Abstract: The present disclosure relates to a surface-mounted heat sink and a power module using the same. The power module includes a circuit board, a magnetic element and at least one power device. The magnetic element is disposed at an upper side of the circuit board, the at least one power device is disposed on a surface of the circuit board and located between the magnetic element and a lower side of the circuit board. The surface-mounted heat sink is disposed on the surface of the circuit board and adjacent to the at least one power device. A top surface disposed on one side of the magnetic element and the surface of the circuit board form a limiting height, the surface-mounted heat sink has a first height formed between a sucked surface and a surface-mounted surface thereof, and the limiting height is greater than or equal to the first height.

Abstract: A high-density power supply includes a shell, a fan, a PFC module, a DC-DC module and a main board. The shell has a first air passage and a second air passage arranged side by side. The fan is arranged on an inner side or an outer side of the shell. The PFC module includes a PFC inductor arranged in the first air passage, and the PFC inductor faces directly to the fan. The DC-DC module is arranged in the first air passage. The DC-DC module includes at least one DC-DC conversion circuit, each of the DC-DC conversion circuits includes a first PCB and a transformer magnetic core, a transformer winding and power components arranged on the first PCB. The main board is arranged within the shell. The PFC inductor and the at least one DC-DC conversion circuit are electrically connected with the main board, respectively.

Abstract: The present disclosure relates to a surface-mounted heat sink and a power module using the same. The power module includes a circuit board, a magnetic element and at least one power device. The magnetic element is disposed at an upper side of the circuit board, the at least one power device is disposed on a surface of the circuit board and located between the magnetic element and a lower side of the circuit board. The surface-mounted heat sink is disposed on the surface of the circuit board and adjacent to the at least one power device. A top surface disposed on one side of the magnetic element and the surface of the circuit board form a limiting height, the surface-mounted heat sink has a first height formed between a sucked surface and a surface-mounted surface thereof, and the limiting height is greater than or equal to the first height.