group in which the warning devices granted an identical Group ID and not divided into mater/slave devices communicate with one another; a warning message can be activated among these warning devices in which contacts are disabled for broadcasting a notification that a group member (warning device) is considered as being out-of-touch within a preset period and fulfilling an anti-loss effect by mutual reminders among warning devices in the same group.
    Type: Application
    Filed: December 22, 2017
    Publication date: October 4, 2018
    Inventors: Ping-Tsung Wang, Han-Chiang Chen, Ming-Fang Wu
  • Publication number: 20170173110
    Abstract: The invention generally relates to an immunomodulatory protein and a chemotherapeutic agent for simultaneous, contemporaneous or sequential use in the treatment of diseases, more particularly of proliferative diseases, still more particularly of cancer(s), to a combination of an FIP and a chemotherapeutic agent, as well as to the medical and biotechnological applications thereof, more particularly in the field of the treatment of diseases, more particularly of proliferative diseases, still more particularly of cancer(s).
    Type: Application
    Filed: March 12, 2015
    Publication date: June 22, 2017
    Applicant: YEASTERN BIOTECH CO., LTD
    Inventors: Jiunn-Liang Ko, Ting-Yi Hou, Ming-Fang Wu, Tzu-Chih Chen
  • Publication number: 20070011708
    Abstract: A microwave AV (audio and video) radio transmission system for reduction in cabled transmission, upgraded signal quality and quantity, lowered production cost, and neater appearance includes a transmitter and a receiver. The transmitter is connected to a socket of an AV source system. The receiver is connected to a socket of a receiving system. Each of the transmitter and the receiver comprises a plug to be directly plugged into the sockets of the AV source system and the receiving system, respectively. No AV cable is required for the connection.
    Type: Application
    Filed: July 5, 2005
    Publication date: January 11, 2007
    Inventor: Ming-Fang Wu
  • Patent number: 7141962
    Abstract: An EMI (Electrical Magnetic Interference) test system is provided. The system includes a testing table, a horizontal antenna, a vertical antenna and a processing unit. The testing table is used for supporting an Equipment Under Test (EUT). The horizontal antenna is positioned at a first location in an EMI chamber. The vertical antenna is positioned at a second location in the EMI chamber. The vertical antenna and the horizontal antenna are used for receiving the electromagnetic wave radiated from the EUT, and producing a vertical electric wave and a horizontal electric wave respectively. The processing unit is coupled to the vertical antenna and the horizontal antenna for transforming and analyzing the vertical electric wave and the horizontal electric wave.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: November 28, 2006
    Assignee: Avision Inc.
    Inventors: Chin-Yuan Lin, Ming-Fang Wu, Pei-Chih Liu, Yu-Kuo Wang, Yi-Kai Lin, Sheng-Lee Lin
  • Publication number: 20060024995
    Abstract: An electrical connector assembly (1) includes a first connector (2) and a second connector (3). The first connector includes a first housing (21) and first electrical contacts (22). The second connector includes a second housing (31) and second electrical contacts (32). The first contacts include signal contacts (22A), ground contacts (22B), and shield-joint contacts (22C). The signal contacts are arranged in pairs, with each pair transmitting one set of differential signals. The signal contacts within each pair are separated by an empty passage (214). Adjacent pairs of signal contacts are separated by one ground contact or by one shield-joint contact. The second contacts are configured to correspond to the first contacts, so that the first and second contacts can electrically mate with each other to electrically interconnect the first and second connectors. The wide interval between adjacent signal contacts enables cross talk between adjacent signal contacts to be reduced.
    Type: Application
    Filed: September 27, 2005
    Publication date: February 2, 2006
    Inventors: Ming-Fang Wu, Hung-Chi Yu
  • Publication number: 20060017428
    Abstract: An EMI (Electrical Magnetic Interference) test system is provided. The system includes a testing table, a horizontal antenna, a vertical antenna and a processing unit. The testing table is used for supporting an Equipment Under Test (EUT). The horizontal antenna is positioned at a first location in an EMI chamber. The vertical antenna is positioned at a second location in the EMI chamber. The vertical antenna and the horizontal antenna are used for receiving the electromagnetic wave radiated from the EUT, and producing a vertical electric wave and a horizontal electric wave respectively. The processing unit is coupled to the vertical antenna and the horizontal antenna for transforming and analyzing the vertical electric wave and the horizontal electric wave.
    Type: Application
    Filed: July 13, 2005
    Publication date: January 26, 2006
    Inventors: Chin-Yuan Lin, Ming-Fang Wu, Pei-Chih Liu, Yu-Kuo Wang, Yi-Kai Lin, Sheng-Lee Lin