Abstract: A semiconductor device, comprising a frame including a die pad and a lead portion; a semiconductor element; a wire including one end connected to the semiconductor element and another end connected to the lead portion; at least one first bonding portion formed of a solder material and bonding a part of an upper surface of the die pad to a part which is on a lower surface of the semiconductor element and which is opposed to the part of the upper surface of the die pad; and at least one second bonding portion formed of a thermosetting resin and bonding another part of the upper surface of the die pad to another part which is on the lower surface of the semiconductor element and which is opposed to said another part of the upper surface of the die pad.

Abstract: A novel method for decomposing urethane resin suppresses the generation of aromatic amines and facilitates the recycling of urethane resins. To decompose urethane resin, the method involves the use of a decomposing agent that has both an ability to cleave urethane bonds in a urethane resin and an ability to react with and thus capture an amine compound. The decomposing agent is preferably one that contains either at least one selected from carboxyl group, and a salt, ester and acid anhydride thereof, or at least one selected from isocyanate group and epoxy group.

Abstract: Disclosed is a method of adding a compound having at least one group selected from the group consisting of a carboxyl group, salts thereof, esters thereof and haloformyl groups or an acid anhydride, as a treating agent, to a resin decomposed substance prepared by decomposing a urethane bond of a urethane resin, and adding an epoxy resin or isocyanate compound to the product, to regenerate the resin. According to the present invention, reaction activity in producing a regenerated resin from a urethane resin decomposed substance is appropriately suppressed, and thus regeneration of a urethane resin can be carried out by easy procedures.

Abstract: The present invention provides a semiconductor device comprising a frame including a die pad and a lead portion, a semiconductor element, a wire including one end connected to the semiconductor element and another end connected to the lead portion, at least one first bonding portion formed of a solder material and bonding a part of the die pad to a part of the semiconductor element, and at least one second bonding portion formed of a thermosetting resin and bonding another part of the die pad to another part of the semiconductor element.

Abstract: A method of recycling a thermoset resin is provided, which involves contacting at least a portion of the thermoset resin with a decomposer having at least one functional group capable of reacting at a crosslink site on the thermoset resin, under conditions sufficient to break the crosslink site, to give a fluid thermoset preresin, wherein a plurality of chain ends of the preresin have functional groups thereon; and re-hardening the fluid thermoset preresin by reacting the plurality of chain ends with a rehardener having two or more groups reactive with the chain end functional groups.

Abstract: Disclosed is a semiconductor device provided with a heat-sink. The semiconductor device comprises a laminated insulating film formed on the heat-sink, a lead-frame mounted on the laminated insulating film, a semiconductor chip mounted to the lead-frame, and a molding resin for molding the semiconductor chip. The laminated insulating film comprises a first insulating resin layer formed on the side of the heat-sink and a second insulating resin layer formed on the side of the lead-frame. The first insulating resin layer is made of an epoxy resin containing 80 wt % of a heat dissipating filler. Also, the second insulating resin layer is made of an epoxy resin containing 70 wt % of a heat dissipating filler.

Abstract: An aqueous printing ink composition containing finely dispersed pigments and a synthetic polymer binder, the binder containing: (a) finely dispersed, aqueous-basic insoluble emulsion (co)polymers having a number average molecular weight of from about 10,000 to 1,000,000 and a glass transition temperature of up to 0.degree. C., in intimate admixture with (b) aqueous-basic soluble or dispersible (co) polymers having a number average molecular weight lower than that of the (co)polymers of component (a) and a glass transition temperature of at least 0.degree. C.