Abstract: Disclosed in the present application is a high-spatial-accuracy electromagnetic fault injection method for a cryptographic chip. According to the method, a spatial position of an electromagnetic probe is adjusted according to a physical structure of a target chip and the characteristic of an integrated circuit, including accurate positioning of three dimensions of X, Y and Z as well as an angle with a surface of the chip, so that electromagnetic fault injection acts on a key area of the chip more accurately, thereby improving the pertinence and efficiency of fault injection.

Abstract: Disclosed in the present application are a high-temporal-accuracy power glitch fault injection method and apparatus for a cryptographic chip. According to the method, power glitch fault injection time is adjusted by considering rise time of a power glitch fault, so that the power glitch fault injection time is controlled more accurately, the limitation of the power glitch fault injection in temporal accuracy is reduced, and the success rate of the power glitch fault injection is increased.

Abstract: Disclosed in the present application are a high-temporal-accuracy electromagnetic fault injection method and apparatus for a cryptographic chip. The method includes: adjusting fault injection time jointly according to peak time and rise time of an electromagnetic pulse signal, thereby enhancing the accuracy of controlling injection time, improving the analysis efficiency and effect of differential fault analysis, and increasing the success rate of the effective fault injection.