Abstract: An aqueous cleaning and adhesive stripping system for monocrystalline silicon wafers and its adhesive stripping process are provided. The system includes a basic driving mechanism configured for driving. The basic driving mechanism includes a stable base plate, a cleaning table fixedly connected to a top of the stable base plate. By arranging two cleaning installation mechanisms inside the basic driving mechanism, and with the cooperation of an electric telescopic rod and a gear cylinder, the two cleaning installation mechanisms can operate alternately, one capable of cleaning the silicon wafers and the other facilitating replacement by workers.