Patents by Inventor Ming-Wei Chen

Ming-Wei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12608684
    Abstract: An operation method and an operation device for operating a real-time discussion window are provided. The operation method for operating the real-time discussion window includes the following steps. A discussion topic is obtained from an initiator. A participant candidate list is provided. The participant candidate list includes a plurality of non-player characters. A participant suggestion list is provided from the candidate list according to the discussion topic. At least one of the non-player characters is added into the real-time discussion window according to a selection result of the initiator. At least one relevant technical person is invited into the real-time discussion window. The discussion topic is discussed in the real-time discussion window. A discussion report is automatically generated according to the discussion content in the real-time discussion window.
    Type: Grant
    Filed: January 5, 2024
    Date of Patent: April 21, 2026
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hsin-Yu Chen, Ching-Pei Lin, Ming-Wei Chen, Chuan-Guei Wang, Yi-Lin Hung, Chung-Pen Hsu
  • Patent number: 12592500
    Abstract: An electric connecting cable includes an insulative seat, multiple terminals and multiple wires corresponding to the terminals. The terminals are buried in the insulative seat. Each terminal has a soldering leg. Each soldering leg penetrates out of the insulative seat. The soldering legs are arranged in a row. Each soldering leg is disposed with a concave soldering groove. Each soldering groove has a notch and a slope outward extended from an edge of the notch. Each wire has a soldering end. Each soldering end is accommodated in corresponding one of the soldering grooves. Each soldering end is separately soldered to corresponding one of the soldering legs. Each wire is extended along a longitudinal direction of corresponding one of the soldering legs soldered thereto.
    Type: Grant
    Filed: May 15, 2023
    Date of Patent: March 31, 2026
    Assignee: JESS-LINK PRODUCTS CO., LTD.
    Inventors: Yun-Chang Yang, Ming-Wei Chen, Ming-Jun Xu, Wen-Fu Liao
  • Patent number: 12545941
    Abstract: A method for producing a modified cell deficient in mannosyl (alpha-1,3-)-glycoprotein beta-1,2-N-acetylglucosaminyltransferase 1 (“MGAT1”) activity. Also provided is a CHO cell line deficient in MGAT1 activity produced by the method. Further disclosed are methods for producing a glycoprotein.
    Type: Grant
    Filed: May 16, 2024
    Date of Patent: February 10, 2026
    Assignee: ROCK BIOMEDICAL, INC.
    Inventors: Chi-Huey Wong, Lan-Bo Chen, Ming-Wei Chen, Jeng-Shin Lee
  • Publication number: 20250298305
    Abstract: A reflective mask includes a substrate, a reflective multilayer disposed on the substrate, a capping layer disposed on the reflective multilayer, and an absorber layer disposed on the capping layer. The absorber layer includes a base material made of one or more of a Cr based material, an Ir based material, a Pt based material, or Co based material, and further contains one or more additional elements selected from the group consisting of Si, B, Ge, Al, As, Sb, Te, Se and Bi.
    Type: Application
    Filed: June 10, 2025
    Publication date: September 25, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Yi TSAI, Wei-Che HSIEH, Ta-Cheng LIEN, Hsin-Chang LEE, Ping-Hsun LIN, Hao-Ping CHENG, Ming-Wei CHEN, Szu-Ping TSAI
  • Publication number: 20250244679
    Abstract: In a method of manufacturing a semiconductor device, in an EUV scanner, an EUV lithography operation using an EUV mask is performed on a photo resist layer formed over a semiconductor substrate. After the EUV lithography operation, the EUV mask is unloaded from a mask stage of the EUV scanner. The EUV mask is placed under a reduced pressure below an atmospheric pressure. The EUV mask is heated under the reduced pressure at a first temperature in a range from 100° C. to 350 C°. After the heating, the EUV mask is stored in a mask stocker.
    Type: Application
    Filed: March 4, 2025
    Publication date: July 31, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Hao CHANG, Ming-Wei CHEN, Ai-Jay MA, Ching-Yueh CHEN
  • Patent number: 12374823
    Abstract: A waterproof electrical connection device includes a waterproof casing, a socket assembly, a wire element, and a waterproof plug. The waterproof casing includes a wiring port. An inner surface of the waterproof casing includes an annular step surface facing the wiring port. The wiring port is covered by an end cover. The socket assembly is placed inside the waterproof casing. The waterproof plug is arranged in the wiring port to seal it. The wire element is connected to a connector of the socket assembly and passes through the waterproof casing via the waterproof plug. The waterproof plug has an inner end and an outer end opposite to the inner end. The inner end is arranged toward the socket assembly and includes a longitudinal ring rib. The end cover is fastened to the waterproof casing to press the outer end, so that the longitudinal ring rib presses the annular step surface.
    Type: Grant
    Filed: May 30, 2023
    Date of Patent: July 29, 2025
    Assignee: JESS-LINK PRODUCTS CO., LTD.
