Patents by Inventor Ming-Tsung Ko

Ming-Tsung Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11929329
    Abstract: A semiconductor device including a substrate, a low-k dielectric layer, a cap layer, and a conductive layer is provided. The low-k dielectric layer is disposed over the substrate. The cap layer is disposed on the low-k dielectric layer, wherein a carbon atom content of the cap layer is greater than a carbon atom content of the low-k dielectric layer. The conductive layer is disposed in the cap layer and the low-k dielectric layer.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Cheng Chou, Chung-Chi Ko, Tze-Liang Lee, Ming-Tsung Lee
  • Patent number: 10147608
    Abstract: A method for preparing a patterned target layer is provided. A target layer is formed over a substrate. A multi-layered hard mask layer is formed over the target layer. The multi-layered hard mask layer includes a first hard mask layer over the target layer, a second hard mask layer between the target layer and the first hard mask layer, and a third hard mask layer between the target layer and the second hard mask layer, wherein a material of the second hard mask layer is different from a material of the first hard mask layer and a material of the third hard mask layer. The multi-layered hard mask layer is used as a hard mask layer to prepare a fine pattern on the target layer.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: December 4, 2018
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Shing-Yih Shih, Chih-Wei Cheng, Ming-Tsung Ko
  • Patent number: 8757568
    Abstract: A wall mount assembly includes a first engagement member and a second engagement member. The first engagement member includes a slide structure and two positioning indentations oppositely disposed relative to the slide structure. The second engagement member includes a slider and two positioning bosses oppositely disposed relative to the slider. The first engagement member and the second engagement member are capable of being correspondingly disposed on an object and a wall. When the slider enters the slide structure from an entrance of the slide structure and is confined to slide relative to the slide structure so as to be blocked at a stop position of the slide structure, the two positioning bosses are embedded in the two positioning indentations respectively so that the object can be fixed on the wall stably. Therefore, the wall mount assembly simplifies the wall-mount operation of the object and provides a stable wall-mount effect.
    Type: Grant
    Filed: May 8, 2012
    Date of Patent: June 24, 2014
    Assignee: AmTRAN Technology Co., Ltd
    Inventor: Ming-Tsung Ko
  • Publication number: 20130256487
    Abstract: A wall mount assembly includes a first engagement member and a second engagement member. The first engagement member includes a slide structure and two positioning indentations oppositely disposed relative to the slide structure. The second engagement member includes a slider and two positioning bosses oppositely disposed relative to the slider. The first engagement member and the second engagement member are capable of being correspondingly disposed on an object and a wall. When the slider enters the slide structure from an entrance of the slide structure and is confined to slide relative to the slide structure so as to be blocked at a stop position of the slide structure, the two positioning bosses are embedded in the two positioning indentations respectively so that the object can be fixed on the wall stably. Therefore, the wall mount assembly simplifies the wall-mount operation of the object and provides a stable wall-mount effect.
    Type: Application
    Filed: May 8, 2012
    Publication date: October 3, 2013
    Inventor: Ming-Tsung Ko
  • Patent number: 7448810
    Abstract: A dustproof transceiver includes a transceiver body, a first dustproof cover and a second dustproof cover. The transceiver body has an opening to receive an optical fiber connector. The first dustproof cover is pivotally connected on the transceiver body to swivel and shelter a part of the opening. The second dustproof cover slides on the transceiver body to shelter the remaining part of the opening. A spring is secured to the transceiver body at one end and secured to the second dustproof cover at an opposite end. A rebounding member has two spiral springs, two securing ends and a securing section linking the two spiral springs. The two securing ends are respectively coupled to the transceiver body and the securing section is coupled to the first dustproof cover such that the rebounding member exerts a force on the first dustproof cover to shelter the part of the opening.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: November 11, 2008
    Assignee: Axcen Photonics Corp.
    Inventor: Ming-Tsung Ko
  • Publication number: 20080031631
    Abstract: A dustproof transceiver includes a transceiver body, a first dustproof cover and a second dustproof cover. The transceiver body has an opening to receive an optical fiber connector. The first dustproof cover is pivotally connected on the transceiver body to swivel and shelter a part of the opening. The second dustproof cover slides on the transceiver body to shelter the remaining part of the opening. A spring is secured to the transceiver body at one end and secured to the second dustproof cover at an opposite end. A rebounding member has two spiral springs, two securing ends and a securing section linking the two spiral springs. The two securing ends are respectively coupled to the transceiver body and the securing section is coupled to the first dustproof cover such that the rebounding member exerts a force on the first dustproof cover to shelter the part of the opening.
    Type: Application
    Filed: July 27, 2006
    Publication date: February 7, 2008
    Applicant: AXCEN PHOTONICS CORP.
    Inventor: Ming-Tsung Ko