Abstract: A heating member for a fusing apparatus includes a resistive heating layer including a base polymer and an electroconductive filler dispersed in the base polymer, where the resistive heating layer generates heat by receiving electric energy, and where a storage modulus of the resistive heating layer is about 1.0 megapascal or greater.

Abstract: A resistance heating composition including a silicon emulsion particle, a carbon nanotube, and an aqueous medium.

Abstract: A resistance heating element includes a positive temperature coefficient resistance heating layer having a positive temperature coefficient, and a negative temperature coefficient resistance heating layer, which is connected to the positive temperature coefficient resistance heating layer and has a negative temperature coefficient.

Abstract: A heating member includes: a resistive heating layer which generates heat when supplied with electrical energy; a release layer as an outermost layer of the heating member and including a polymer; an intermediate layer disposed between the resistive heating layer and the release layer. The resistive heating layer includes a base polymer, and an electroconductive filler dispersed in the base polymer. The intermediate layer includes a polymer material being a same type as the base polymer of the resistive heating layer or the polymer of the release layer.

Abstract: A method of forming a thin film resistive heating layer, the method including: forming a polymer layer by extruding a polymer paste, in which an electrically conductive filler is dispersed, by using an extrusion molding operation, on an outer circumferential surface of a cylindrical member; and forming a thin film resistive heating layer by making an outer diameter of the polymer layer uniform by using a ring blading operation.

Abstract: A heating member includes: a resistive heating layer including: a medium-passing area, and non-medium-passing areas respectively on opposing sides of the medium-passing area at opposing side portions of the resistive heating layer; a core which supports the resistive heating layer; a thermally conductive layer between the resistive heating layer and the core, and disposed in a non-medium passing area at a side portion of the resistive heating layer; and an electrode which is between the resistive heating layer and the core, contacts the side portion of the resistive heating layer and supplies current to the resistive heating layer. A ratio of a contact area between the thermally conductive layer and the resistive heating layer to an area of the non-medium-passing area in which the thermally conductive layer is disposed, ranges from about 5% to about 25%.

Abstract: A resistance heating element includes a positive temperature coefficient resistance heating layer having a positive temperature coefficient, and a negative temperature coefficient resistance heating layer, which is connected to the positive temperature coefficient resistance heating layer and has a negative temperature coefficient.

Abstract: A heating member includes: a resistive heating layer including: a medium-passing area, and non-medium-passing areas respectively on opposing sides of the medium-passing area at opposing side portions of the resistive heating layer; a core which supports the resistive heating layer; a thermally conductive layer between the resistive heating layer and the core, and disposed in a non-medium passing area at a side portion of the resistive heating layer; and an electrode which is between the resistive heating layer and the core, contacts the side portion of the resistive heating layer and supplies current to the resistive heating layer. A ratio of a contact area between the thermally conductive layer and the resistive heating layer to an area of the non-medium-passing area in which the thermally conductive layer is disposed, ranges from about 5% to about 25%.

Abstract: A fusing apparatus including a heating unit including a heater having a substantially flat shape; a nip forming unit which faces the heating unit and forms a fusing nip with the heating unit; and a driving unit which moves the heating unit to alternately repeat a forward motion whereby the heating unit moves forward in a moving direction of the recording medium, when the fusing nip is formed, and a returning motion whereby the heating unit moves backward in a direction opposite to the moving direction of the recording medium, when the fusing nip is released.

Abstract: A method of forming a thin film resistive heating layer, the method including: forming a polymer layer by extruding a polymer paste, in which an electrically conductive filler is dispersed, by using an extrusion molding operation, on an outer circumferential surface of a cylindrical member; and forming a thin film resistive heating layer by making an outer diameter of the polymer layer uniform by using a ring blading operation.

Abstract: A dielectric paste composition including: a plurality of inorganic dielectric particles, a binder, a solvent, and a halogenated hydrocarbon. Also disclosed is a method of forming a dielectric layer, a dielectric layer, and a device including the dielectric layer.

Abstract: A heating member for a fusing apparatus includes a resistive heating layer including a base polymer and an electroconductive filler dispersed in the base polymer, where the resistive heating layer generates heat by receiving electric energy, and where a storage modulus of the resistive heating layer is about 1.0 megapascal or greater.

Abstract: A heating member includes: a resistive heating layer which generates heat when supplied with electrical energy; a release layer as an outermost layer of the heating member and including a polymer; an intermediate layer disposed between the resistive heating layer and the release layer. The resistive heating layer includes a base polymer, and an electroconductive filler dispersed in the base polymer. The intermediate layer includes a polymer material being a same type as the base polymer of the resistive heating layer or the polymer of the release layer.

Abstract: A resistance heating composition including a silicon emulsion particle, a carbon nanotube, and an aqueous medium.

Abstract: A backlight unit that can perform local dimming, and has a structure for preventing light leakage and a cooling structure, and an image display apparatus employing the backlight unit. The backlight unit includes a light emitting arrangement adapted to radiate light and a plurality of light shielding guides adapted to divide the light emitting arrangement into a plurality of unit blocks, the unit blocks being adapted to provide local dimming, the light shielding guides being further adapted to prevent light from traveling from one of said unit blocks to another of said unit blocks.

Abstract: A method for manufacturing a dielectric ceramic, the method including: combining a ferroelectric compound having a perovskite structure and a halide to provide a mixture; heat treating the mixture; and removing the halide from the heat treated mixture to manufacture the dielectric ceramic.

Abstract: A dielectric paste composition for manufacturing a transparent dielectric layer, the dielectric paste composition including a cyanoresin, and a carbonate solvent. Also a method of forming a transparent dielectric layer, and a device including the transparent dielectric layer.

Abstract: A nano-sized phosphor including: sulfur, wherein the nano-sized phosphor has a mean largest particle diameter of less than 1 micrometer.

Abstract: An inorganic electroluminescence device includes a first electrode, a dielectric layer disposed on the first electrode, an inorganic light emitting layer disposed on the dielectric layer, and a second electrode disposed on the inorganic light emitting layer. The inorganic light emitting layer includes a fluorescent particle. The fluorescent particle includes a ZnS mother body and a nano-wire disposed on a surface of the ZnS mother body.

Abstract: An inorganic electroluminescence device including a first electrode and a second electrode disposed apart from each other, and a dielectric material layer disposed between the first and second electrodes. The dielectric material layer has a micro-tubular shape, and a light emitting layer is filled in the dielectric material layer.