Patents by Inventor Ming Hua Shi

Ming Hua Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit modeling method and framework tool
    Patent number: 8205174
    Abstract: An integrated circuit modeling method 100 implementable on computer, which has an executable software model 145 having modules 140 of reusable functional cores 105 coded in a high level language and a virtual platform of the integrated circuit employable in an architecture exploration step 115. A modeling library of modules coded in high level languages and hardware level languages are provided and instantiated according to user input in a functional verification step 120 having a co-simulation environment, with interface code 170 between modules automatically generated by an interface generator 130 based on a two dimensional data array of hardware specification inputs 205, the interface code 170 further interfacing with wrappers engaged between high and hardware level language modules.
    Type: Grant
    Filed: August 17, 2009
    Date of Patent: June 19, 2012
    Assignees: Hong Kong Applied Science and Technology Research, Institute Company Limited
    Inventors: Suet Fei Li, Yunzhao Lu, Erik Olsson, Ming Hua Shi
  • Integrated Circuit Modeling Method and Framework Tool
    Publication number: 20110041106
    Abstract: An integrated circuit modeling method 100 implementable on computer, which has an executable software model 145 having modules 140 of reusable functional cores 105 coded in a high level language and a virtual platform of the integrated circuit employable in an architecture exploration step 115. A modeling library of modules coded in high level languages and hardware level languages are provided and instantiated according to user input in a functional verification step 120 having a co-simulation environment, with interface code 170 between modules automatically generated by an interface generator 130 based on a two dimensional data array of hardware specification inputs 205, the interface code 170 further interfacing with wrappers engaged between high and hardware level language modules.
    Type: Application
    Filed: August 17, 2009
    Publication date: February 17, 2011
    Applicant: Hong Kong Applied Science and Technology Research Institute Company Limited
    Inventors: Suet Fei LI, Yunzhao LU, Erik OLSSON, Ming Hua SHI