Abstract: A semiconductor package includes a lower structure and an upper structure on the lower structure. The lower structure includes a first substrate, a first through-electrode penetrating the first substrate in a first direction, a first pad connected to the first through-electrode, and a first protective layer surrounding the first pad. The upper structure includes a second substrate, a second through-electrode penetrating the second substrate in the first direction, a second pad connected to the second through-electrode, and a second protective layer surrounding the second pad. The second pad is offset from the first pad in a second direction crossing the first direction. The first pad has a first portion not overlapping the second pad. A first barrier pattern is disposed between the first portion and the second protective layer. A portion of the first barrier pattern is disposed between the first pad and the second pad.

Abstract: A display device including a display panel, in which a display region including a plurality of organic light emitting devices and a non-display region adjacent to the display region are defined, a protection film disposed below the display panel, a first adhesive layer contacting a bottom surface of the protection film, a supporting layer comprising a metallic material, at least overlapping the entire display region, and contacting the first adhesive layer, an input-sensing unit disposed on the display panel, an anti-reflection unit disposed on the input-sensing unit, and a window panel disposed on the input-sensing unit.

Abstract: Provided is a lighting assembly including an upper body that defines a top surface thereof; a lower body coupled to a lower portion of the upper body and defining a bottom surface thereof; a light diffusion member coupled to the upper body and the lower body, the light diffusion member including a first surface facing the upper body, a second surface facing the lower body, and a third surface that has a curved surface and is exposed to an outside of the light diffusion member; a light guide made of a light transmissive material, the light guide being in contact with the light diffusion member; and a light-emitting diode (LED) disposed to face a surface of the light guide.

Abstract: A semiconductor package includes a first die having signal and dummy regions, and a second die on the first die. The first die includes first dummy patterns arranged in a first direction on the dummy region, second dummy patterns on the dummy region and between the first dummy patterns, a first dielectric layer on the first and second dummy patterns, and first pads extending through the first dielectric layer and coupled to the first dummy patterns. The second die includes second pads on the dummy region, and third pads on the dummy region. On an interface between the first and second dies, the first pads are in contact with the second pads. The first dielectric layer is between the second dummy patterns and the third pads. The first dummy patterns are connected to a ground circuit or power circuit of the first die.

Abstract: Provided is a flexible heater. The flexible heater includes a first electrode, a second electrode arranged to be spaced apart from the first electrode, and a dielectric gel layer arranged between the first electrode and the second electrode and generating heat in response to an alternating voltage applied thereto.

Abstract: Provided is a lighting assembly including an upper body that defines a top surface thereof; a lower body coupled to a lower portion of the upper body and defining a bottom surface thereof; a light diffusion member coupled to the upper body and the lower body, the light diffusion member including a first surface facing the upper body, a second surface facing the lower body, and a third surface that has a curved surface and is exposed to an outside of the light diffusion member; a light guide made of a light transmissive material, the light guide being in contact with the light diffusion member; and a light-emitting diode (LED) disposed to face a surface of the light guide.

Abstract: A display device including a display panel, in which a display region including a plurality of organic light emitting devices and a non-display region adjacent to the display region are defined, a protection film disposed below the display panel, a first adhesive layer contacting a bottom surface of the protection film, a supporting layer comprising a metallic material, at least overlapping the entire display region, and contacting the first adhesive layer, an input-sensing unit disposed on the display panel, an anti-reflection unit disposed on the input-sensing unit, and a window panel disposed on the input-sensing unit.

Abstract: Provided are a thinner composition, which may be generally used for an extreme ultraviolet (EUV) photoresist as well as KrF and ArF photoresists and exhibits improved performance in reduced resist coating (RRC) and edge bead removal (EBR), and which has an excellent pipe cleaning capability, and a method of treating a substrate surface by using the thinner composition. The thinner composition includes a C2-C4 alkylene glycol C1-C4 alkyl ether acetate, a C2-C3 alkylene glycol C1-C4 alkyl ether, and a cycloketone.

Abstract: A soft haptic device and a local control method are disclosed. The soft haptic device includes a soft actuator. The soft actuator includes an electroactive polymer film, a patterned electrode, and a dielectric liquid injected between the electroactive polymer film and the patterned electrode. The soft actuator generates a reconfigurable shape such that a form of an output shape and a number of outputtable shapes are changed depending on the number of electrodes constituting the patterned electrode, a shape of the electrodes, and an arrangement of the electrodes.

Abstract: A glass article includes a central layer including a first crystalline phase having a first coefficient of thermal expansion and a surface layer surrounding an entirety of the central layer and including a second crystalline phase having a second coefficient of thermal expansion smaller than the first coefficient of thermal expansion. Accordingly, the strength of the glass article may be improved.

