Patents by Inventor Ming-Jun Wang

Ming-Jun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240155292
    Abstract: An electronic device includes two speakers, a single functional chip, a parameter extraction circuit, an audio processing module, a gain adjusting circuit and a current detecting unit. The current detecting unit is disposed in the functional chip for detecting the driving current of the two speakers. The functional chip provides the driving voltage of the two speakers based on an output signal and converts the analogue current/voltages of the two speakers into digital current/voltages. The parameter extraction circuit acquires the parameter of each speaker based on the digital current/voltages. The audio processing module acquires the gains of various physical quantities based on the parameter of each speaker and determines the final gain of each physical quantity. The gain adjusting circuit provides the output signal by adjusting the gain of an input signal based on the final gain of each physical quantity.
    Type: Application
    Filed: December 12, 2022
    Publication date: May 9, 2024
    Applicant: RICHTEK TECHNOLOGY CORP.
    Inventors: Tsung-Han Yang, Yen-Chih Wang, Ming-Jun Hsiao, Tsung-Nan Wu
  • Patent number: 7732344
    Abstract: A method for fabricating a integrated circuit with improved performance is disclosed. The method comprises providing a substrate; forming a hard mask layer over the substrate; forming protected portions and unprotected portions of the hard mask layer; performing a first etching process, a second etching process, and a third etching process on the unprotected portions of the hard mask layer, wherein the first etching process partially removes the unprotected portions of the hard mask layer, the second etching process treats the unprotected portions of the hard mask layer, and the third etching process removes the remaining unprotected portions of the hard mask layer; and performing a fourth etching process to remove the protected portions of the hard mask layer.
    Type: Grant
    Filed: June 5, 2009
    Date of Patent: June 8, 2010
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Fang Wen Tsai, Matt Yeh, Ming-Jun Wang, Shun Wu Lin, Chi-Chun Chen, Zin-Chang Wei, Chyi-Shyuan Chern
  • Patent number: D1017061
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: March 5, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chih-Hsien Wang, Shih-Chieh Chang, Yan-Jun Wang, Peng-Hui Wang, Ming-Chieh Cheng