Patents by Inventor Mingo Lin

Mingo Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Forming sensing elements above a semiconductor substrate
    Patent number: 8796804
    Abstract: An integrated circuit structure includes a substrate and a metallization layer over the substrate. The metallization layer includes a dielectric layer and metal lines in the dielectric layer. The integrated circuit structure further includes a sensing element over the metallization layer. The sensing element may be formed in passivation layers.
    Type: Grant
    Filed: April 22, 2008
    Date of Patent: August 5, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ke Chun Liu, Kuan-Chieh Huang, Chin-Min Lin, Ken Wen-Chien Fu, Mingo Lin
  • Forming Sensing Elements above a Semiconductor Substrate
    Publication number: 20090263674
    Abstract: An integrated circuit structure includes a substrate and a metallization layer over the substrate. The metallization layer includes a dielectric layer and metal lines in the dielectric layer. The integrated circuit structure further includes a sensing element over the metallization layer. The sensing element may be formed in passivation layers.
    Type: Application
    Filed: April 22, 2008
    Publication date: October 22, 2009
    Inventors: Ke Chun Liu, Kuan-Chieh Huang, Chin-Min Lin, Ken Wen-Chien Fu, Mingo Lin