Patents by Inventor Mingyi YU

Mingyi YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240074053
    Abstract: According to various embodiments, a printed circuit board includes: a buried via formed through one or more layers of the printed circuit board; a first conductive pad that is formed on a first end of the buried via; a first conductive via that is formed through a first layer of the printed circuit board and is connected to the first conductive pad; and a second conductive via that is formed through the first layer of the printed circuit board and is connected to the first conductive pad.
    Type: Application
    Filed: August 25, 2022
    Publication date: February 29, 2024
    Inventors: Mingyi YU, Gregory Patrick BODI, Ananta H. ATTALURI, Duy NGUYEN
  • Publication number: 20230363093
    Abstract: A circuit system includes an integrated circuit package mounted on a first side of a printed circuit board and a power regulator connected to power terminals of the integrated circuit package through a cutout in the printed circuit board. The power regulator draws power from the printed circuit board by way of side pins around a periphery of the cutout.
    Type: Application
    Filed: May 5, 2022
    Publication date: November 9, 2023
    Applicant: NVIDIA Corp.
    Inventors: MingYi Yu, Greg Bodi, Ananta Attaluri
  • Publication number: 20230363085
    Abstract: A circuit system includes an integrated circuit package mounted on a first side of a printed circuit board and a power regulator connected to power terminals of the integrated circuit package through a cutout in the printed circuit board. The power regulator draws power from the printed circuit board by way of connections on a shelf region extending beyond an area of the cutout.
    Type: Application
    Filed: May 5, 2022
    Publication date: November 9, 2023
    Applicant: NVIDIA Corp.
    Inventors: MingYi Yu, Greg Bodi, Ananta Attaluri
  • Publication number: 20230276578
    Abstract: A method for forming a printed circuit board includes: forming on a substrate a first conductive layer for a first edge connector pin and a first conductive layer for a second edge connector pin, wherein the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin are electrically coupled to one another via a first conductive layer for an electrical bridging element; electroplating a second conductive layer onto both the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin via a plating current conductor; and removing at least a portion of the electrical bridging element to electrically separate the first edge connector pin from the second edge connector pin.
    Type: Application
    Filed: May 8, 2023
    Publication date: August 31, 2023
    Inventors: Mingyi YU, Gregory Patrick BODI
  • Patent number: 11653455
    Abstract: A method for forming a printed circuit board includes: forming on a substrate a first conductive layer for a first edge connector pin and a first conductive layer for a second edge connector pin, wherein the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin are electrically coupled to one another via a first conductive layer for an electrical bridging element; electroplating a second conductive layer onto both the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin via a plating current conductor; and removing at least a portion of the electrical bridging element to electrically separate the first edge connector pin from the second edge connector pin.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: May 16, 2023
    Assignee: NVIDIA Corporation
    Inventors: Mingyi Yu, Gregory Patrick Bodi
  • Patent number: 11439002
    Abstract: A printed circuit board includes a first voltage plane disposed on a first surface of a first electrically insulating layer and a second voltage plane. An inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically couples the first voltage plane to the second voltage plane.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: September 6, 2022
    Assignee: NVIDIA Corporation
    Inventors: Mingyi Yu, Ananta H. Attaluri, Gregory Patrick Bodi, Carmen A. Capillo, Jr., Michael James Warner
  • Publication number: 20220279659
    Abstract: A method for forming a printed circuit board includes: forming on a substrate a first conductive layer for a first edge connector pin and a first conductive layer for a second edge connector pin, wherein the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin are electrically coupled to one another via a first conductive layer for an electrical bridging element; electroplating a second conductive layer onto both the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin via a plating current conductor; and removing at least a portion of the electrical bridging element to electrically separate the first edge connector pin from the second edge connector pin.
