Abstract: The present disclosure provides a method for preparing a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors, the composition prepared by the method, and use of the composition for treating arthritis. The composition of the present disclosure achieves the effect of treating arthritis through various efficacy experiments.

Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.

Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.

Abstract: A semiconductor device includes a substrate. The semiconductor device includes a fin that is formed over the substrate and extends along a first direction. The semiconductor device includes a gate structure that straddles the fin and extends along a second direction perpendicular to the first direction. The semiconductor device includes a first source/drain structure coupled to a first end of the fin along the first direction. The gate structure includes a first portion protruding toward the first source/drain structure along the first direction. A tip edge of the first protruded portion is vertically above a bottom surface of the gate structure.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: A wheel structure and a method for making the same are disclosed. The wheel structure comprises at least two components connected together. The connection between the two components is fixed by friction stir welding so as to form a wheel. One of the two components is a hub and the other component is a rim. The rim is made of an aluminum sheet by a spin-forming process to enhance its mechanical strength, and the hub is made by a casting process so as to form hubs with different designs. Moreover, the colors of the rim and the hub are different. Therefore, the wheel structure of the present invention has well mechanical strength and robustness and a gorgeous design so as to promote the competitiveness of the wheel structure of the present invention.

Abstract: A suspension includes a flexure and a plurality of electrical traces formed on the flexure. Each electrical trace has a trace body and a bonding pad arranged for connecting with a slider, and the bonding pad is a free end before connecting with the slider and is capable of bending to the trace body flexibly, and the bonding pad includes a trace body layer and a solder layer formed on the trace body layer, thereby the bonding pads of the electrical traces connecting with the slider by reflowing the solder layer. The present invention uses no extra solder balls, so as to reduce the manufacturing cost and the corresponding apparatus cost. The invention also discloses a manufacturing method of a suspension, and a connecting method for a suspension and a slider.

Abstract: A suspension includes a flexure and a plurality of electrical traces formed on the flexure. Each electrical trace has a trace body and a bonding pad arranged for connecting with a slider, and the bonding pad is a free end before connecting with the slider and is capable of bending to the trace body flexibly, and the bonding pad includes a trace body layer and a solder layer formed on the trace body layer, thereby the bonding pads of the electrical traces connecting with the slider by reflowing the solder layer. The present invention uses no extra solder balls, so as to reduce the manufacturing cost and the corresponding apparatus cost. The invention also discloses a manufacturing method of a suspension, and a connecting method for a suspension and a slider.

Abstract: This invention relates to the technical field of electronic components, and in particular to an improved illuminating device of light emitting diode (LED) wafer holder. The improved illuminating device of LED wafer holder comprises a reflecting shade and a diode crystal holder, wherein the diode crystal holder comprises a plurality of electrode portions and isolation portions disposed between the electrode portions; a plurality of crystals are disposed on the upper end of the electrode portion; a connecting piece with functions of radiation and conduction is fixedly set between one crystal and another; the diode crystal holder is connected with three non-polar brackets; the reflecting shade is internally provided with a plastic sheet which is opened with air holes; the inner wall of the plastic sheet is provided with fluorescent powder.

Abstract: An LED lighting device comprises a seat with a conductor. A light emitting diode is disposed on the conductor of the seat, and has an upper positive conductive pad, a lower negative conductive pad, and an insulating pad disposed between the positive and negative conductive pads. The lower negative conductive pad of the light emitting diode connects with the conductor. An exterior enclosure is disposed on top of the seat in such a way that a bottom end of the exterior enclosure is in contact with the upper positive conductive pad. A through hole is defined through the bottom end of the exterior enclosure for receiving the light emitting diode. The bottom of the seat is connected with a metal plate that is in contact with the conductor.

Abstract: An LED lighting device comprises a seat with a conductor. A light emitting diode is disposed on the conductor of the seat, and has an upper positive conductive pad, a lower negative conductive pad, and an insulating pad disposed between the positive and negative conductive pads. The lower negative conductive pad of the light emitting diode connects with the conductor. An exterior enclosure is disposed on top of the seat in such a way that a bottom end of the exterior enclosure is in contact with the upper positive conductive pad. A through hole is defined through the bottom end of the exterior enclosure for receiving the light emitting diode. The bottom of the seat is connected with a metal plate that is in contact with the conductor.

Abstract: A wheel rim structure comprised of a first wheel member having a disk with a plurality of primary mounting holes and a rim portion; a second wheel member having a disk with a plurality of primary mounting holes and a rim portion; and a side plate having a disk with a plurality of primary mounting holes. The first wheel member disk is placed against the second wheel member disk and the side plate disk is placed against the first wheel member disk. The side plate, the first wheel member, and the second wheel member are then conjoined into a one-piece entity and, furthermore, mounted on a vehicle hub with threaded fastening components through the primary mounting holes.

Abstract: A bicycle foot peg of a hollow construction is fastened at one end thereof with a bicycle frame and provided in the inner wall of the open end thereof with an inner threaded portion. A fitting seat is disposed in the hollow interior of the bicycle foot peg and provided with a plurality of slots for holding hand tools such as a screwdriver and wrench. An outer cap is used to seal off the open end of the foot peg such that the outer cap is engaged securely with the outer end of the fitting seat, which in turn is engaged with the inner threaded portion of the foot peg.