Abstract: This disclosure discloses a foldable panel, including a flexible display panel and a driver IC, the driver IC is arranged at a bonding end of a flexible substrate of the panel, and the bonding end is bent backward to the contrary direction of a light side of the panel, so that the driver IC is located at back side of the substrate; a thin film wiring layer connected between an active area and the driver IC is also arranged on the substrate, conductive wires are disposed on the thin film wiring layer for connecting the panel and the driver IC. This disclosure also discloses a method of manufacturing the foldable panel. By using the method, the active area proportion of the panel can be the maximum, this disclosure also ensures the circuit having good bending performance and avoids the use of COF and the risk of fracturing wires.