Patents by Inventor Min-ho Jang

Min-ho Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250122592
    Abstract: Provided is a cold-rolled steel sheet consisting of carbon (C): 0.23 wt % to 0.35 wt %, silicon (Si): 0.05 wt % to 0.5 wt %, manganese (Mn): 0.3 wt % to 2.3 wt %, phosphorus (P): more than 0 wt % and not more than 0.02 wt %, sulfur (S): more than 0 wt % and not more than 0.005 wt %, aluminum (Al): 0.01 wt % to 0.05 wt %, chromium (Cr): more than 0 wt % and not more than 0.8 wt %, molybdenum (Mo): more than 0 wt % and not more than 0.4 wt %, titanium (Ti): 0.01 wt % to 0.1 wt %, boron (B): 0.001 wt % to 0.005 wt %, a balance of iron (Fe), and unavoidable impurities, wherein a final microstructure of the cold-rolled steel sheet includes cementite, a transition carbide, and a fine precipitate, the transition carbide including ?-carbide having an atomic ratio of a substitutional element selected from Fe, Mn, Cr, and Mo, to C of 2.
    Type: Application
    Filed: December 23, 2024
    Publication date: April 17, 2025
    Inventors: Bong June Park, Hyun Seong Noh, Joung Hyun La, Min Suh Park, Min Ho Jang, Seong Kyung Han
  • Publication number: 20250091113
    Abstract: A hot stamping part includes: a base material; a decarburization layer located on the base material; and an inner oxide layer located on the decarburization layer, wherein the hot stamping part has a tensile strength (TS) of 1680 MPa to 2000 MPa, and a hardness of the hot stamping part within a depth of 50 ?m from a surface of the hot stamping part in a plate thickness direction of the hot stamping part and an average hardness of the hot stamping part satisfy Relational Expression 1. ( A / B ) ? 0 . 7 < Relational ? Expression ? 1 > (In Relational Expression 1, A denotes the hardness (Hv(?50 ?m)) within the depth of 50 ?m in the plate thickness direction of the hot stamping part, and B denotes the average hardness (Hv(avg.)) of the hot stamping part.
    Type: Application
    Filed: December 2, 2024
    Publication date: March 20, 2025
    Inventors: Min Ho Jang, Seok Hyeon Kang, Min Suh Park, Seong Kyung Han
  • Publication number: 20250092485
    Abstract: A hot stamping component includes: a base material; a decarburization layer located on the base material; and an inner oxide layer located on the decarburization layer, wherein the hot stamping component has a tensile strength (TS) of 1350 MPa to 1680 MPa, and a hardness of the hot stamping component within a depth of 50 ?m from a surface of the hot stamping component in a plate thickness direction of the hot stamping component and an average hardness of the hot stamping component satisfy Relational Expression 1. ( A / B ) ? 0 . 7 < Relational ? Expression ? 1 > (In Relational Expression 1, A denotes the hardness (Hv(?50 ?m)) within the depth of 50 ?m in the plate thickness direction of the hot stamping component, and B denotes the average hardness (Hv(avg.)) of the hot stamping component.
    Type: Application
    Filed: December 2, 2024
    Publication date: March 20, 2025
    Inventors: Min Ho Jang, Seok Hyeon Kang, Min Suh Park, Seong Kyung Han
  • Publication number: 20250075286
    Abstract: In one aspect, a method of manufacturing an ultra-high strength galvanized steel sheet is provided, the method including a step of annealing a cold-rolled steel sheet in an annealing furnace, wherein an annealing time (A) for performing the annealing and a moisture concentration (B) in the annealing furnace are controlled based on the product of the positive square root (A1/2) of the annealing time and the natural logarithm value (ln(1/B)) of the reciprocal value of the moisture concentration.