    Inventors: Yun-Chang Yang, Ming-Wei Chen, Ming-Jun Xu, Wen-Fu Liao
  • Patent number: 12366797
    Abstract: A reflective mask includes a substrate, a reflective multilayer disposed on the substrate, a capping layer disposed on the reflective multilayer, and an absorber layer disposed on the capping layer. The absorber layer includes a base material made of one or more of a Cr based material, an Ir based material, a Pt based material, or Co based material, and further contains one or more additional elements selected from the group consisting of Si, B, Ge, Al, As, Sb, Te, Se and Bi.
    Type: Grant
    Filed: June 20, 2024
    Date of Patent: July 22, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hung-Yi Tsai, Wei-Che Hsieh, Ta-Cheng Lien, Hsin-Chang Lee, Ping-Hsun Lin, Hao-Ping Cheng, Ming-Wei Chen, Szu-Ping Tsai
  • Patent number: 12346027
    Abstract: A reflective mask includes a substrate, a reflective multilayer disposed on the substrate, a capping layer disposed on the reflective multilayer, and an absorber layer disposed on the capping layer. The absorber layer includes one or more alternating pairs of a first Cr based layer and a second Cr based layer different from the first Cr based layer.
    Type: Grant
    Filed: June 17, 2024
    Date of Patent: July 1, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Pei-Cheng Hsu, Ching-Huang Chen, Hung-Yi Tsai, Ming-Wei Chen, Hsin-Chang Lee, Ta-Cheng Lien
  • Patent number: 12339632
    Abstract: A training method of a semiconductor process prediction model, a semiconductor process prediction device, and a semiconductor process prediction method are provided. The training method of the semiconductor process prediction model includes the following steps. The semiconductor process was performed on several samples. A plurality of process data of the samples are obtained. A plurality of electrical measurement data of the samples are obtained. Some of the samples having physical defects are filtered out according to the process data. The semiconductor process prediction model is trained according to the process data and the electrical measurement data of the filtered samples.
    Type: Grant
    Filed: March 15, 2022
    Date of Patent: June 24, 2025
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chia-Wei Chen, Ching-Pei Lin, Chung-Yi Chiu, Te-Hsuan Chen, Ming-Wei Chen, Hsiao-Ying Yang
  • Publication number: 20250190950
    Abstract: An operation method and an operation device for operating a real-time discussion window are provided. The operation method for operating the real-time discussion window includes the following steps. A discussion topic is obtained from an initiator. A participant candidate list is provided. The participant candidate list includes a plurality of non-player characters. A participant suggestion list is provided from the candidate list according to the discussion topic. At least one of the non-player characters is added into the real-time discussion window according to a selection result of the initiator. At least one relevant technical person is invited into the real-time discussion window. The discussion topic is discussed in the real-time discussion window. A discussion report is automatically generated according to the discussion content in the real-time discussion window.
    Type: Application
    Filed: January 5, 2024
    Publication date: June 12, 2025
    Inventors: Hsin-Yu CHEN, Ching-Pei LIN, Ming-Wei CHEN, Chuan-Guei WANG, Yi-Lin HUNG, Chung-Pen HSU
  • Patent number: 12287581
    Abstract: In a method of manufacturing a semiconductor device, in an EUV scanner, an EUV lithography operation using an EUV mask is performed on a photo resist layer formed over a semiconductor substrate. After the EUV lithography operation, the EUV mask is unloaded from a mask stage of the EUV scanner. The EUV mask is placed under a reduced pressure below an atmospheric pressure. The EUV mask is heated under the reduced pressure at a first temperature in a range from 100° C. to 350 C°. After the heating, the EUV mask is stored in a mask stocker.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: April 29, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chung-Hao Chang, Ming-Wei Chen, Ai-Jay Ma, Ching-Yueh Chen
  • Publication number: 20250109401
    Abstract: The present disclosure is directed to genome editing systems, reagents and methods for immunooncology.
    Type: Application
    Filed: October 13, 2023
    Publication date: April 3, 2025
    Inventors: Jennifer BROGDON, Ming-Wei CHEN, Hyungwook LIM, Yi YANG, Morag STEWART, Sarah HESSE
  • Patent number: 12261392
    Abstract: A waterproof structure of a socket connector includes a waterproof housing, a socket, a cable, and a waterproof plug. The waterproof housing includes a wiring opening. The inner surface of the waterproof housing incudes a ring step surface facing the wiring opening. The wiring opening is covered by an end cap. The socket is received in the waterproof housing. The cable is connected to the socket and passes the wiring opening. The waterproof plug wrapping the cable is arranged in the wiring opening to close the wiring opening. The waterproof plug has an inner and an outer end, the inner end faces the socket, and a longitudinal annular rib is arranged on the inner end. The end cover is fastened to the waterproof housing along the longitudinal direction of the waterproof plug to press the outer end to make the longitudinal ring rib press the ring step surface.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: March 25, 2025
    Assignees: JESS-LINK PRODUCTS CO., LTD., ULTRASPEED ELECTRONICS CO., LTD.
