Abstract: A housing structure includes a first cover and a second cover. The first cover includes a first substrate and two first side plates. The second cover includes a second substrate and two second side plates. The two first side plates and the two second side plates are spliced between the first substrate and the second substrate, such that an accommodating space is formed between the first cover and the second cover.

Abstract: A mobile vehicle includes a vehicle body, a computer host and at least one damping assembly. The at least one damping assembly includes a mounting casing, a mounting sleeve and a damping body. The mounting casing is mounted on the vehicle body, and has an accommodation space and an opening connected to the accommodation space. The mounting sleeve is located in the accommodation space, and partially passes through the opening. The mounting sleeve is mounted on the computer host. The damping body is interposed between the mounting casing and the mounting sleeve.

Abstract: Route management methods and systems for electric vehicles are provided. First, a driving monitoring system of an electric vehicle is used to detect a driving state of the electric vehicle. Then, the driving state is transmitted to the server via a network by the driving monitoring system. The server performs an analysis according to the driving state to obtain a driving behavior index of a driver corresponding to the electric vehicle. Then, a plurality of routes are provided in the server, wherein each route includes a plurality of stations, and average distance between two stations. The server selects one of the routes according to the driving behavior index, and assigns the selected route to the driver of the electric vehicle.

Abstract: A package structure and method of forming the same are provided. The package structure includes a first die and a second die disposed side by side, a first encapsulant laterally encapsulating the first and second dies, a bridge die disposed over and connected to the first and second dies, and a second encapsulant. The bridge die includes a semiconductor substrate, a conductive via and an encapsulant layer. The semiconductor substrate has a through substrate via embedded therein. The conductive via is disposed over a back side of the semiconductor substrate and electrically connected to the through substrate via. The encapsulant layer is disposed over the back side of the semiconductor substrate and laterally encapsulates the conductive via. The second encapsulant is disposed over the first encapsulant and laterally encapsulates the bridge die.

Abstract: A mobile vehicle includes a vehicle body, a computer host and at least one damping assembly. The at least one damping assembly includes a mounting casing, a mounting sleeve and a damping body. The mounting casing is mounted on the vehicle body, and has an accommodation space and an opening connected to the accommodation space. The mounting sleeve is located in the accommodation space, and partially passes through the opening. The mounting sleeve is mounted on the computer host. The damping body is interposed between the mounting casing and the mounting sleeve.

Abstract: A quick-release combination structure includes a panel and a water-proof cover. The panel includes a groove and a sliding channel. The groove is recessed from a surface of the panel. The sliding channel is connected to the groove and runs through the panel. The water-proof cover includes a cover body and a guiding plate. The cover body is configured to be at least partially accommodated in the groove and cover the sliding channel. The guiding plate is connected to the cover body and slidably inserted in the sliding channel. A thickness of the guiding plate is smaller than a distance of an inner wall of the sliding channel in a thickness direction of the guiding plate, thereby allowing two ends of the guiding plate to seesaw in the thickness direction relative to the panel.

Abstract: A fixing device includes a circuit board, a first cover, a reinforcing piece, and a double-layer chip. The circuit board has a first surface and a second surface opposite to each other. The first cover is disposed adjacent to the first surface and has a first bump which has a first abutting surface facing the first surface. The reinforcing piece is located on the first surface and adjacent to the first bump. The double-layer chip has an upper layer and a lower layer which are electrically connected. An upper surface of the upper layer and a lower surface of the lower layer are respectively located on opposite sides of the double-layer chip, and an area of the upper surface is smaller than an area of the lower surface. The lower layer of the double-layer chip and the second surface of the circuit board are electrically connected.

Abstract: A wireless charging device includes a casing, a wireless charging module, and an air-flow generator. The casing includes a housing part and a carrier plate disposed in the housing part to divide internal space of the housing part into a first accommodation space and a second accommodation space. The casing has an air inlet, an air outlet, and an opening. The carrier plate has a through hole. The air inlet, the air outlet, the opening, and the through hole are in fluid communication with the first accommodation space and the second accommodation space. The wireless charging module is located in the first accommodation space for charging a mobile device supported by the carrier plate. The air-flow generator is located in the first accommodation space for creating an airflow flowing through the air inlet, the second accommodation space, the through hole, the first accommodation space, and the air outlet.

Abstract: A quick-release combination structure includes a panel and a water-proof cover. The panel includes a groove and a sliding channel. The groove is recessed from a surface of the panel. The sliding channel is connected to the groove and runs through the panel. The water-proof cover includes a cover body and a guiding plate. The cover body is configured to be at least partially accommodated in the groove and cover the sliding channel. The guiding plate is connected to the cover body and slidably inserted in the sliding channel. A thickness of the guiding plate is smaller than a distance of an inner wall of the sliding channel in a thickness direction of the guiding plate, thereby allowing two ends of the guiding plate to seesaw in the thickness direction relative to the panel.

Abstract: An antenna device includes a housing, a masking frame, and antennas. The housing includes a side wall, a bottom wall, a heat dissipation structure, and bumps. The side wall surrounds the heat dissipation structure. The bottom wall connects to an edge of the side wall and extends outwards relative to the side wall. Each one of the bumps is disposed on one of the side wall and the bottom wall. The masking frame is removably fastened on the housing and defines an accommodation space with the side wall and the bottom wall. The antennas are disposed in the accommodation space and covered by the masking frame. The bumps contact the antennas, respectively.

