Patents by Inventor Mingliang XIANG

Mingliang XIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for preparing electrode of inductive component
    Patent number: 11655554
    Abstract: A method for preparing an electrode of an inductive component, includes: S1: performing surface insulation treatment, specifically including: placing an inductive component in a tilting and rotating spraying pot, and performing thermal spraying on resin by using a fixed spray gun for surface insulation treatment; S2: exposing an inner electrode, specifically including: processing an electrode area through laser or mechanical polishing to expose the inner electrode; S3: performing surface pretreatment, specifically including: performing degreasing and surface pretreatment with ultrasound in a special solution; S4: performing surface activation treatment, specifically including: performing surface activation treatment with ultrasound in a low-concentration acid solution; S5: electroplating to form a metal layer, specifically including: electroplating to form an electroplated copper layer first, then electroplating to form an electroplated nickel layer, and finally electroplating to form an electroplated tin lay
    Type: Grant
    Filed: December 13, 2020
    Date of Patent: May 23, 2023
    Assignee: Dongguan Hualuo Electronics Co., Ltd.
    Inventors: Hao Qin, Mingliang Xiang
  • METHOD FOR PREPARING ELECTRODE OF INDUCTIVE COMPONENT
    Publication number: 20210108322
    Abstract: A method for preparing an electrode of an inductive component, includes: S1: performing surface insulation treatment, specifically including: placing an inductive component in a tilting and rotating spraying pot, and performing thermal spraying on resin by using a fixed spray gun for surface insulation treatment; S2: exposing an inner electrode, specifically including: processing an electrode area through laser or mechanical polishing to expose the inner electrode; S3: performing surface pretreatment, specifically including: performing degreasing and surface pretreatment with ultrasound in a special solution; S4: performing surface activation treatment, specifically including: performing surface activation treatment with ultrasound in a low-concentration acid solution; S5: electroplating to form a metal layer, specifically including: electroplating to form an electroplated copper layer first, then electroplating to form an electroplated nickel layer, and finally electroplating to form an electroplated tin lay
    Type: Application
    Filed: December 13, 2020
    Publication date: April 15, 2021
    Inventors: Hao QIN, Mingliang XIANG