Patents by Inventor Mingyi YU
Mingyi YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12225665Abstract: A circuit system and method of manufacturing a printed circuit board includes providing an integrated circuit package mounted on a first side of a printed circuit board and a power regulator connected to power terminals of the integrated circuit package through a cutout in the printed circuit board. The power regulator draws power from the printed circuit board by way of side pins around a periphery of the cutout.Type: GrantFiled: May 5, 2022Date of Patent: February 11, 2025Assignee: NVIDIA Corp.Inventors: MingYi Yu, Greg Bodi, Ananta Attaluri
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Publication number: 20240389230Abstract: A printed circuit board (PCB) includes an exterior section having a first set of layers including an outermost conductive layer. The PB further includes an interior section, adjacent to the exterior section, having a second set of layers including a first conductive layer corresponding to a first end of the interior section, a second conductive layer corresponding to a second end of the interior section opposite the first end, and a third conductive layer disposed between the first conductive layer and the second conductive layer. The exterior section further includes a set of vias extending from an outermost conductive layer to the first conductive layer. The interior section further includes a buried skip via extending from the first conductive layer to the third conductive layer.Type: ApplicationFiled: May 15, 2023Publication date: November 21, 2024Inventors: Mingyi Yu, Gregory Patrick Bodi, Gabriele Gorla, Xiang Sun
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Publication number: 20240074053Abstract: According to various embodiments, a printed circuit board includes: a buried via formed through one or more layers of the printed circuit board; a first conductive pad that is formed on a first end of the buried via; a first conductive via that is formed through a first layer of the printed circuit board and is connected to the first conductive pad; and a second conductive via that is formed through the first layer of the printed circuit board and is connected to the first conductive pad.Type: ApplicationFiled: August 25, 2022Publication date: February 29, 2024Inventors: Mingyi YU, Gregory Patrick BODI, Ananta H. ATTALURI, Duy NGUYEN
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Publication number: 20230363085Abstract: A circuit system includes an integrated circuit package mounted on a first side of a printed circuit board and a power regulator connected to power terminals of the integrated circuit package through a cutout in the printed circuit board. The power regulator draws power from the printed circuit board by way of connections on a shelf region extending beyond an area of the cutout.Type: ApplicationFiled: May 5, 2022Publication date: November 9, 2023Applicant: NVIDIA Corp.Inventors: MingYi Yu, Greg Bodi, Ananta Attaluri
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Publication number: 20230363093Abstract: A circuit system includes an integrated circuit package mounted on a first side of a printed circuit board and a power regulator connected to power terminals of the integrated circuit package through a cutout in the printed circuit board. The power regulator draws power from the printed circuit board by way of side pins around a periphery of the cutout.Type: ApplicationFiled: May 5, 2022Publication date: November 9, 2023Applicant: NVIDIA Corp.Inventors: MingYi Yu, Greg Bodi, Ananta Attaluri
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Publication number: 20230276578Abstract: A method for forming a printed circuit board includes: forming on a substrate a first conductive layer for a first edge connector pin and a first conductive layer for a second edge connector pin, wherein the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin are electrically coupled to one another via a first conductive layer for an electrical bridging element; electroplating a second conductive layer onto both the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin via a plating current conductor; and removing at least a portion of the electrical bridging element to electrically separate the first edge connector pin from the second edge connector pin.Type: ApplicationFiled: May 8, 2023Publication date: August 31, 2023Inventors: Mingyi YU, Gregory Patrick BODI
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Patent number: 11653455Abstract: A method for forming a printed circuit board includes: forming on a substrate a first conductive layer for a first edge connector pin and a first conductive layer for a second edge connector pin, wherein the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin are electrically coupled to one another via a first conductive layer for an electrical bridging element; electroplating a second conductive layer onto both the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin via a plating current conductor; and removing at least a portion of the electrical bridging element to electrically separate the first edge connector pin from the second edge connector pin.Type: GrantFiled: February 26, 2021Date of Patent: May 16, 2023Assignee: NVIDIA CorporationInventors: Mingyi Yu, Gregory Patrick Bodi
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Patent number: 11439002Abstract: A printed circuit board includes a first voltage plane disposed on a first surface of a first electrically insulating layer and a second voltage plane. An inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically couples the first voltage plane to the second voltage plane.Type: GrantFiled: October 27, 2020Date of Patent: September 6, 2022Assignee: NVIDIA CorporationInventors: Mingyi Yu, Ananta H. Attaluri, Gregory Patrick Bodi, Carmen A. Capillo, Jr., Michael James Warner
