Abstract: The present invention provides a method of enhancing continuous directional high-value biological conversion of an urban wet garbage open system. The method includes wet garbage crushing, low-energy consumption hydrolysis, continuous conversion of organic components of wet garbage into short-chain fatty acid, continuous directional conversion of other components of short-chain fatty acid into acetic acid, separation and microbial reflux of acetic acid, and the like.

Abstract: A mask and a mask assembly, which relates to the display field. The mask includes an opening region, a welding region and a blocking groove, the welding region is arranged around the opening region, and the blocking groove is arranged outside the opening area. When the mask is welded to a frame, wrinkles will appear on the mask. In embodiments of the present application, by providing a blocking groove on the mask, the spreading of the wrinkles may be blocked by the blocking groove, thereby preventing the wrinkles from extending into the opening region of the mask, avoiding the position shifting of the opening region, and improving the evaporation accuracy.

Abstract: A permanent magnet generator experimental device for simulating electromechanical cross and complex faults is disclosed. The device includes a base, a DC drive motor, a permanent magnet simulation generator, bearing seats, a stator short circuit wiring board and time relays. A certain degree of radial air-gap eccentricity is set by moving a stator and a stator winding, and then a stator short circuit is set by controlling time relays; or a certain degree of axial air-gap eccentricity is set by moving a stator and a stator winding, and then a stator short circuit is set by controlling time relays. According to the above settings, different degrees of electromechanical cross and complex faults are simulated as required.

Abstract: A light-emitting diode (LED) chip includes a plurality of epitaxial structures, at least one first electrode, and a plurality of second electrodes. Any two adjacent epitaxial structures of the plurality of epitaxial structures have a gap therebetween. Each epitaxial structure includes a first semiconductor pattern, a light-emitting pattern and a second semiconductor pattern stacked in sequence. First semiconductor patterns in at least two of the plurality of epitaxial structures are connected to each other to form a first semiconductor layer. A first electrode is electrically connected to the first semiconductor layer. Each second electrode is electrically connected to the second semiconductor pattern in at least one of the plurality of epitaxial structures.

Abstract: Embodiments of the present disclosure provide a ferromagnetic object detection device and a method for detecting a tubing coupling. The ferromagnetic object detection device includes a support tube, a magnetic field generating device and a magnetic detection device. The support tube includes a space penetrating in a first direction; the magnetic field generating device is located on an outer sidewall of the support tube and configured to generate a magnetic field; the magnetic field detection device includes a first magnetic field detection element, a second magnetic field detection element and a third magnetic field detection element.

Abstract: A light-emitting diode substrate, a manufacturing method thereof, and a display device are disclosed. The manufacturing method of the light-emitting diode substrate includes: forming an epitaxial layer group of M light-emitting diode chips on a substrate; transferring N epitaxial layer groups on N substrates onto a transition carrier substrate, the N epitaxial layer groups on the N substrates being densely arranged on the transition carrier substrate; and transferring at least part of N*M light-emitting diode chips corresponding to the N epitaxial layer groups on the transition carrier substrate onto a driving substrate, an area of the transition carrier substrate is greater than or equal to a sum of areas of the N substrates, M is a positive integer greater than or equal to 2, and N is a positive integer greater than or equal to 2.

Abstract: The present application relates to the field of ice making, and provides an ice making system and a refrigeration apparatus. The ice making system includes an ice making assembly, a water collecting tank located below the ice making assembly, and a water diversion ice rake structure. The water diversion ice rake structure includes: a pair of water receiving lateral wings, each of which is constructed with a rotary end and a free end; the pair of water receiving lateral wings are rotatably disposed on opposite sides of the ice making assembly through the respective rotary ends to rotate between an ice making position and an ice falling position. At the ice making position, the free ends of the pair of water receiving lateral wings are butted in a space between the ice making assembly and the water collecting tank to form a closure space with an opening facing the ice making assembly, and a water outlet communicating with the water collecting tank is constructed on one side of the closure space.

