Abstract: In some embodiments, a method of forming a bonded assembly includes: providing a first object comprising a first surface having a plurality of locking orifices formed therein, each of the plurality of locking orifices including an opening on the surface of the object and a cavity extending in the first object; positioning an adhesive on at least one of the first surface of the first object and a second surface on a second object; positioning the first surface of the first object on the second surface of the second object with the adhesive between the first and second surfaces; and curing the adhesive to form the bonded assembly.