Patents by Inventor MingHang Wu

MingHang Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEM AND METHOD FOR PERFORMING HOT WATER SEAL ON ELECTROSTATIC CHUCK
    Publication number: 20150235889
    Abstract: A method is provided for treating a bipolar ESC having a front surface and a back surface, the front surface including an anodized layer. The method includes eliminating the anodized layer, disposing a new anodized layer onto the front surface, and treating the new anodized layer with water to seal the new anodized layer.
    Type: Application
    Filed: May 5, 2015
    Publication date: August 20, 2015
    Applicant: LAM RESEARCH CORPORATION
    Inventors: Hong Shih, Tuochuan Huang, David Schaefer, Ambarish Chhatre, John Daugherty, MingHang Wu, Clifford La Croix
  • Method for performing hot water seal on electrostatic chuck
    Patent number: 9054148
    Abstract: A method is provided for treating a bipolar ESC having a front surface and a back surface, the front surface including an anodized layer. The method includes eliminating the anodized layer, disposing a new anodized layer onto the front surface, and treating the new anodized layer with water to seal the new anodized layer.
    Type: Grant
    Filed: August 26, 2011
    Date of Patent: June 9, 2015
    Assignee: Lam Research Corporation
    Inventors: Hong Shih, Tuochuan Huang, David Schaefer, Ambarish Chhatre, John Daugherty, MingHang Wu, Clifford La Croix
  • SYSTEM AND METHOD FOR PERFORMING HOT WATER SEAL ON ELECTROSTATIC CHUCK
    Publication number: 20130052339
    Abstract: A method is provided for treating a bipolar ESC having a front surface and a back surface, the front surface including an anodized layer. The method includes eliminating the anodized layer, disposing a new anodized layer onto the front surface, and treating the new anodized layer with water to seal the new anodized layer.
    Type: Application
    Filed: August 26, 2011
    Publication date: February 28, 2013
    Inventors: Hong Shih, Tuochuan Huang, David Schaefer, Ambarish Chhatre, John Daugherty, MingHang Wu, Clifford La Croix