Patents by Inventor Minglong Du

Minglong Du has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11236926
    Abstract: An air conditioning heat pump system using an ejector may include a compression assembly, an outdoor heat exchanger, an indoor heat exchanger, an ejector, and a first to third electromagnetic valve and a controller. A first end of the compression assembly may be connected with the one end of the outdoor heat exchanger, a second end may be connected with one end of the indoor heat exchanger, a third end may connected with outlet end of the ejector, and a fourth end may be connected with another end of the outdoor heat exchanger. One end of the outdoor heat exchanger may also be connected with a jet inlet of the ejector through the first electromagnetic valve, and another end may also be connected with the jet inlet of the ejector through the second electromagnetic valve and the third electromagnetic valve.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: February 1, 2022
    Assignee: Qingdao Hisense Hitachi Air-Conditioning Systems Co., Ltd.
    Inventors: Min Liu, Wenqiang Zhang, Hu Li, Minglong Du
  • Patent number: 11226917
    Abstract: Disclosed is a home bus system (HBS) circuit, applicable to home bus (HB) communication implemented using a Microchip chip. The circuit includes the Microchip chip, an HBS communication chip, a resistor, a capacitor, and a transistor, the Microchip chip includes a universal asynchronous receiver/transmitter (UART) input pin and a serial peripheral interface (SPI) output pin, and the HBS communication chip includes an input pin. The transistor has a base coupled to the SPI output pin and a first end of the capacitor, a collector coupled to a first end of the resistor and the input pin of the HBS communication chip, and an emitter grounded, wherein a second end of the resistor is coupled to a power supply, and a second end of the capacitor is grounded.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: January 18, 2022
    Assignee: QINGDAO HISENSE HITACHI AIR-CONDITIONING SYSTEMS CO., LTD.
    Inventors: Jingfeng Shi, Minglong Du, Lei Hou, Leilei Ge
  • Publication number: 20210191891
    Abstract: Disclosed is a home bus system (HBS) circuit, applicable to home bus (HB) communication implemented using a Microchip chip. The circuit includes the Microchip chip, an HBS communication chip, a resistor, a capacitor, and a triode, the Microchip chip includes a universal asynchronous receiver/transmitter (UART) input pin and a serial peripheral interface (SPI) output pin, and the HBS communication chip includes an input pin. The triode has a base coupled to the SPI output pin and a first end of the capacitor, a collector coupled to a first end of the resistor and the input pin of the HBS communication chip, and an emitter grounded, wherein a second end of the resistor is coupled to a power supply, and a second end of the capacitor is grounded.
    Type: Application
    Filed: October 11, 2018
    Publication date: June 24, 2021
    Applicant: QINGDAO HISENSE HITACHI AIR-CONDITIONING SYSTEMS CO., LTD.
    Inventors: Jingfeng SHI, Minglong DU, Lei HOU, Leilei GE
  • Publication number: 20190242610
    Abstract: An air conditioning heat pump system using an ejector may include a compression assembly, an outdoor heat exchanger, an indoor heat exchanger, an ejector, and a first to third electromagnetic valve and a controller. A first end of the compression assembly may be connected with the one end of the outdoor heat exchanger, a second end may be connected with one end of the indoor heat exchanger, a third end may connected with outlet end of the ejector, and a fourth end may be connected with another end of the outdoor heat exchanger. One end of the outdoor heat exchanger may also be connected with a jet inlet of the ejector through the first electromagnetic valve, and another end may also be connected with the jet inlet of the ejector through the second electromagnetic valve and the third electromagnetic valve.
    Type: Application
    Filed: March 12, 2019
    Publication date: August 8, 2019
    Applicant: Qingdao Hisense Hitachi Air-Conditioning Systems Co., Ltd.
    Inventors: Min Liu, Wenqiang Zhang, Hu Li, Minglong Du