    Type: Application
    Filed: February 26, 2021
    Publication date: September 1, 2022
    Inventors: Mingyi YU, Gregory Patrick BODI
  • Publication number: 20210127479
    Abstract: A printed circuit board includes a first voltage plane disposed on a first surface of a first electrically insulating layer and a second voltage plane. An inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically couples the first voltage plane to the second voltage plane.
    Type: Application
    Filed: October 27, 2020
    Publication date: April 29, 2021
    Inventors: Mingyi YU, Ananta H. ATTALURI, Gregory Patrick BODI, Carmen A. CAPILLO, JR., Michael James WARNER
  • Patent number: 9746969
    Abstract: A flat panel electronic device is presented. The flat panel electronic device comprises an actuating apparatus, a supporting apparatus and a control apparatus. The actuating apparatus is configured to generate a first actuating signal. The supporting apparatus has an extending position and an initial position, wherein the supporting apparatus is configured to support at least a portion of the flat panel electronic device to a predetermined height when the supporting apparatus is in the extending position. The control apparatus is configured to control the movement of the supporting apparatus in response to the first actuating signal. In addition, the supporting apparatus can also have an additional function for adjusting the angle of the display panel of the flat panel electronic device with respect to the user, so as to improve the comfort level for watching.
    Type: Grant
    Filed: April 17, 2013
    Date of Patent: August 29, 2017
    Assignee: NVIDIA CORPORATION
    Inventor: Mingyi Yu
  • Patent number: 9258633
    Abstract: The present invention provides a rear cover of a flat panel electronic device and a flat panel electronic device having the rear cover. A outer surface of the rear cover is provided with a recess and a supporting leg, the supporting leg is pivotably connected in the recess through a pivot means so as to enable the supporting leg to pivot between a retracting position and an unfolding position, the supporting leg is configured to be contained in the recess when being in the retracting position, and to make an angle with the rear cover when being in the unfolding position, a speaker is disposed in the supporting leg, sound holes are disposed at a position on a side wall of the supporting leg which is corresponding to the speaker, a through-hole is formed at a position of the rear cover which is corresponding to the pivot means, and an electric wire of the speaker passes through the through-hole to extend into the rear cover.
    Type: Grant
    Filed: January 22, 2013
    Date of Patent: February 9, 2016
    Assignee: NVIDIA Corporation
    Inventor: Mingyi Yu
  • Publication number: 20140218332
    Abstract: A flat panel electronic device is presented. The flat panel electronic device comprises an actuating apparatus, a supporting apparatus and a control apparatus. The actuating apparatus is configured to generate a first actuating signal. The supporting apparatus has an extending position and an initial position, wherein the supporting apparatus is configured to support at least a portion of the flat panel electronic device to a predetermined height when the supporting apparatus is in the extending position. The control apparatus is configured to control the movement of the supporting apparatus in response to the first actuating signal. In addition, the supporting apparatus can also have an additional function for adjusting the angle of the display panel of the flat panel electronic device with respect to the user, so as to improve the comfort level for watching.
    Type: Application
    Filed: April 17, 2013
    Publication date: August 7, 2014
    Applicant: NVIDIA CORPORATION
    Inventor: MINGYI YU
  • Publication number: 20140133689
    Abstract: The present invention provides a rear cover of a flat panel electronic device and a flat panel electronic device having the rear cover. A outer surface of the rear cover is provided with a recess and a supporting leg, the supporting leg is pivotably connected in the recess through a pivot means so as to enable the supporting leg to pivot between a retracting position and an unfolding position, the supporting leg is configured to be contained in the recess when being in the retracting position, and to make an angle with the rear cover when being in the unfolding position, a speaker is disposed in the supporting leg, sound holes are disposed at a position on a side wall of the supporting leg which is corresponding to the speaker, a through-hole is formed at a position of the rear cover which is corresponding to the pivot means, and an electric wire of the speaker passes through the through-hole to extend into the rear cover.
    Type: Application
    Filed: January 22, 2013
    Publication date: May 15, 2014
    Applicant: NVIDIA CORPORATION
    Inventor: Mingyi YU