Abstract: A housing structure includes a first cover and a second cover. The first cover includes a first substrate and two first side plates. The second cover includes a second substrate and two second side plates. The two first side plates and the two second side plates are spliced between the first substrate and the second substrate, such that an accommodating space is formed between the first cover and the second cover.

Abstract: A fixing device includes a circuit board, a first cover, a reinforcing piece, and a double-layer chip. The circuit board has a first surface and a second surface opposite to each other. The first cover is disposed adjacent to the first surface and has a first bump which has a first abutting surface facing the first surface. The reinforcing piece is located on the first surface and adjacent to the first bump. The double-layer chip has an upper layer and a lower layer which are electrically connected. An upper surface of the upper layer and a lower surface of the lower layer are respectively located on opposite sides of the double-layer chip, and an area of the upper surface is smaller than an area of the lower surface. The lower layer of the double-layer chip and the second surface of the circuit board are electrically connected.

Abstract: A wireless charger is configured to charge a mobile device and be connected to an air conditioner. The wireless charger includes a casing, a wireless charging module, and a valve assembly. The casing includes a first accommodation space, a second accommodation space, and an air inlet. The first accommodation space is in fluid communication with the second accommodation space, the first accommodation space is configured to accommodate the mobile device, and the air inlet is in fluid communication with the first accommodation space and the second accommodation space. The wireless charging module is located in the second accommodation space and configured to charge the mobile device. The valve assembly is mounted to the air inlet and configured to be connected to the air conditioner.

Abstract: The present disclosure discloses a pixel structure, an array substrate and a display panel. The pixel structure includes a first data line; a first gate line and a second gate line; a first pixel unit and a second pixel unit. The first pixel units and second pixel units arranged along a second direction; a first pixel electrode relative to the second pixel electrode is close to the first data line, a first thin film transistor and second thin film transistors are arranged close to the first data line; first connecting trace is set between the first drain electrode and the first pixel electrode, a second connecting trace is set between the second drain electrode and the second pixel electrode to make a capacitance of the first pixel unit matching with a capacitance of the second pixel unit.

Abstract: A fixing structure, configured to fix screw. Screw includes wide portion and narrow portion. Fixing structure includes plate part, holding component and elastic positioning component. Plate part includes top surface, bottom surface and mount groove. Mount groove penetrates through top surface and bottom surface and narrow portion is disposed through mount groove to allow wide portion to rest on top surface. Holding component and top surface together form space. Elastic positioning component is disposed on plate part. When wide portion is located in space and between holding component and top surface, and elastic positioning component is in holding state and located at side of wide portion, wide portion is prevented from being moved away from space. When elastic positioning component is switched to released state, elastic positioning component is removed from side of wide portion so that wide portion is allowed to move away from space.

Abstract: The present disclosure discloses a pixel structure, an array substrate and a display panel. The pixel structure includes a first data line; a first gate line and a second gate line; a first pixel unit and a second pixel unit. The first pixel units and second pixel units arranged along a second direction; a first pixel electrode relative to the second pixel electrode is close to the first data line, a first thin film transistor and second thin film transistors are arranged close to the first data line; first connecting trace is set between the first drain electrode and the first pixel electrode, a second connecting trace is set between the second drain electrode and the second pixel electrode to make a capacitance of the first pixel unit matching with a capacitance of the second pixel unit.

Abstract: An electronic assembly and a heat dissipation assembly thereof. The electronic assembly includes a circuit board and a heat dissipation assembly. The circuit board includes a plate body and a heat source disposed on the plate body. The heat dissipation assembly includes a fin assembly, a mounting plate body, and a heat dissipation pillar. The mounting plate body is fixed to the fin assembly and includes a mounting hole. The heat dissipation pillar is engaged in the mounting hole of the mounting plate body. One end of the heat dissipation pillar is in thermal contact with the fin assembly, and another end of the heat dissipation pillar is in thermal contact with the heat source of the circuit board.

Abstract: A supporting member includes a body portion, at least one first fixing portion, and at least one second fixing portion. The first fixing portion is connected to a side of the body portion and bends relative to the body portion. The first fixing portion is configured to be fixed to a first circuit board. The second fixing portion is connected to another side of the body portion and bends relative to the body portion. The second fixing portion is configured to be fixed to a second circuit board.

Abstract: A fixing structure, configured to fix screw. Screw includes wide portion and narrow portion. Fixing structure includes plate part, holding component and elastic positioning component. Plate part includes top surface, bottom surface and mount groove. Mount groove penetrates through top surface and bottom surface and narrow portion is disposed through mount groove to allow wide portion to rest on top surface. Holding component and top surface together form space. Elastic positioning component is disposed on plate part. When wide portion is located in space and between holding component and top surface, and elastic positioning component is in holding state and located at side of wide portion, wide portion is prevented from being moved away from space. When elastic positioning component is switched to released state, elastic positioning component is removed from side of wide portion so that wide portion is allowed to move away from space.

Abstract: A plate for at least partially covering a first circuit board includes a body portion, at least one first fixing post, at least one second fixing post, and at least one crossing region. The body portion is configured to cover the first circuit board. The first fixing post is connected to a side of the body portion and protrudes from the body portion. The first fixing post is configured to be fixed to the first circuit board. The second fixing post is connected to another side of the body portion and protrudes from the body portion. The second fixing post is configured to be fixed to a second circuit board. The crossing region is disposed on the body portion. The crossing region is configured to allow at least one electronic component on the first circuit board to pass through.