Patents by Inventor Mingqi Chen

Mingqi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing fingerprint recognition module, fingerprint recognition module, and display device
    Patent number: 11436856
    Abstract: Embodiments of the present disclosure provide a method for manufacturing a fingerprint recognition method, a fingerprint recognition module, and a display device. The method for manufacturing the fingerprint recognition module includes: providing a backplane; forming a bonding terminal in a bonding area of the backplane; forming a sensing electrode in a fingerprint recognition area of the backplane; forming an insulation layer cladding the bonding terminal in the bonding area, and forming a piezoelectric material layer in the fingerprint recognition area, where an orthographic projection of the piezoelectric material layer on the backplane coincides with an orthographic projection of the sensing electrode on the backplane; performing polarization processing on the piezoelectric material layer; and peeling off the insulation layer.
    Type: Grant
    Filed: March 21, 2020
    Date of Patent: September 6, 2022
    Assignee: Beijing BOE Technology Development Co., Ltd.
    Inventors: Wenqu Liu, Qi Yao, Feng Zhang, Zhijun Lv, Liwen Dong, Xiaoxin Song, Zhao Cui, Detian Meng, Libo Wang, Mingqi Chen, Changzheng Wang
  • METHOD FOR MANUFACTURING FINGERPRINT RECOGNITION MODULE, FINGERPRINT RECOGNITION MODULE, AND DISPLAY DEVICE
    Publication number: 20210089739
    Abstract: Embodiments of the present disclosure provide a method for manufacturing a fingerprint recognition method, a fingerprint recognition module, and a display device. The method for manufacturing the fingerprint recognition module includes: providing a backplane; forming a bonding terminal in a bonding area of the backplane; forming a sensing electrode in a fingerprint recognition area of the backplane; forming an insulation layer cladding the bonding terminal in the bonding area, and forming a piezoelectric material layer in the fingerprint recognition area, where an orthographic projection of the piezoelectric material layer on the backplane coincides with an orthographic projection of the sensing electrode on the backplane; performing polarization processing on the piezoelectric material layer; and peeling off the insulation layer.
    Type: Application
    Filed: March 21, 2020
    Publication date: March 25, 2021
    Inventors: Wenqu LIU, Qi Yao, Feng Zhang, Zhijun Lv, Liwen Dong, Xiaoxin Song, Zhao Cui, Detian Meng, Libo Wang, Mingqi Chen, Changzheng Wang