Patents by Inventor Min Keun KIM
Min Keun KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240190925Abstract: The present invention relates to a novel signal sequence peptide and a vector comprising a polynucleotide encoding same. The signal sequence peptide can induce a protein linked thereto to be secreted to the outside of a cell, and thus, when the signal sequence peptide is used or a recombinant microorganism transformed with the vector is used, the signal sequence peptide expresses a target protein and then secretes the target protein to the outside of a cell, thus enabling the target protein to exhibit the activity and function thereof.Type: ApplicationFiled: April 5, 2022Publication date: June 13, 2024Applicant: KOREA RESEARCH INSTITUTE OF BIOSCIENCE AND BIOTECHNOLOGYInventors: Dae Hee LEE, Seung Goo LEE, Tae Hyun KIM, Seong Keun KIM, Min Jeong CHOI, Seung Gyun WOO, Hyun Seung LIM, Seokjin OH
-
Publication number: 20240180043Abstract: Disclosed is a heterojunction semiconductor flexible substrate in which an epitaxial oxide thin film layer is hetero-bonded to a thinned silicon substrate using a metal layer, a manufacturing method thereof, and the heterojunction semiconductor flexible substrate can be applied to sensor, actuator, transducer, or micro electro mechanical systems (MEMS) device using high functionality of the epitaxial oxide thin film layer of high quality as well as an electronic and/or optical device.Type: ApplicationFiled: November 16, 2023Publication date: May 30, 2024Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Seung Hyub BAEK, Min Seok KIM, Ji-Soo JANG, Sunghoon HUR, Jungho YOON, Hyun-Cheol SONG, Seong Keun KIM, Ji-Won CHOI, Jin Sang KIM, Chong Yun KANG
-
Publication number: 20240164084Abstract: A semiconductor device includes: a substrate includes an active area; a first landing pad connected to the active area and disposed on the substrate; a second landing pad connected to the active area, and spaced apart from the first landing pad, wherein the second landing pad is disposed on the substrate; a first lower electrode disposed on the first landing pad and extending in a direction substantially perpendicular to the substrate; a second lower electrode disposed on the second landing pad and extending in the direction substantially perpendicular to the substrate; a dielectric layer extending along the first lower electrode and the second lower electrode; and an upper electrode disposed on the dielectric layer, wherein a first upper surface of the first landing pad is disposed below a second upper surface of the second landing pad with respect to a lower surface of the substrate.Type: ApplicationFiled: August 22, 2023Publication date: May 16, 2024Inventors: Do Keun LEE, Dong Wook KIM, Yang Doo KIM, Sang Wuk PARK, Min Kyu SUH, Geon Yeop LEE, Jung Pyo HONG
-
Publication number: 20240121924Abstract: A water-cooled heat dissipation module assembly capable of cooling a power module of a vehicle driving inverter system using a battery or fuel cell. The water-cooled heat dissipation module assembly includes a housing unit provided in the form of a housing having an opening portion at least partially opened at one side thereof. The housing unit and at least a part of a rim region of the cooling unit are made of a plastic material, and the housing unit and the cooling unit are joined to each other by plastic welding using a laser.Type: ApplicationFiled: August 4, 2022Publication date: April 11, 2024Inventors: Kwan Ho RYU, Jeong Keun LEE, Min Woo LEE, Ju Hyun SUN, Tae Keun PARK, Kang Wook PARK, Lee Cheol JI, Hyeok Chul YANG, Tae Heon KIM, Keun Jae LEE
-
Patent number: 11951832Abstract: A driver assistance system for vehicles, which is capable of preventing driver carelessness from causing a vehicle accident when a vehicle stops while traveling, includes a vehicle sensor unit configured to detect driver state data, a driver assistance unit operated to assist a driver when driver carelessness about vehicle driving is detected when a vehicle stops while traveling, and a control unit configured to identify whether the driver is careless based on the driver state data when the vehicle stops while traveling, and to operate the driver assistance unit when the driver carelessness is detected, preventing the vehicle from driving.Type: GrantFiled: October 21, 2022Date of Patent: April 9, 2024Assignees: Hyundai Motor Company, Kia CorporationInventors: Dong Hyeon Woo, Kyeong Keun Kim, Min Kyu Han, Da Som Yang
-
FREE MOTION HEADFORM IMPACT PERFORMANCE PREDICTION DEVICE AND A METHOD USING ARTIFICIAL INTELLIGENCE