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Publication number: 20220279659Abstract: A method for forming a printed circuit board includes: forming on a substrate a first conductive layer for a first edge connector pin and a first conductive layer for a second edge connector pin, wherein the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin are electrically coupled to one another via a first conductive layer for an electrical bridging element; electroplating a second conductive layer onto both the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin via a plating current conductor; and removing at least a portion of the electrical bridging element to electrically separate the first edge connector pin from the second edge connector pin.Type: ApplicationFiled: February 26, 2021Publication date: September 1, 2022Inventors: Mingyi YU, Gregory Patrick BODI
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Publication number: 20210127479Abstract: A printed circuit board includes a first voltage plane disposed on a first surface of a first electrically insulating layer and a second voltage plane. An inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically couples the first voltage plane to the second voltage plane.Type: ApplicationFiled: October 27, 2020Publication date: April 29, 2021Inventors: Mingyi YU, Ananta H. ATTALURI, Gregory Patrick BODI, Carmen A. CAPILLO, JR., Michael James WARNER
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Patent number: 9746969Abstract: A flat panel electronic device is presented. The flat panel electronic device comprises an actuating apparatus, a supporting apparatus and a control apparatus. The actuating apparatus is configured to generate a first actuating signal. The supporting apparatus has an extending position and an initial position, wherein the supporting apparatus is configured to support at least a portion of the flat panel electronic device to a predetermined height when the supporting apparatus is in the extending position. The control apparatus is configured to control the movement of the supporting apparatus in response to the first actuating signal. In addition, the supporting apparatus can also have an additional function for adjusting the angle of the display panel of the flat panel electronic device with respect to the user, so as to improve the comfort level for watching.Type: GrantFiled: April 17, 2013Date of Patent: August 29, 2017Assignee: NVIDIA CORPORATIONInventor: Mingyi Yu
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Patent number: 9258633Abstract: The present invention provides a rear cover of a flat panel electronic device and a flat panel electronic device having the rear cover. A outer surface of the rear cover is provided with a recess and a supporting leg, the supporting leg is pivotably connected in the recess through a pivot means so as to enable the supporting leg to pivot between a retracting position and an unfolding position, the supporting leg is configured to be contained in the recess when being in the retracting position, and to make an angle with the rear cover when being in the unfolding position, a speaker is disposed in the supporting leg, sound holes are disposed at a position on a side wall of the supporting leg which is corresponding to the speaker, a through-hole is formed at a position of the rear cover which is corresponding to the pivot means, and an electric wire of the speaker passes through the through-hole to extend into the rear cover.Type: GrantFiled: January 22, 2013Date of Patent: February 9, 2016Assignee: NVIDIA CorporationInventor: Mingyi Yu
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Publication number: 20140218332Abstract: A flat panel electronic device is presented. The flat panel electronic device comprises an actuating apparatus, a supporting apparatus and a control apparatus. The actuating apparatus is configured to generate a first actuating signal. The supporting apparatus has an extending position and an initial position, wherein the supporting apparatus is configured to support at least a portion of the flat panel electronic device to a predetermined height when the supporting apparatus is in the extending position. The control apparatus is configured to control the movement of the supporting apparatus in response to the first actuating signal. In addition, the supporting apparatus can also have an additional function for adjusting the angle of the display panel of the flat panel electronic device with respect to the user, so as to improve the comfort level for watching.Type: ApplicationFiled: April 17, 2013Publication date: August 7, 2014Applicant: NVIDIA CORPORATIONInventor: MINGYI YU
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Publication number: 20140133689Abstract: The present invention provides a rear cover of a flat panel electronic device and a flat panel electronic device having the rear cover. A outer surface of the rear cover is provided with a recess and a supporting leg, the supporting leg is pivotably connected in the recess through a pivot means so as to enable the supporting leg to pivot between a retracting position and an unfolding position, the supporting leg is configured to be contained in the recess when being in the retracting position, and to make an angle with the rear cover when being in the unfolding position, a speaker is disposed in the supporting leg, sound holes are disposed at a position on a side wall of the supporting leg which is corresponding to the speaker, a through-hole is formed at a position of the rear cover which is corresponding to the pivot means, and an electric wire of the speaker passes through the through-hole to extend into the rear cover.Type: ApplicationFiled: January 22, 2013Publication date: May 15, 2014Applicant: NVIDIA CORPORATIONInventor: Mingyi YU