Patents by Inventor Min-kyun SUN

Min-kyun SUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for testing semiconductor package
    Patent number: 10627441
    Abstract: A semiconductor package test apparatus includes a handler, a test board, and a board temperature controller. The handler includes a first heater and cooler to heat and cool a semiconductor package. The test board tests the semiconductor package, and includes main test board having a test socket and a base test board spaced from the main test board. The board temperature controller includes a second heater and cooler to heat and cool the main test board.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: April 21, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sin Yang, Min-kyun Sun
  • APPARATUS FOR TESTING SEMICONDUCTOR PACKAGE
    Publication number: 20180038905
    Abstract: A semiconductor package test apparatus includes a handler, a test board, and a board temperature controller. The handler includes a first heater and cooler to heat and cool a semiconductor package. The test board tests the semiconductor package, and includes main test board having a test socket and a base test board spaced from the main test board. The board temperature controller includes a second heater and cooler to heat and cool the main test board.
    Type: Application
    Filed: April 10, 2017
    Publication date: February 8, 2018
    Inventors: Dong-sin YANG, Min-kyun SUN