Abstract: A foot peg assembly comprises a main body, an extension element and a cover body. The main body comprises a predetermined portion, the extension element is configured to be installed to the main body, so that an extension portion of the extension element exceeds the predetermined portion of the main body by a predetermined distance, and the cover body is configured to fix the extension element to the main body.

Abstract: A wireless charging device includes a casing, a wireless charging module, and an air-flow generator. The casing includes a housing part and a carrier plate disposed in the housing part to divide internal space of the housing part into a first accommodation space and a second accommodation space. The casing has an air inlet, an air outlet, and an opening. The carrier plate has a through hole. The air inlet, the air outlet, the opening, and the through hole are in fluid communication with the first accommodation space and the second accommodation space. The wireless charging module is located in the first accommodation space for charging a mobile device supported by the carrier plate. The air-flow generator is located in the first accommodation space for creating an airflow flowing through the air inlet, the second accommodation space, the through hole, the first accommodation space, and the air outlet.

Abstract: A wireless charger is configured to charge a mobile device and be connected to an air conditioner. The wireless charger includes a casing, a wireless charging module, and a valve assembly. The casing includes a first accommodation space, a second accommodation space, and an air inlet. The first accommodation space is in fluid communication with the second accommodation space, the first accommodation space is configured to accommodate the mobile device, and the air inlet is in fluid communication with the first accommodation space and the second accommodation space. The wireless charging module is located in the second accommodation space and configured to charge the mobile device. The valve assembly is mounted to the air inlet and configured to be connected to the air conditioner.

Abstract: A foot peg assembly comprises a main body, an extension element and a cover body. The main body comprises a predetermined portion, the extension element is configured to be installed to the main body, so that an extension portion of the extension element exceeds the predetermined portion of the main body by a predetermined distance, and the cover body is configured to fix the extension element to the main body.

Abstract: A mobile vehicle includes a vehicle body, a computer host and at least one damping assembly. The at least one damping assembly includes a mounting casing, a mounting sleeve and a damping body. The mounting casing is mounted on the vehicle body, and has an accommodation space and an opening connected to the accommodation space. The mounting sleeve is located in the accommodation space, and partially passes through the opening. The mounting sleeve is mounted on the computer host. The damping body is interposed between the mounting casing and the mounting sleeve.

Abstract: A mobile vehicle includes a vehicle body, a computer host and at least one damping assembly. The at least one damping assembly includes a mounting casing, a mounting sleeve and a damping body. The mounting casing is mounted on the vehicle body, and has an accommodation space and an opening connected to the accommodation space. The mounting sleeve is located in the accommodation space, and partially passes through the opening. The mounting sleeve is mounted on the computer host. The damping body is interposed between the mounting casing and the mounting sleeve.

Abstract: A wireless charging device includes a casing, a wireless charging module, and an air-flow generator. The casing includes a housing part and a carrier plate disposed in the housing part to divide internal space of the housing part into a first accommodation space and a second accommodation space. The casing has an air inlet, an air outlet, and an opening. The carrier plate has a through hole. The air inlet, the air outlet, the opening, and the through hole are in fluid communication with the first accommodation space and the second accommodation space. The wireless charging module is located in the first accommodation space for charging a mobile device supported by the carrier plate. The air-flow generator is located in the first accommodation space for creating an airflow flowing through the air inlet, the second accommodation space, the through hole, the first accommodation space, and the air outlet.

Abstract: A wireless charger is configured to charge a mobile device and be connected to an air conditioner. The wireless charger includes a casing, a wireless charging module, and a valve assembly. The casing includes a first accommodation space, a second accommodation space, and an air inlet. The first accommodation space is in fluid communication with the second accommodation space, the first accommodation space is configured to accommodate the mobile device, and the air inlet is in fluid communication with the first accommodation space and the second accommodation space. The wireless charging module is located in the second accommodation space and configured to charge the mobile device. The valve assembly is mounted to the air inlet and configured to be connected to the air conditioner.

Abstract: A fixing structure, configured to fix screw. Screw includes wide portion and narrow portion. Fixing structure includes plate part, holding component and elastic positioning component. Plate part includes top surface, bottom surface and mount groove. Mount groove penetrates through top surface and bottom surface and narrow portion is disposed through mount groove to allow wide portion to rest on top surface. Holding component and top surface together form space. Elastic positioning component is disposed on plate part. When wide portion is located in space and between holding component and top surface, and elastic positioning component is in holding state and located at side of wide portion, wide portion is prevented from being moved away from space. When elastic positioning component is switched to released state, elastic positioning component is removed from side of wide portion so that wide portion is allowed to move away from space.

Abstract: An electronic assembly and a heat dissipation assembly thereof. The electronic assembly includes a circuit board and a heat dissipation assembly. The circuit board includes a plate body and a heat source disposed on the plate body. The heat dissipation assembly includes a fin assembly, a mounting plate body, and a heat dissipation pillar. The mounting plate body is fixed to the fin assembly and includes a mounting hole. The heat dissipation pillar is engaged in the mounting hole of the mounting plate body. One end of the heat dissipation pillar is in thermal contact with the fin assembly, and another end of the heat dissipation pillar is in thermal contact with the heat source of the circuit board.

Abstract: A supporting member includes a body portion, at least one first fixing portion, and at least one second fixing portion. The first fixing portion is connected to a side of the body portion and bends relative to the body portion. The first fixing portion is configured to be fixed to a first circuit board. The second fixing portion is connected to another side of the body portion and bends relative to the body portion. The second fixing portion is configured to be fixed to a second circuit board.