    Type: Application
    Filed: November 19, 2024
    Publication date: March 6, 2025
    Inventors: Min Suh Park, Joung Hyun La, Wan Yook, Min Ho Jang
  • Patent number: 12230658
    Abstract: An image sensor includes a substrate having first and second surfaces and first and second regions. Unit pixels including photoelectric conversion layers are arranged inside the first region. A pixel separation pattern extends from the first surface to the second surface in the first region, separates each of the unit pixels, and includes a pixel separation spacer film and a pixel separation filling film. A dummy pixel separation pattern extends from the first surface to the second surface in the second region, and includes a dummy pixel separation filling film. A wiring structure disposed on the second surface includes an inter-wiring insulating film and a first wiring. A first contact directly connects the dummy pixel separation filling film and connects the dummy pixel separation filling film to the first wiring. A height of the pixel separation filling film is greater than a height of the dummy pixel separation filling film.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: February 18, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min Ho Jang, Seung Kuk Kang, Hae Sung Jung, Kwan Sik Cho, Ho-Chul Ji
  • Patent number: 12176164
    Abstract: A plug interlock apparatus for a vacuum circuit breaker, comprising: a control power plug having a plug fixing member formed on each side thereof; a switchboard including a plurality of terminals; a control power connector from which the control power plug is detached; a plug latch formed on the sides of the control power connector and fixing the plug fixing members; a circuit breaker body which includes a connector rotation link which rotates in association with the plug latch, and a slide link having one end coupled to the connector rotation link, and which is detached from the terminal and supplied with voltage and current; and a transfer cart for reciprocating the circuit breaker body along a rail installed on the bottom surface of the switchboard, wherein a locking latch detached from a rail groove formed on the rail is formed at the other end of the slide link.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: December 24, 2024
    Assignee: LS ELECTRIC CO., LTD.
    Inventor: Min-Ho Jang
  • Publication number: 20240181517
    Abstract: A hot-stamped component according to an embodiment of the present disclosure includes a steel sheet, a plating layer located on the steel sheet and including Zn, and a surface layer located on the plating layer, wherein the surface layer includes a post-treatment layer including an Si-based inorganic post-treatment agent, a Zn oxide layer located on a same layer as the post-treatment layer on the plating layer, and an inter-diffusion layer located between the plating layer and at least one of the post-treatment layer and the Zn oxide layer to overlap at least one of the post-treatment layer and the Zn oxide layer, the inter-diffusion layer including at least one of Si, Mn, O, Fe, Zn, and SiO.
    Type: Application
    Filed: December 29, 2023
    Publication date: June 6, 2024
    Inventors: Min Ho Jang, Kun Woo Chang
  • Publication number: 20240141473
    Abstract: A hot stamping component according to an embodiment of the present disclosure includes a steel sheet, a plating layer located on the steel sheet and including Zn, and a surface layer located on the plating layer, wherein the surface layer includes a post-treatment layer including an Si-based inorganic post-treatment agent, a Zn oxide layer located on a same layer as the post-treatment layer on the plating layer, and an inter-diffusion layer located between the plating layer and at least one of the post-treatment layer and the Zn oxide layer to overlap at least one of the post-treatment layer and the Zn oxide layer, the inter-diffusion layer including at least one of Si, Mn, O, Fe, Zn, and SiO, wherein a tensile strength of the steel sheet is 1680 MPa or more.
    Type: Application
    Filed: December 29, 2023
    Publication date: May 2, 2024
    Inventors: Min Ho Jang, Kun Woo Chang
  • Publication number: 20230167519
    Abstract: The present invention provides a dent-resistant cold-rolled steel sheet having excellent dent-resistance properties. According to one embodiment of the present invention, the dent-resistant cold-rolled steel sheet includes, by weight, carbon (C): 0.005% to 0.03%, manganese (Mn): 1.0% to 2.5%, aluminum (Al): 0.2% to 0.8%, sum of chromium (Cr) and molybdenum (Mo): 0.3% to 1.5%, sum of niobium (Nb) and titanium (Ti): 0.001% to 0.01%, phosphorus (P): greater than 0% to 0.02%, sulfur (S): greater than 0% to 0.01%, and the balance of iron (Fe) and other unavoidable impurities, wherein a yield strength (YP) of 195 MPa or greater, a tensile strength (ST) of 340 MPa or greater, elongation (El) of 33% or greater, and a bake hardening (BH) amount of 40 MPa or greater are satisfied.