    Inventors: Ming-Jun Xu, Wen-Fu Liao, Yun-Chang Yang, Ming-Wei Chen
  • Publication number: 20250047003
    Abstract: An antenna structure and an electronic device are provided. The antenna structure is disposed on a carrier of the electronic device and includes a first dipole radiating element perpendicular to a plane, a second dipole radiating element connected to the first dipole radiating element, and a third dipole radiating element connected to the first dipole radiating element and the second dipole radiating element. The first dipole radiating element is configured to generate a first radiation pattern, the second dipole radiating element is configured to generate a second radiation pattern, and the third radiating element is configured to generate a third radiation pattern. The first radiation pattern is omnidirectional radiation on the plane. A polarization direction of the second radiation pattern and a polarization direction of the third radiation pattern are respectively orthogonal to a polarization direction of the first radiation pattern.
    Type: Application
    Filed: July 15, 2024
    Publication date: February 6, 2025
    Inventors: Ming-Wei Chen, HUANG-TSE PENG, Chung-Yen Hsiao, KUO-SHIH LIU
  • Publication number: 20250009881
    Abstract: Disclosed herein are recombinant polypeptides and recombinant nucleic acids encoding the same. According to some embodiments of the present disclosure, the recombinant polypeptide comprises a first bi-functional domain, and a first single-chain fragment variable (scFv) or a peptide linked to the N-terminus of the first bi-functional domain. Optionally, the recombinant polypeptide further comprises a second scFv linked to the N-terminus of the first scFv or peptide. Also disclosed herein are methods of treating cancers by using the immune cells expressing the recombinant polypeptides.
    Type: Application
    Filed: June 24, 2024
    Publication date: January 9, 2025
    Inventor: Ming-Wei CHEN
  • Publication number: 20240417722
    Abstract: The present invention is directed to genome editing systems, reagents and methods for immunooncology.
    Type: Application
    Filed: December 8, 2023
    Publication date: December 19, 2024
    Inventors: Ming-Wei CHEN, Melissa DECK, Glenn DRANOFF, Craig Stephen MICKANIN, Reynald LESCARBEAU, Celeste RICHARDSON, Morag STEWART, Yi YANG
  • Publication number: 20240384320
    Abstract: A method for producing a modified cell deficient in mannosyl (alpha-1,3-)-glycoprotein beta-1,2-N-acetylglucosaminyltransferase 1 (“MGAT1”) activity. Also provided is a CHO cell line deficient in MGAT1 activity produced by the method. Further disclosed are methods for producing a glycoprotein.
    Type: Application
    Filed: May 16, 2024
    Publication date: November 21, 2024
    Inventors: Chi-Huey WONG, Lan-Bo CHEN, Ming-Wei CHEN, Jeng-Shin LEE
  • Patent number: 12142872
    Abstract: A thermoconductive structure includes a waterproof casing, a socket and a thermoconductive plate. The socket is accommodated in the waterproof casing and includes a metal housing having an inserting opening and a side opening defined on a side of the inserting opening. The thermoconductive plate is movably disposed on the metal housing. One surface of the thermoconductive plate protrudes from an inner surface of the metal housing through the side opening. Another surface of the thermoconductive plate is provided with a soft thermoconductive element. The soft thermoconductive element is disposed between an inner surface of the waterproof casing and the thermoconductive plate. When a plug is inserted into the metal housing, the plug pushes the thermoconductive plate to make the soft thermoconductive element be compressed by the thermoconductive plate and the waterproof housing.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: November 12, 2024
    Assignees: JESS-LINK PRODUCTS CO., LTD., ULTRASPEED ELECTRONICS CO., LTD.
    Inventors: Ming-Jun Xu, Wen-Fu Liao, Yun-Chang Yang, Ming-Wei Chen
  • Publication number: 20240337918
    Abstract: A reflective mask includes a substrate, a reflective multilayer disposed on the substrate, a capping layer disposed on the reflective multilayer, and an absorber layer disposed on the capping layer. The absorber layer includes a base material made of one or more of a Cr based material, an Ir based material, a Pt based material, or Co based material, and further contains one or more additional elements selected from the group consisting of Si, B, Ge, Al, As, Sb, Te, Se and Bi.
    Type: Application
    Filed: June 20, 2024
    Publication date: October 10, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Yi TSAI, Wei-Che HSIEH, Ta-Cheng LIEN, Hsin-Chang LEE, Ping-Hsun LIN, Hao-Ping CHENG, Ming-Wei CHEN, Szu-Ping TSAI
  • Publication number: 20240337917
    Abstract: A reflective mask includes a substrate, a reflective multilayer disposed on the substrate, a capping layer disposed on the reflective multilayer, and an absorber layer disposed on the capping layer. The absorber layer includes one or more alternating pairs of a first Cr based layer and a second Cr based layer different from the first Cr based layer.
    Type: Application
    Filed: June 17, 2024
    Publication date: October 10, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pei-Cheng HSU, Ching-Huang CHEN, Hung-Yi TSAI, Ming-Wei CHEN, Hsin-Chang LEE, Ta-Cheng LIEN