Publication number: 20240104272Abstract: A free motion headform (FMH) impact performance prediction device using artificial intelligence includes a data processing processor configured to generate an image by extracting a pre-processed test target image, generated by pre-processing test target design data, using a pre-trained model and generate a pre-processed test target distance value by pre-processing the test target design data. The FMH input performance prediction device also includes a machine learning processor configured to concatenate the image generated by extraction on the basis of the pre-trained model and the pre-processed test target distance value and to predict impact performance using a neural network in which parameters are updated by learning based on an image obtained by pre-processing existing design data and existing impact amount data corresponding to the existing design data. The FMH input performance prediction device further includes an output processor configured to output a value learned by the machine learning processor.Type: ApplicationFiled: May 25, 2023Publication date: March 28, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, SOONCHUNHYANG UNIVERSITY INDUSTRY ACADEMY COOPERATION FOUNDATIONInventors: Ji Seob Park, Ji Ah Kim, Min Ho Cho, Hae Young Jeon, Seong Keun Park, Ji Eun Lee, Si Hyeon Yu -
Publication number: 20240081146Abstract: An organic light emitting diode (OLED) includes an emissive layer with at least one emitting part includes at least one emitting material layer, a first electron transport layer and a second electron transport layer disposed sequentially between two facing electrodes, wherein the first electron transport layer includes a first electron transporting material of a benzimidazole-based compound substituted with at least one spiro-structured fluorenyl group and the second electron transport layer includes a second electron transporting material of a benzimidazole-based compound substituted with at least one anthracenyl group. The first electron transport including the first electron transport material with excellent thermal stability is disposed adjacently to the emitting material layer so that the OLED can maintain good luminescent intensity in an environment of high temperature and implement beneficial luminous properties.Type: ApplicationFiled: July 6, 2023Publication date: March 7, 2024Inventors: Yu-Jeong LEE, Jung-Keun KIM, Mi-Young HAN, Min-Hyeong HWANG
-
Publication number: 20220011899Abstract: A touch sensing method includes: generating respective oscillation signals having a resonant frequency, the respective oscillation signals being changeable according to a plurality of touch inputs applied to a first touch switch unit and a second touch switch unit, formed in a housing of an electronic device; analyzing the applied plurality of touch inputs, based on a change in the resonant frequency of the generated oscillation signals; and discerning and sensing a type of a touch operation according to a pattern of the plurality of touch inputs, based on results of the analyzing of the applied plurality of touch inputs.Type: ApplicationFiled: September 24, 2020Publication date: January 13, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Min Keun KIM, Ho Kwon YOON, Bang Chul KO, Joo Yul KO
-
Patent number: 11037971Abstract: There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a 5 through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and 10 an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.Type: GrantFiled: April 9, 2020Date of Patent: June 15, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yong Ho Baek, Jung Hyun Cho, Min Keun Kim, Young Sik Hur, Tae Hee Han
-
Publication number: 20200235154Abstract: There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a 5 through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and 10 an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.Type: ApplicationFiled: April 9, 2020Publication date: July 23, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yong Ho BAEK, Jung Hyun CHO, Min Keun KIM, Young Sik HUR, Tae Hee HAN
-
Patent number: 10644046Abstract: There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.Type: GrantFiled: December 1, 2017Date of Patent: May 5, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yong Ho Baek, Jung Hyun Cho, Min Keun Kim, Young Sik Hur, Tae Hee Han
-
Publication number: 20190287938Abstract: A fan-out component package includes: a core member having a through-hole and including wiring layers and one or more connection vias; one or more first electronic components disposed in the through-hole; a first encapsulant covering at least portions of the core member and the first electronic components and filling at least a portion of the through-hole; a connection member disposed on the core member and the first electronic components and including one or more redistribution layers electrically connected to the wiring layers and the first electronic components; one or more second electronic components disposed on the connection member and electrically connected to the redistribution layers; and a second encapsulant disposed on the connection member and encapsulating the second electronic components, wherein an upper surface of the connection member and a lower surface of the second encapsulant are spaced apart from each other by a predetermined interval.Type: ApplicationFiled: August 31, 2018Publication date: September 19, 2019Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jong Rok KIM, Min Keun KIM, Yong Ho BAEK, Young Sik HUR, Jung Chul GONG