Abstract: An apparatus for manufacturing a glass article includes a chamber defining an inner space that accommodates a molten salt for molding and chemical strengthening the glass article, a first electrode disposed in the inner space of the chamber and in contact with the molten salt, a second electrode disposed in the inner space of the chamber, in contact with the molten salt, and facing the first electrode, and a power supply connected to the first electrode and the second electrode.

Abstract: Disclosed is a semiconductor package comprising lower and upper structure. The lower structure includes a first semiconductor substrate, first through vias vertically penetrating the first semiconductor substrate, first signal pads connected to the first through vias, first dummy pads between the first signal pads and electrically separated from the first through vias, and a first dielectric layer surrounding the first signal pads and the first dummy pads. The upper structure includes a second semiconductor substrate, second signal pads and second dummy pads, and a second dielectric layer surrounding the second signal pads and the second dummy pads. The first signal pad is in contact with one of the second signal pads. The first dummy pad is in contact with one of the second dummy pads. A first interval between the first dummy pads is 0.5 to 1.5 times a second interval between the first signal pads.

Abstract: A display device A display device includes a display panel including a plurality of pixel rows and a plurality of pixel columns arranged to display an image; a data driver comprising a plurality of source drive integrated circuits (ICs) respectively connected to one or more pixel columns among the plurality of pixel columns and configured to supply a data signal to the plurality of pixel rows; and a timing controller configured to supply image data and a data control signal to the data driver, wherein the timing controller includes a general purpose input-output (GPIO) pin connected to digital block power down enable (DBDEN) pins provided in each of the plurality of source drive ICs in a point-to-multipoint way and outputs a DBDEN signal disabling to at least some of the plurality of source drive ICs.

Abstract: Disclosed is a semiconductor package comprising lower and upper structure. The lower structure includes a first semiconductor substrate, first through vias vertically penetrating the first semiconductor substrate, first signal pads connected to the first through vias, first dummy pads between the first signal pads and electrically separated from the first through vias, and a first dielectric layer surrounding the first signal pads and the first dummy pads. The upper structure includes a second semiconductor substrate, second signal pads and second dummy pads, and a second dielectric layer surrounding the second signal pads and the second dummy pads. The first signal pad is in contact with one of the second signal pads. The first dummy pad is in contact with one of the second dummy pads. A first interval between the first dummy pads is 0.5 to 1.5 times a second interval between the first signal pads.

Abstract: A manufacturing method of a window includes: providing a substrate; placing a plurality of masks above the substrate; adjusting positions of the plurality of masks to expose a target area of the substrate; spraying a coating material to the target area of the substrate exposed by the plurality of masks; and heat-treating the substrate and the coating material sprayed on the substrate to form the window.

Abstract: A method of manufacturing a window includes: preparing a glass substrate laminate which includes preparing a base substrate, alternately disposing glass substrates and adhesive layers on the base substrate, and disposing a cover substrate on the glass substrates and the adhesive layers alternately disposed; and cutting the glass substrate laminate, where the adhesive layers include a potassium nitrate (KNO3) particle and an adhesive resin. This method makes it possible to effectively manufacture an ultra-thin glass substrate used for a window.

Abstract: A window reinforcing apparatus includes a spray part which sprays a solution downward, a plurality of masks which are disposed below the spray part and move in a first direction, a storage part which is disposed above the spray part, stores the solution, and provides the solution to the spray part, and a stage disposed below the masks.

Abstract: An electronic device is provided. The electronic device includes a first circuit board, an antenna member disposed to face one surface of the first circuit board, an electronic module disposed between the first circuit board and the antenna member and including a plurality of contact protrusions disposed to face the antenna member, and a plurality of contact members disposed on the antenna member and configured to electrically contact one of the plurality of contact protrusions. As the antenna member generates an induced current in reaction to an external electrical signal or an external electromagnetic field, the electronic module may be configured to supply power using the induced current generated by the antenna member.

Abstract: A semiconductor device includes a first chip and a second chip stacked on the first chip. The first chip includes a first substrate, a first upper pad on an upper surface of the first substrate, a first upper insulating layer surrounding a lower portion of the first upper pad and a sacrificial layer surrounding an upper portion of the first upper pad. The second chip includes a second substrate, a second upper pad on an upper surface of the second substrate and a second upper insulating layer surrounding the second upper pad, wherein a thickness of the second upper pad is less than a thickness of the first upper pad.

Abstract: A semiconductor package includes a first semiconductor chip including a first semiconductor layer, a first through-electrode passing through the first semiconductor layer in a vertical direction, and a first bonding pad connected to the first through-electrode, and a second semiconductor chip including a second semiconductor layer on the first semiconductor chip, a wiring structure between the second semiconductor layer and the first semiconductor chip, a wiring pad connected to the wiring structure below the wiring structure, and a second bonding pad connected to the wiring pad below the wiring pad and in contact with the first bonding pad, wherein the second bonding pad includes a protrusion protruding toward the wiring pad.