Patents by Inventor Ming-Yi Wu

Ming-Yi Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PASSIVATION LAYER FOR FORMING SEMICONDUCTOR BONDING STRUCTURE, SPUTTERING TARGET MAKING THE SAME, SEMICONDUCTOR BONDING STRUCTURE AND SEMICONDUCTOR BONDING PROCESS
    Publication number: 20240145421
    Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 2, 2024
    Inventors: Kuan-Neng CHEN, Zhong-Jie HONG, Chih-I CHO, Ming-Wei WENG, Chih-Han CHEN, Chiao-Yen WANG, Ying-Chan HUNG, Hong-Yi WU, CHENG-YEN HSIEH
  • Composite antenna structure
    Patent number: 8803740
    Abstract: A composite antenna structure includes a dielectric main body, a covering layer and a metallic transmission line structure. The dielectric constant of the dielectric main body is ranged from 1 to 200. The covering layer is disposed on the dielectric main body and has a pattern area defined thereon. The metallic transmission line structure is formed on the pattern area of the covering layer.
    Type: Grant
    Filed: January 4, 2012
    Date of Patent: August 12, 2014
    Assignee: Inpaq Technology Co., Ltd.
    Inventors: Yueh-Pi Huang, Ming-Tsan Tseng, Ming-Yi Wu
  • COMPOSITE ANTENNA STRUCTURE
    Publication number: 20130169486
    Abstract: A composite antenna structure includes a dielectric main body, a covering layer and a metallic transmission line structure. The dielectric constant of the dielectric main body is ranged from 1 to 200. The covering layer is disposed on the dielectric main body and has a pattern area defined thereon. The metallic transmission line structure is formed on the pattern area of the covering layer.
    Type: Application
    Filed: January 4, 2012
    Publication date: July 4, 2013
    Applicant: INPAQ TECHNOLOGY CO., LTD.
    Inventors: YUEH-PI HUANG, MING-TSAN TSENG, MING-YI WU
  • Chip-type antenna for receiving FM broadcasting signal and a manufacturing method thereof
    Publication number: 20100156734
    Abstract: A chip-type antenna for receiving FM broadcasting signal includes a ceramic substrate, a ferrite layer formed on a top surface of the ceramic substrate, and a radiation structure. The ceramic substrate and the ferrite layer form an antenna substrate. The radiation structure is formed on the antenna substrate. The chip-type antenna for receiving FM broadcasting signal utilizes the high dielectric constant of the ceramic substrate and the electric characteristic of the ferrite layer to reduce the dimension of the antenna.
    Type: Application
    Filed: December 19, 2008
    Publication date: June 24, 2010
    Inventors: Chih-Ming Chen, Chih-Wei Chen, Chih-Hao Lai, Ming-Yi Wu, Tzu-Feng Lee