    Type: Application
    Filed: December 21, 2021
    Publication date: June 1, 2023
    Inventors: Byoung Jin KIM, Chun ku Kang, YoungJu Park, Ha Young Yu, Min Ho Jang, Seong Kyung Han, Sung Yul Huh
  • Publication number: 20230065103
    Abstract: A plug interlock apparatus for a vacuum circuit breaker, comprising: a control power plug having a plug fixing member formed on each side thereof; a switchboard including a plurality of terminals; a control power connector from which the control power plug is detached; a plug latch formed on the sides of the control power connector and fixing the plug fixing members; a circuit breaker body which includes a connector rotation link which rotates in association with the plug latch, and a slide link having one end coupled to the connector rotation link, and which is detached from the terminal and supplied with voltage and current; and a transfer cart for reciprocating the circuit breaker body along a rail installed on the bottom surface of the switchboard, wherein a locking latch detached from a rail groove formed on the rail is formed at the other end of the slide link.
    Type: Application
    Filed: January 27, 2021
    Publication date: March 2, 2023
    Inventor: Min-Ho JANG
  • Publication number: 20220375983
    Abstract: An image sensor is provided. The image sensor includes unit pixels inside the substrate; a pixel separation pattern provided between the unit pixels, inside the substrate; a first inter-wiring insulating film provided on the first surface of the substrate; a pad pattern provided inside the first inter-wiring insulating film; a first connection pattern provided inside the first inter-wiring insulating film, an upper surface of the first connection pattern and an upper surface of the first inter-wiring insulating film being provided along a first common plane; a second inter-wiring insulating film provided on the upper surface of the first inter-wiring insulating film; a second connection pattern provided inside the second inter-wiring insulating film, a lower surface of the second connection pattern and a lower surface of the second inter-wiring insulating film being provided along a second common plane; and a microlens provided on the second surface of the substrate.
    Type: Application
    Filed: January 12, 2022
    Publication date: November 24, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung Kuk Kang, Min Ho Jang, Hoon Joo Na, Hee Ju Shin
  • Publication number: 20220352216
    Abstract: An image sensor includes a substrate having first and second surfaces and first and second regions. Unit pixels including photoelectric conversion layers are arranged inside the first region. A pixel separation pattern extends from the first surface to the second surface in the first region, separates each of the unit pixels, and includes a pixel separation spacer film and a pixel separation filling film. A dummy pixel separation pattern extends from the first surface to the second surface in the second region, and includes a dummy pixel separation filling film. A wiring structure disposed on the second surface includes an inter-wiring insulating film and a first wiring. A first contact directly connects the dummy pixel separation filling film and connects the dummy pixel separation filling film to the first wiring. A height of the pixel separation filling film is greater than a height of the dummy pixel separation filling film.
    Type: Application
    Filed: December 13, 2021
    Publication date: November 3, 2022
    Inventors: Min Ho JANG, Seung Kuk KANG, Hae Sung JUNG, Kwan Sik CHO, Ho-Chul JI
  • Patent number: 11484902
    Abstract: A system is provided for selectively applying a coating to portions of an article having at least one area that is not be coated. The system comprises a jig, with a platform for supporting article. The jig also has a bar that is moveable with respect to the platform and at least one masking element that is coupled to the bar and is configured to cover the at least one surface of the article that is not to be coated. The jig also has a first connection mechanism that defines a first mating element. The system also comprises at least one carrier that comprises a base and at least one second connection mechanism that defines a second mating element. The second mating element is mateable with the first mating element such that the jig is releasably coupled to the carrier upon mating the first and second mating elements.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: November 1, 2022
    Assignee: NIKE, Inc.
    Inventors: Hyun Tae Ahn, Tae Woong Heo, Min Ho Jang, Ji Hoo Park
  • Patent number: 11264414
    Abstract: An image sensor includes a semiconductor substrate having opposite first and second surfaces, a wiring structure on the first surface of the semiconductor substrate, and a refractive structure on the second surface of the semiconductor substrate. The refractive structure includes a first anti-reflective layer on the second surface of the semiconductor substrate, a refractive pattern on the first anti-reflective layer, an insulation layer on the first anti-reflective layer, and a second anti-reflective layer on the refractive pattern and the insulation layer. The refractive pattern includes first refractive parts spaced apart from each other in a first direction parallel to the second surface of the semiconductor substrate, and the insulation layer fills spaces between the first refractive parts.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: March 1, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Masaru Ishii, Tae-hyoung Kim, Min-ho Jang, In-sung Joe
  • Publication number: 20200227452
    Abstract: An image sensor includes a semiconductor substrate having opposite first and second surfaces, a wiring structure on the first surface of the semiconductor substrate, and a refractive structure on the second surface of the semiconductor substrate. The refractive structure includes a first anti-reflective layer on the second surface of the semiconductor substrate, a refractive pattern on the first anti-reflective layer, an insulation layer on the first anti-reflective layer, and a second anti-reflective layer on the refractive pattern and the insulation layer. The refractive pattern includes first refractive parts spaced apart from each other in a first direction parallel to the second surface of the semiconductor substrate, and the insulation layer fills spaces between the first refractive parts.