-
Patent number: 10395088Abstract: A fan-out fingerprint sensor package includes a first connection member having a through-hole, a fingerprint sensor disposed in the through-hole, an encapsulant encapsulating at least portions of the first connection member and the fingerprint sensor, and a second connection member disposed on the first connection member and an active surface of the fingerprint sensor. The first connection member includes a distribution layer. The second connection member includes a first insulating layer disposed on the distribution layer and the active surface, a redistribution layer disposed on the first insulating layer, a first via connecting the redistribution layer to a connection pad of the fingerprint sensor, and a second via connecting the redistribution layer to the distribution layer. The first via passes through the first insulating layer and at least a portion of the encapsulant, and the second via passes through the first insulating layer.Type: GrantFiled: March 15, 2018Date of Patent: August 27, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Min Keun Kim, Young Sik Hur, Yong Ho Baek, Tae Hee Han
-
Publication number: 20190181172Abstract: A fan-out sensor package includes: an image sensor chip including an integrated circuit (IC) for an image sensor having a first surface having first connection pads disposed thereon, a second surface opposing the first surface and having second connection pads disposed thereon, and through-silicon-vias (TSVs) penetrating between the first surface and the second surface and electrically connecting the first and second connection pads to each other and an optical portion disposed on the first surface of the IC for an image sensor and having a plurality of lens layers; an encapsulant covering at least portions of the second surface of the IC for an image sensor; a redistribution layer disposed on the encapsulant; and vias penetrating through at least portions of the encapsulant and electrically connecting the redistribution layer and the second connection pads to each other.Type: ApplicationFiled: April 20, 2018Publication date: June 13, 2019Inventors: Jong Rok KIM, Yong Ho BAEK, Jung Hyun CHO, Min Keun KIM, Jung Chul GONG, Young Sik HUR
-
Publication number: 20180307890Abstract: A fan-out fingerprint sensor package includes a first connection member having a through-hole, a fingerprint sensor disposed in the through-hole, an encapsulant encapsulating at least portions of the first connection member and the fingerprint sensor, and a second connection member disposed on the first connection member and an active surface of the fingerprint sensor. The first connection member includes a distribution layer. The second connection member includes a first insulating layer disposed on the distribution layer and the active surface, a redistribution layer disposed on the first insulating layer, a first via connecting the redistribution layer to a connection pad of the fingerprint sensor, and a second via connecting the redistribution layer to the distribution layer. The first via passes through the first insulating layer and at least a portion of the encapsulant, and the second via passes through the first insulating layer.Type: ApplicationFiled: March 15, 2018Publication date: October 25, 2018Inventors: Min Keun KIM, Young Sik HUR, Yong Ho BAEK, Tae Hee HAN
-
Publication number: 20180294299Abstract: There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.Type: ApplicationFiled: December 1, 2017Publication date: October 11, 2018Inventors: Yong Ho BAEK, Jung Hyun CHO, Min Keun KIM, Young Sik HUR, Tae Hee HAN
-
Publication number: 20150369902Abstract: An amusement park management system may include at least one portable terminal apparatus including identification information and providing the identification information using a preset wireless communications scheme, a plurality of repeaters receiving the identification information provided from the portable terminal apparatus and detecting distance information of the portable terminal apparatus providing the identification information, and a server apparatus receiving the distance information provided from the plurality of repeaters and detecting coordinate information of the portable terminal apparatus providing the identification information.Type: ApplicationFiled: February 16, 2015Publication date: December 24, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Min Keun KIM, Sang Hoon Kim