Abstract: A walking robot pose estimation method is provided. The walking robot pose estimation method according to an embodiment of the present disclosure includes the calculation a kinematic factor considering data measured by an inertial measurement unit (IMU) mounted on the walking robot and joint kinematics while the walking robot is in motion, obtaining point cloud data with respect to the environment where the walking robot is located by using the LiDAR sensor mounted on it, obtaining image data with respect to the environment where the walking robot is located by using the image sensor mounted on it, data fusion operation of the kinematic factor, the point cloud data, and the image data, and pose estimation of the walking robot based on the fused data.

Abstract: A thin film transistor array panel includes a substrate, a gate insulating layer, an interface layer, and a semiconductor layer. The gate insulating layer is disposed on the substrate. The interface layer is disposed on the gate insulating layer. The semiconductor layer is disposed on the interface layer. The interface layer includes a fluorinated silicon oxide. The semiconductor layer includes a p-type oxide semiconductor material.

Abstract: A thin film transistor array panel includes a substrate, a gate insulating layer, an interface layer, and a semiconductor layer. The gate insulating layer is disposed on the substrate. The interface layer is disposed on the gate insulating layer. The semiconductor layer is disposed on the interface layer. The interface layer includes a fluorinated silicon oxide. The semiconductor layer includes a p-type oxide semiconductor material.

Abstract: A method for manufacturing an organic light emitting diode display includes forming a thin-film transistor on a substrate, forming a protection layer by using a deposition method on an entire surface of the substrate, and forming an organic light emitting element on the protection layer. Forming the protection layer includes forming a first protection layer, a surface thereof including a first wrinkle, and forming a second protection layer on the first protection layer, a surface thereof including a second wrinkle. A first modulus value of the first protection layer is less than a second modulus value of the second protection layer by at least 300 MPa.

Abstract: A method for manufacturing an organic light emitting diode display includes forming a thin-film transistor on a substrate, forming a protection layer by using a deposition method on an entire surface of the substrate, and forming an organic light emitting element on the protection layer. Forming the protection layer includes forming a first protection layer, a surface thereof including a first wrinkle, and forming a second protection layer on the first protection layer, a surface thereof including a second wrinkle. A first modulus value of the first protection layer is less than a second modulus value of the second protection layer by at least 300 MPa.

Abstract: Disclosed herein is a method of preparing silica slurry for wafer polishing. This method includes pre-treating relatively inexpensive and commercially available fumed or colloidal silica particles as a seed by a settling, a crushing using a ball mill and a paint shaker, and a sonication to produce an aqueous dispersion of the silica particles. The pre-treated silica particles are then combined with tetraethylorothosilicate as a precursor, an alcohol solvent and a base, and grown to a desired size by hydrolysis and polycondensation of the precursor, tetraethylorothosilicate. Then, the alcohol solvent, in which the silica particles are grown, are displaced with water by a vacuum distillation. The resulting aqueous dispersion of the grown silica dispersion is hydrothermally treated in an autoclave. Thus, this method allows the economical preparation of the spherical silica particles having a highly uniform size and a very high purity.