    Type: Application
    Filed: July 1, 2019
    Publication date: July 16, 2020
    Inventors: Masaru Ishii, Tae-hyoung Kim, Min-ho Jang, In-sung Joe
  • Publication number: 20200164393
    Abstract: A system is provided for selectively applying a coating to portions of an article having at least one area that is not be coated. The system comprises a jig, with a platform for supporting article. The jig also has a bar that is moveable with respect to the platform and at least one masking element that is coupled to the bar and is configured to cover the at least one surface of the article that is not to be coated. The jig also has a first connection mechanism that defines a first mating element. The system also comprises at least one carrier that comprises a base and at least one second connection mechanism that defines a second mating element. The second mating element is mateable with the first mating element such that the jig is releasably coupled to the carrier upon mating the first and second mating elements.
    Type: Application
    Filed: November 27, 2019
    Publication date: May 28, 2020
    Inventors: Hyun Tae AHN, Tae Woong HEO, Min Ho Jang, Ji Hoo Park
  • Patent number: 9935298
    Abstract: Disclosed herein is a battery cell case. The battery cell case includes a front case plate and a rear case plate which are separably coupled to each other. The structures of the front and rear case plates are symmetrical structures, so that the battery cell case can be easily assembled in such a way that the front and rear case plates are coupled to each other with the battery cell disposed therebetween and are fastened to each other by holders fitted over the opposite ends of the case plates. In another embodiment, the structures of the front and rear case plates may be asymmetrical structures so that the front and rear case plates can be coupled with each other in an insert coupling manner without using a separate tool or fastening means.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: April 3, 2018
    Assignee: Global Battery Co., Ltd.
    Inventors: Gueng Hyun Nam, Seok Ho Kim, Min Ho Jang, Dae Ung Kim
  • Patent number: 9559344
    Abstract: The present invention relates to a lithium battery and, more particularly, to a lithium battery, in which the structure of a battery module contained in the lithium battery is simplified, thus reducing the size of the entire lithium battery, and which includes a connector by which two or more lithium batteries are mechanically coupled to each other so that in response to a required amount of power, an appropriate number of lithium batteries can be easily connected to each other.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: January 31, 2017
    Assignee: Global Battery Co., Ltd.
    Inventors: Gueng Hyun Nam, Sang Min Jang, Seok Ho Kim, Dong Ho Baek, Min Ho Jang
  • Patent number: 9425442
    Abstract: The present invention relates to a lithium battery and, more particularly, to a lithium battery, in which the structure of a battery module contained in the lithium battery is simplified, thus reducing the size of the entire lithium battery, and which includes a connector by which two or more lithium batteries are mechanically coupled to each other so that in response to a required amount of power, an appropriate number of lithium batteries can be easily connected to each other.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: August 23, 2016
    Assignee: GLOBAL BATTERY CO., LTD
    Inventors: Gueng Hyun Nam, Sang Min Jang, Seok Ho Kim, Dong Ho Baek, Min Ho Jang
  • Publication number: 20160133891
    Abstract: The present invention relates to a lithium battery and, more particularly, to a lithium battery, in which the structure of a battery module contained in the lithium battery is simplified, thus reducing the size of the entire lithium battery, and which includes a connector by which two or more lithium batteries are mechanically coupled to each other so that in response to a required amount of power, an appropriate number of lithium batteries can be easily connected to each other.
    Type: Application
    Filed: December 29, 2015
    Publication date: May 12, 2016
    Inventors: Gueng Hyun NAM, Sang Min JANG, Seok Ho KIM, Dong Ho BAEK, Min Ho JANG