Abstract: A fixing structure, configured to fix screw. Screw includes wide portion and narrow portion. Fixing structure includes plate part, holding component and elastic positioning component. Plate part includes top surface, bottom surface and mount groove. Mount groove penetrates through top surface and bottom surface and narrow portion is disposed through mount groove to allow wide portion to rest on top surface. Holding component and top surface together form space. Elastic positioning component is disposed on plate part. When wide portion is located in space and between holding component and top surface, and elastic positioning component is in holding state and located at side of wide portion, wide portion is prevented from being moved away from space. When elastic positioning component is switched to released state, elastic positioning component is removed from side of wide portion so that wide portion is allowed to move away from space.

Abstract: A supporting member includes a body portion, at least one first fixing portion, and at least one second fixing portion. The first fixing portion is connected to a side of the body portion and bends relative to the body portion. The first fixing portion is configured to be fixed to a first circuit board. The second fixing portion is connected to another side of the body portion and bends relative to the body portion. The second fixing portion is configured to be fixed to a second circuit board.

Abstract: A plate for at least partially covering a first circuit board includes a body portion, at least one first fixing post, at least one second fixing post, and at least one crossing region. The body portion is configured to cover the first circuit board. The first fixing post is connected to a side of the body portion and protrudes from the body portion. The first fixing post is configured to be fixed to the first circuit board. The second fixing post is connected to another side of the body portion and protrudes from the body portion. The second fixing post is configured to be fixed to a second circuit board. The crossing region is disposed on the body portion. The crossing region is configured to allow at least one electronic component on the first circuit board to pass through.

Abstract: An electronic device comprises a housing, and a fan connection member. The housing comprises a bottom plate having a motherboard mounting area. The fan connection member is disposed on the bottom plate, and an orthogonal projection of the fan connection member onto the bottom plate partially overlaps with the motherboard mounting area. The fan connection member includes a fan base and a fan seat pivoted on the fan base. The orthogonal projection of the fan connection member has a first overlap area on the motherboard mounting area at a working state of the fan connection member. The orthogonal projection of the fan connection member has a second overlap area on the motherboard mounting area at a maintenance state of the fan connecting member. The first overlap area is larger than the second overlap area.

Abstract: A thin film transistor (TFT) array substrate and a display panel are provided. The TFT array substrate includes multiple pixels arranged in an array. Each pixel includes first through third sub-pixels sequentially arranged along a first direction. The first through third sub-pixels are connected to a same scan line. The TFT array substrate further includes first through third data lines sequentially arranged along the first direction. The first through third data lines respectively are for driving the first through third sub-pixels. The first sub-pixel includes first and second areas, the second sub-pixel includes third and fourth areas, and the third sub-pixel includes fifth and sixth areas, arranged along a second direction. A voltage difference between a sub-pixel electrode in the sixth area and a common electrode is different from a voltage difference between a sub-pixel electrode in the fifth area and the common electrode.

Abstract: A thin film transistor (TFT) array substrate and a display panel are provided. The TFT array substrate includes multiple pixels arranged in an array. Each pixel includes first through third sub-pixels sequentially arranged along a first direction. The first through third sub-pixels are connected to a same scan line. The TFT array substrate further includes first through third data lines sequentially arranged along the first direction. The first through third data lines respectively are for driving the first through third sub-pixels. The first sub-pixel includes first and second areas, the second sub-pixel includes third and fourth areas, and the third sub-pixel includes fifth and sixth areas, arranged along a second direction. A voltage difference between a sub-pixel electrode in the sixth area and a common electrode is different from a voltage difference between a sub-pixel electrode in the fifth area and the common electrode.

Abstract: The invention provides a thin film transistor (TFT) array substrate and a display panel. The TFT array substrate is disposed with multiple pixels arranged in an array. Each pixel includes first through third sub-pixels sequentially arranged along a first direction. The first through third sub-pixels are connected to a same scan line. The TFT array substrate further is disposed with first through third data lines sequentially arranged along the first direction. The first through third data lines respectively are for driving the first through third sub-pixels. The first sub-pixel includes first and second areas, the second sub-pixel includes third and fourth areas, and the third sub-pixel includes fifth and sixth areas, arranged along a second direction. A voltage difference between a sub-pixel electrode in the sixth area and a common electrode is different from a voltage difference between a sub-pixel electrode in the fifth area and the common electrode.

Abstract: In the present disclosure, one TFT substrate and a liquid crystal panel are disclosed. The TFT substrate includes a plurality of pixel cells, and each of the pixel cells includes three sub-pixel cells. Within one pixel cell, at least one sub-pixel includes single pixel area. Each of the other pixel cells includes two isolated pixel areas, and brightness of the at least two isolated pixel areas being different. In view of the above, the performance of the liquid crystal panel is enhanced when the viewing angle is large. In addition, the transmission rate of the liquid crystal panel may be maintained to be higher, which saves the power consumption of the backlight module so as to save the energy.

Abstract: In the present disclosure, one TFT substrate and a liquid crystal panel are disclosed. The TFT substrate includes a plurality of pixel cells, and each of the pixel cells includes three sub-pixel cells. Within one pixel cell, at least one sub-pixel includes single pixel area. Each of the other pixel cells includes two isolated pixel areas, and brightness of the at least two isolated pixel areas being different. In view of the above, the performance of the liquid crystal panel is enhanced when the viewing angle is large. In addition, the transmission rate of the liquid crystal panel may be maintained to be higher, which saves the power consumption of the backlight module so as to save the energy.