Patents by Inventor Minhui Ma

Minhui Ma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RADIATOR OF VEHICLE POWER MODULE AND DESIGN METHOD THEREOF
    Publication number: 20230328935
    Abstract: This disclosure provides a design method for a radiator of a vehicle power module. The design method includes: selecting a plurality of specific values from the possible value ranges of the first distance D1, the second distance D2 and the radius R, respectively, to form different combinations of the plurality of specific values, performing simulation calculations on the different combinations, and obtaining a temperature rise ?Tj and a pressure drop ?Pf corresponding to each combination to form a plurality of samples; through a response surface method, fitting explicit functions of the temperature rise ?Tj and the pressure drop ?Pf with the first distance D1, the second distance D2 and the radius R as dependent variables; and through a multi-objective optimization, determining the first distance D1, the second distance D2 and the radius R with an optimization objective that the temperature rise ?Tj and the pressure drop ?Pf are simultaneously minimized.
    Type: Application
    Filed: April 6, 2023
    Publication date: October 12, 2023
    Applicants: Nexperia Technology (Shanghai) Ltd., Chongqing University, NEXPERIA B.V.
    Inventors: Ke Jiang, Zheng Zeng, Chunlin Zhu, Jiawei Zhang, Richard Qian, Peng Sun, Minhui Ma, Yuxi Liang
  • WAFER-LEVEL BACKSIDE LAYER FOR SEMICONDUCTOR APPARATUS
    Publication number: 20230064066
    Abstract: In a described example, a method of forming a semiconductor apparatus includes applying a layer of an electrically insulating material on a backside of a semiconductor wafer having a plurality of integrated circuit dice. The method also includes mounting the wafer to dicing tape with a die attach film, in which the die attach film is between the backside layer and the dicing tape, and cutting the wafer into respective dice.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Inventors: HAO ZHANG, YUNTAO XU, MINHUI MA, YUAN ZHANG, DING HAN
  • Lead frame system
    Patent number: 11024562
    Abstract: A lead frame strip with corrugated saw street metal where the corrugated saw street metal is comprised of a partial thickness of the lead frame strip metal. A lead frame strip with corrugated saw street metal where the corrugated saw street metal is comprised of a half thickness of the lead frame strip metal.
    Type: Grant
    Filed: October 18, 2016
    Date of Patent: June 1, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Xingliang Deng, Minhui Ma, Qinghua Hu, Alex Ting Chin-Sern, Ruben Da Rolda, Jr.
  • LEAD FRAME SYSTEM
    Publication number: 20170309546
    Abstract: A lead frame strip with corrugated saw street metal where the corrugated saw street metal is comprised of a partial thickness of the lead frame strip metal. A lead frame strip with corrugated saw street metal where the corrugated saw street metal is comprised of a half thickness of the lead frame strip metal.
    Type: Application
    Filed: October 18, 2016
    Publication date: October 26, 2017
    Inventors: Xingliang Deng, Minhui Ma, Qinghua Hu, Alex Ting Chin-Sern, Ruben Da Rolda, JR.