Abstract: Magnetic levitation bearing structure includes a cylinder body, a rotating shaft, a motor stator, a motor rotor, an axial bearing, a radial bearing and a displacement sensing device; the displacement sensing device, the axial bearing stator, and the radial bearing stator are directly fixed on an inner wall of the cylinder body.

Abstract: The present invention provides use of an ionization radiation source in preparation of a porous crystalline material, and a method for preparing a MOFs material and a COFs material. In the present invention, the ionization radiation source is used for preparing the porous crystalline material; under the irradiation of the ionization radiation source, the porous crystalline material (MOFs, COFs) can be synthesized in an extremely short time, wherein the ionization radiation source is used for providing energy required in a reaction for preparing the porous crystalline material. The preparation process does not need heating, so that energy consumption is reduced and a high-pressure system is avoided. The aforementioned preparation method is simple, low in instrument and equipment cost, and thus is a environmentally friendly and extremely low-cost synthesis method.

Abstract: A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a chip arranged on the base substrate, wherein the chip includes a chip main body and a plurality of terminals arranged on the chip main body; a terminal expansion layer arranged on the base substrate, the terminal expansion layer including a conductive material, and the terminal expansion layer and at least one terminal are located on a same side of the chip main body; and a plurality of expansion wires in the terminal expansion layer, wherein the plurality of expansion wires are electrically connected to the plurality of terminals, respectively, to lead out the plurality of terminals, wherein an orthographic projection of at least one expansion wire on the base substrate completely covers an orthographic projection of a terminal electrically connected to the expansion wire on the base substrate.

Abstract: A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a plurality of chips arranged on the base substrate each including a chip main body and a plurality of terminals arranged thereon; a plurality of fixed connection portions arranged on the base substrate, and adjacent to the plurality of chips; a terminal expansion layer arranged on the base substrate; and a plurality of expansion wires in the terminal expansion layer and configured to electrically connect the chips, wherein an expansion wire configured to electrically connect two chips includes at least a first wire segment and a second wire segment, and the first wire segment is configured to electrically connect a terminal of a chip and a fixed connection portion adjacent to the chip, and the second wire segment is configured to connect two fixed connection portions between the two chips.

Abstract: A method for preparing a zeolite molecular sieve includes the steps of: (1) mixing at least one of a silicon source, an aluminum source and a phosphorus source with an alkaline substance, a template agent and water uniformly to obtain a zeolite molecular sieve precursor solution; aging the zeolite molecular sieve precursor solution at 20-30° C. for 10-15 h; and subjecting the aged solution to ionizing radiation, and then washing the obtained solid to neutrality and drying to obtain the zeolite molecular sieve. The method of the present invention is green, simple and extremely cost-effective. Under the irradiation of an ionizing radiation source, the synthesis period of zeolite molecular sieve is short and no heating is needed in the preparation process, so energy consumption is reduced and a high-pressure system is avoided.

Abstract: An array substrate and a display panel, which relate to the technical field of flexible displays and are used for solving the problem of the Newton's ring phenomenon due to unequal spacing between transparent layers affects the display effect of the display panel. The array substrate or a display panel include at least two transparent layers stacked in sequence, and a light adjusting layer arranged between at least two adjacent transparent layers, where a product of a refractive index of the light adjusting layer and a thickness of the light adjusting layer is greater than one half of a preset wave train length.

Abstract: A display panel and a display device, where the display panel includes a substrate, an insulation layer, a conductive layer, a first planarization layer, an OLED layer and an encapsulation layer which are stacked in sequence, where a plurality of first grooves are formed in the conductive layer, and the first planarization layer fills the first grooves and covers the conductive layer; the display panel further includes a compensation layer, where a plurality of second grooves are formed in the compensation layer, and projection of the compensation layer on the substrate at least overlaps with projection of part of the first grooves on the substrate.

