Abstract: A method of cleaning a substrate processing apparatus that provides a processing space for accommodating a process wafer and includes a substrate support including an internal electrode, the method includes disposing a cover wafer on an upper surface of the substrate support; fixing the cover wafer to the substrate support using the internal electrode of the substrate support; plasma cleaning the processing space; and removing a current of the internal electrode and removing the cover wafer, wherein the cover wafer includes silicon carbide (SiC), a lower surface of the cover wafer is in contact with the substrate support, and an average roughness of an upper surface of the cover wafer is less than an average roughness of an upper surface of the process wafer.

Abstract: Provided is an object treatment apparatus including a cabinet having an inlet formed in a front surface thereof, a door coupled to the cabinet to open and close the inlet, a first chamber located inside the cabinet and accommodating an object put through the inlet, a second chamber located inside the cabinet and defining a space separated from the first chamber, and a circulator disposed in the second chamber and circulating air of the first chamber, and in this case, the circulator includes a connection duct including a circulating fan circulating air and an air processor processing air, a first flow path including the connection duct and communicating with the first object processing room to circulate air of first object processing room therethrough, and a second flow path including the connection duct and communicating with the second object processing room to circulate air of the second object processing room.

Abstract: A bracket includes a first member having one end joined to a first surface of an enclosure including an antenna, a second member having one end joined to a second surface of the enclosure, and a third member including a first slot joined to another end of the first member and a second slot joined to another end of the second member. In the bracket, the another end of the first member is guided along and moved in the first slot, and the another end of the second member is guided along and moved in the second slot.

Abstract: A bracket includes a first member having one end joined to a first surface of an enclosure including an antenna, a second member having one end joined to a second surface of the enclosure, and a third member including a first slot joined to another end of the first member and a second slot joined to another end of the second member. In the bracket, the another end of the first member is guided along and moved in the first slot, and the another end of the second member is guided along and moved in the second slot.