Abstract: A water-cooled heat dissipation module assembly capable of cooling a power module of a vehicle driving inverter system using a battery or fuel cell. The water-cooled heat dissipation module assembly includes a housing unit provided in the form of a housing having an opening portion at least partially opened at one side thereof. The housing unit and at least a part of a rim region of the cooling unit are made of a plastic material, and the housing unit and the cooling unit are joined to each other by plastic welding using a laser.

Abstract: A gate driver includes a first scan signal generator configured to output a logic voltage for driving of a scan transistor through a plurality of stages connected in cascade, the scan transistor performing a switching operation to transfer a data voltage to a driving transistor of a pixel, a second scan signal generator configured to output a logic voltage for driving of a sensing transistor through the plurality of stages, the sensing transistor sensing deterioration of a light emitting element of the pixel, a light emission control signal generator configured to output a logic voltage for control of a light emission control transistor of the pixel through the plurality of stages, and an initialization voltage generator driven by logic voltages received from some nodes of the first scan signal generator based on the light emission control signal generator to supply an initialization voltage to the pixel.

Abstract: A method for refining waste plastic pyrolysis oil is provided, including: applying a voltage to a first mixed solution obtained by mixing waste plastic pyrolysis oil, washing water, and a demulsifier to dehydrate the first mixed solution to form a dehydrated first mixed solution; and hydrotreating a second mixed solution obtained by mixing the dehydrated first mixed solution dehydrated and a sulfur source to produce refined oil from which impurities have been removed, and a device related thereto. The method and device may prevent or minimize formation of an ammonium salt (NH4Cl) and/or prevent adhesion of impurity particles in a refining process of waste plastic pyrolysis oil containing impurities such as chlorine and nitrogen, and provides waste plastic pyrolysis oil having low content of impurities and olefins and excellent quality, and thus, may be used as a feedstock for blending with existing petroleum products or oil refining and petrochemical processes.

Abstract: An embodiment magnetorheological (MR) damper includes a stator including a solenoid coil to which a current is applicable, a rotor configured to rotate with respect to the stator, and an orifice disposed between the stator and the rotor, wherein the orifice is configured to allow fluids sealed in a first chamber and a second chamber defined by the stator and the rotor to communicate with each other.

Abstract: A method according to an embodiment of the present invention corresponds to a method for transmitting, by a gateway, a synchronization signal block (SSB) through a plurality of satellites, and may comprise the steps of: determining satellite identification SSBs for identifying a plurality of satellites, respectively; determining beam identification SSBs for identifying beams usable for the plurality of satellites, respectively; and controlling the satellite identification SSBs and the beam identification SSBs to be transmitted to the plurality of satellites, respectively, through a predetermined resource, wherein the satellite identification SSBs and each of the beam identification SSBs have different SSB indices from each other.

Abstract: A display device includes a display panel including a pixel that includes sub-pixels for emitting light in respective colors, and a driver configured to adjust a current amount flowing through the sub-pixels and to adjust an emission duty of the sub-pixels, drive one sub-pixel among the sub-pixels having a luminance with a first current amount and with a first emission duty when a color coordinate of an image expressed by the pixel is within a reference color space, and drive the one sub-pixel having the luminance with a second current amount that is greater than the first current amount and with a second emission duty that is less than the first emission duty when the color coordinate is outside of the reference color space.

Abstract: The present invention relates to a method for transmitting a synchronization signal block (SSB) through a plurality of satellites from a base station that can connect to a plurality of gateways, wherein the method may comprise the steps of: controlling transmission of first SSBs corresponding to the number of beams of each satellite through respective transmission beams in a first SSB cycle; determining a transmission beam of each of the satellites on the basis of a first measurement report for the respective beams received from a terminal; and controlling transmission of second SSBs for determining one combination including two or more gateways among the plurality of gateways in a second SSB cycle.

Abstract: A touch sensing method includes: generating respective oscillation signals having a resonant frequency, the respective oscillation signals being changeable according to a plurality of touch inputs applied to a first touch switch unit and a second touch switch unit, formed in a housing of an electronic device; analyzing the applied plurality of touch inputs, based on a change in the resonant frequency of the generated oscillation signals; and discerning and sensing a type of a touch operation according to a pattern of the plurality of touch inputs, based on results of the analyzing of the applied plurality of touch inputs.

Abstract: There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a 5 through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and 10 an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.

Abstract: There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a 5 through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and 10 an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.

Abstract: There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.

Abstract: A fan-out component package includes: a core member having a through-hole and including wiring layers and one or more connection vias; one or more first electronic components disposed in the through-hole; a first encapsulant covering at least portions of the core member and the first electronic components and filling at least a portion of the through-hole; a connection member disposed on the core member and the first electronic components and including one or more redistribution layers electrically connected to the wiring layers and the first electronic components; one or more second electronic components disposed on the connection member and electrically connected to the redistribution layers; and a second encapsulant disposed on the connection member and encapsulating the second electronic components, wherein an upper surface of the connection member and a lower surface of the second encapsulant are spaced apart from each other by a predetermined interval.

Abstract: A fan-out fingerprint sensor package includes a first connection member having a through-hole, a fingerprint sensor disposed in the through-hole, an encapsulant encapsulating at least portions of the first connection member and the fingerprint sensor, and a second connection member disposed on the first connection member and an active surface of the fingerprint sensor. The first connection member includes a distribution layer. The second connection member includes a first insulating layer disposed on the distribution layer and the active surface, a redistribution layer disposed on the first insulating layer, a first via connecting the redistribution layer to a connection pad of the fingerprint sensor, and a second via connecting the redistribution layer to the distribution layer. The first via passes through the first insulating layer and at least a portion of the encapsulant, and the second via passes through the first insulating layer.

Abstract: A fan-out sensor package includes: an image sensor chip including an integrated circuit (IC) for an image sensor having a first surface having first connection pads disposed thereon, a second surface opposing the first surface and having second connection pads disposed thereon, and through-silicon-vias (TSVs) penetrating between the first surface and the second surface and electrically connecting the first and second connection pads to each other and an optical portion disposed on the first surface of the IC for an image sensor and having a plurality of lens layers; an encapsulant covering at least portions of the second surface of the IC for an image sensor; a redistribution layer disposed on the encapsulant; and vias penetrating through at least portions of the encapsulant and electrically connecting the redistribution layer and the second connection pads to each other.

Abstract: A fan-out fingerprint sensor package includes a first connection member having a through-hole, a fingerprint sensor disposed in the through-hole, an encapsulant encapsulating at least portions of the first connection member and the fingerprint sensor, and a second connection member disposed on the first connection member and an active surface of the fingerprint sensor. The first connection member includes a distribution layer. The second connection member includes a first insulating layer disposed on the distribution layer and the active surface, a redistribution layer disposed on the first insulating layer, a first via connecting the redistribution layer to a connection pad of the fingerprint sensor, and a second via connecting the redistribution layer to the distribution layer. The first via passes through the first insulating layer and at least a portion of the encapsulant, and the second via passes through the first insulating layer.

Abstract: There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.

Abstract: An amusement park management system may include at least one portable terminal apparatus including identification information and providing the identification information using a preset wireless communications scheme, a plurality of repeaters receiving the identification information provided from the portable terminal apparatus and detecting distance information of the portable terminal apparatus providing the identification information, and a server apparatus receiving the distance information provided from the plurality of repeaters and detecting coordinate information of the portable terminal apparatus providing the identification information.