Patents by Inventor Ming-Kuan Chen

Ming-Kuan Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing a semiconductor structure
    Patent number: 8703611
    Abstract: A method for manufacturing a semiconductor structure is disclosed. The method comprises following steps. A substrate is provided. A sacrificial layer is formed on the substrate. The sacrificial layer is patterned to develop a first opening and a second opening. The first opening corresponds to an exposed portion of the substrate and the second opening corresponds to an unexposed portion of the substrate. A heat procedure is performed. A target material is formed on the exposed portion of the substrate and a rest part of the sacrificial layer. The rest part of the sacrificial layer and parts of the target material on the rest part of the sacrificial layer are removed. A predetermined patterned target material is obtained.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: April 22, 2014
    Assignee: United Microelectronics Corp.
    Inventor: Ming-Kuan Chen