Abstract: A display panel and a display apparatus. The display panel includes a light-transmitting area and a display area at least partially surrounding the light-transmitting area, and a light-shielding area is disposed between the display area and the light-transmitting area. An array substrate and a light-emitting layer disposed on the array substrate are disposed in the display area, and at least one light-shielding layer is disposed in the light-shielding area to prevent light emitted by the light-emitting layer in the display area from entering the light-transmitting area. The embodiments can effectively block the light in the display area from transmitting through the light-transmitting area, and reduce the light leakage rate of the display panel, thereby optimizing the display effect of the display panel and the display apparatus, and meanwhile being conductive to manufacturing the display panel with a narrow frame.

Abstract: A LED chip, including: substrate; LEDs on side of the substrate, each including first semiconductor pattern, light emission pattern, second semiconductor pattern sequentially stacked, the first semiconductor patterns of at least two LEDs being formed as single piece to constitute first semiconductor layer; at least one first electrode on side of first semiconductor layer away from the substrate and electrically coupled to first semiconductor layer; second electrodes on side of the second semiconductor patterns away from the substrate, each being electrically coupled to second semiconductor pattern of corresponding LED; pixel defining layer on side of the substrate away from LED, and having pixel openings in one-to-one correspondence with LEDs; and a color conversion pattern within at least two pixel openings, and converting light of first color emitted by the light emission pattern into light of target color other than the first color. The LED chip is Mini-LED or Micro-LED chip.

Abstract: A display substrate and a display device are provided. The display substrate includes a backplane including a plurality of pixel regions; and light emitting units arranged in one-to-one correspondence with the plurality of pixel regions. Each light emitting unit includes light emitting sub-units arranged in a plurality of rows and a plurality of columns, each row of light emitting sub-units includes a plurality of light emitting sub-units arranged along a row direction, each column of light emitting sub-units includes one light emitting sub-unit, and orthographic projections of light emitting regions of two adjacent columns of light emitting sub-units on a first straight line extending along a column direction are not overlapped; and in each light emitting unit, there is no gap between orthographic projections of the light emitting regions of the two adjacent columns of light emitting sub-units on a second straight line extending along the row direction.

Abstract: An evaporation mask, an organic light-emitting diode (OLED) panel and system, and an evaporation monitoring method. The evaporation mask includes a first functional region and a first peripheral region disposed outside of the first functional region. The first functional region has a first opening for forming a functional layer by evaporation, and the first peripheral region has a second opening for monitoring an evaporation effect of the first opening. A monitoring structure can be formed on an observation layer of the OLED panel by evaporation through the second opening of the evaporation mask, and the evaporation effect of the first opening of the evaporation mask can be monitored via the monitoring structure, so that the evaporation effect can be monitored in time to achieve real-time on-line monitoring.

Abstract: A driving backplane, a display panel and a display apparatus are provided. The driving backplane includes: a base substrate, and a plurality of connection electrode groups and a plurality of correction structures disposed on the base substrate, each of the connection electrode groups includes: a first connection electrode and a second connection electrode the first connection electrode and the second connection electrode are arranged on a same layer; a first gap is formed between the first connection electrode and the second connection electrode, and a first group of opposite edges includes: an edge, close to the first gap, of the first connection electrode; and an edge, close to the first gap, of the second connection electrode; a second group of opposite edges includes: an edge, far away from the first gap, of the first connection electrode; and an edge, far away from the first gap, of the second connection electrode.

Abstract: An embodiment of the present disclosure provides a light emitting diode chip, including: a light emitting functional layer including a first semiconductor layer, a light emitting layer and a second semiconductor layer which are sequentially stacked, and a second semiconductor layer including a plurality of second semiconductor patterns which are arranged at intervals; a first electrode layer including a first electrode pattern electrically coupled to the first semiconductor layer; a second electrode layer disposed on a side, away from the light emitting layer, of the second semiconductor layer and including a plurality of second electrode patterns in one-to-one correspondence with the second semiconductor patterns, and the second electrode patterns are electrically coupled to the second semiconductor patterns correspondingly. Embodiments of the present disclosure further provide a method for manufacturing a light emitting diode chip and a display device.