Patents by Inventor Mingle Tong

Mingle Tong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12125683
    Abstract: Exemplary semiconductor processing systems may include a chamber body having sidewalls and a base. The semiconductor processing systems may include a substrate support extending through the base of the chamber body. The substrate support may include a support plate. The substrates support may include a shaft coupled with the support plate. The semiconductor processing systems may include a liner positioned within the chamber body and positioned radially outward of a peripheral edge of the support plate. An inner surface of the liner may include an emissivity texture.
    Type: Grant
    Filed: May 19, 2021
    Date of Patent: October 22, 2024
    Assignee: Applied Materials, Inc.
    Inventor: Mingle Tong
  • Patent number: 12068144
    Abstract: Exemplary semiconductor processing systems may include a pumping system, a chamber body that defines a processing region, and a pumping liner disposed within the processing region. The pumping liner may define an annular member characterized by a wall that defines an exhaust aperture coupled to the pumping system. The annular member may be characterized by an inner wall that defines a plurality of apertures distributed circumferentially along the inner wall. A plenum may be defined in the annular member between interior surfaces of the walls. A divider may be disposed within the plenum, where the divider separates the plenum into a first plenum chamber and a second plenum chamber, wherein the first plenum chamber is fluidly accessible from the apertures defined through the inner wall, and wherein the divider defines at least one aperture providing fluid access between the first plenum chamber and the second plenum chamber.
    Type: Grant
    Filed: July 19, 2020
    Date of Patent: August 20, 2024
    Assignee: Applied Materials, Inc.
    Inventor: Mingle Tong
  • Patent number: 11804363
    Abstract: Exemplary semiconductor processing chambers may include an inlet manifold defining a central aperture. The inlet manifold may also define a first channel and a second channel, and each of the channels may extend through the inlet manifold radially outward of the central aperture. The chambers may also include a gasbox characterized by a first surface facing the inlet manifold and a second surface opposite the first. The gasbox may define a central aperture aligned with the central aperture of the inlet manifold. The gasbox may define a first annular channel in the first surface extending about the central aperture of the gasbox and fluidly coupled with the first channel of the inlet manifold. The gasbox may define a second annular channel extending radially outward of the first and fluidly coupled with the second channel of the inlet manifold. The second annular channel may be fluidly isolated from the first.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: October 31, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Fang Ruan, Diwakar Kedlaya, Truong Van Nguyen, Mingle Tong, Sherry L. Mings, Venkata Sharat Chandra Parimi
  • Publication number: 20220375727
    Abstract: Exemplary semiconductor processing systems may include a chamber body having sidewalls and a base. The semiconductor processing systems may include a substrate support extending through the base of the chamber body. The substrate support may include a support plate. The substrates support may include a shaft coupled with the support plate. The semiconductor processing systems may include a liner positioned within the chamber body and positioned radially outward of a peripheral edge of the support plate. An inner surface of the liner may include an emissivity texture.
    Type: Application
    Filed: May 19, 2021
    Publication date: November 24, 2022
    Applicant: Applied Materials, Inc.
    Inventor: Mingle Tong
  • Patent number: 11367594
    Abstract: Exemplary semiconductor processing chambers may include a gasbox characterized by a first surface and a second surface opposite the first surface. The gasbox may define a central aperture. The gasbox may define an annular channel extending about the central aperture. The annular channel may be fluidly accessible from the first surface of the gasbox. The gasbox may further define a plurality of outlet apertures extending from the annular channel through the second surface of the gasbox.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: June 21, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Mingle Tong, Li-Qun Xia, Daemian Raj Benjamin Raj
  • Publication number: 20220122819
    Abstract: Exemplary semiconductor processing systems may include a remote plasma source and a processing chamber. The processing chamber may include a gasbox defining an access into the processing chamber. The systems may include an adapter positioned between the remote plasma source and the processing chamber. The adapter may include a mounting block defining a central aperture. The remote plasma source may be seated on a first surface of the mounting block. The adapter may include a mounting plate characterized by a first surface on which the mounting block is seated. The mounting plate may define a central aperture axially aligned with the central aperture defined through the mounting block. The mounting plate may define a recess in the first surface of the mounting plate extending about the central aperture through the mounting plate. The recess may form a volume between the mounting block and the mounting plate.
    Type: Application
    Filed: October 15, 2020
    Publication date: April 21, 2022
    Applicant: Applied Materials, Inc.
    Inventor: Mingle Tong
  • Publication number: 20220093373
    Abstract: Exemplary semiconductor processing systems may include a chamber body having sidewalls and a base. The systems may include a substrate support extending through the base of the chamber body. The substrate support may include a support plate. The substrate support may include a shaft coupled with the support plate. The chambers may include a bottom plate coupled with the shaft of the substrate support and extending below a bottom surface of the support plate. The bottom plate may include a first emissivity zone and a second emissivity zone. The first emissivity zone and the second emissivity zone may have different emissivity levels.
    Type: Application
    Filed: September 21, 2020
    Publication date: March 24, 2022
    Applicant: Applied Materials, Inc.
    Inventor: Mingle Tong
  • Publication number: 20220018024
    Abstract: Exemplary semiconductor processing systems may include a pumping system, a chamber body that defines a processing region, and a pumping liner disposed within the processing region. The pumping liner may define an annular member characterized by a wall that defines an exhaust aperture coupled to the pumping system. The annular member may be characterized by an inner wall that defines a plurality of apertures distributed circumferentially along the inner wall. A plenum may be defined in the annular member between interior surfaces of the walls. A divider may be disposed within the plenum, where the divider separates the plenum into a first plenum chamber and a second plenum chamber, wherein the first plenum chamber is fluidly accessible from the apertures defined through the inner wall, and wherein the divider defines at least one aperture providing fluid access between the first plenum chamber and the second plenum chamber.
    Type: Application
    Filed: July 19, 2020
    Publication date: January 20, 2022
    Applicant: Applied Materials, Inc.
    Inventor: Mingle Tong
  • Publication number: 20210159053
    Abstract: Exemplary semiconductor processing chambers may include a gasbox characterized by a first surface and a second surface opposite the first surface. The gasbox may define a central aperture. The gasbox may define an annular channel extending about the central aperture. The annular channel may be fluidly accessible from the first surface of the gasbox. The gasbox may further define a plurality of outlet apertures extending from the annular channel through the second surface of the gasbox.
    Type: Application
    Filed: November 27, 2019
    Publication date: May 27, 2021
    Applicant: Applied Materials, Inc.
    Inventors: Mingle Tong, Li-Qun Xia, Daemian Raj Benjamin Raj
  • Publication number: 20210142984
    Abstract: Exemplary semiconductor processing chambers may include an inlet manifold defining a central aperture. The inlet manifold may also define a first channel and a second channel, and each of the channels may extend through the inlet manifold radially outward of the central aperture. The chambers may also include a gasbox characterized by a first surface facing the inlet manifold and a second surface opposite the first. The gasbox may define a central aperture aligned with the central aperture of the inlet manifold. The gasbox may define a first annular channel in the first surface extending about the central aperture of the gasbox and fluidly coupled with the first channel of the inlet manifold. The gasbox may define a second annular channel extending radially outward of the first and fluidly coupled with the second channel of the inlet manifold. The second annular channel may be fluidly isolated from the first.
    Type: Application
    Filed: November 4, 2020
    Publication date: May 13, 2021
    Applicant: Applied Materials, Inc.
    Inventors: Fang Ruan, Diwakar Kedlaya, Truong Van Nguyen, Mingle Tong, Sherry L. Mings, Venkata Sharat Chandra Parimi