Abstract: An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker.

Abstract: A method of interconnecting semiconductor devices by using capillary motion, thereby simplifying fabricating operations, reducing fabricating costs, and simultaneously filling of through-silicon-vias (TSVs) and interconnecting semiconductor devices. The method includes preparing a first semiconductor device in which first TSVs are formed, positioning solder balls respectively on the first TSVs, performing a back-lap operation on the first semiconductor device, positioning a second semiconductor device, in which second TSVs are formed, above the first semiconductor device on which the solder balls are positioned, and performing a reflow operation such that the solder balls fill the first and second TSVs due to capillary motion.

Abstract: Provided are a reflow apparatus and method. The reflow apparatus includes a loader unit, a heating unit, an unloader unit, and a moving unit. The loader unit has an input module and an input stacker. Processing objects are stored in vertical stacks in magazines, and a plurality of magazines is stored in the input stacker. The magazines stored in the input stacker are moved to the input module and are introduced into the heating unit by the moving unit. Solder balls provided on the processing objects within the heating unit are quickly processed using an induction heating method. The processing objects that have undergone a reflow process are loaded in a magazine on an output module of the unloader unit and are then stored in an output stacker.

Abstract: An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker.

Abstract: The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.

Abstract: The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.

Abstract: The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.

Abstract: The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.

Abstract: In an embodiment of the invention, a device for manufacturing a wafer-level package includes a wafer sawing unit, a sorting unit, a pickup unit, and a placing unit. The wafer sawing unit cuts a wafer into wafer-level packages. The sorting unit performs a sorting process on the wafer-level packages to judge whether each of the wafer-level packages is normal or not. The pickup unit picks up the normal wafer-level packages. The placing unit stores the normal wafer-level packages in a storage case. The sawing process, the sorting process, and the placing process for the wafer-level package can be automatically performed within one device, thus a processing time reduction, a processing accuracy increase, and manpower reduction are achieved compared with the case where the processes are performed manually.

Abstract: The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.