Abstract: A polypropylene resin composition for molding material, which is excellent in an appearance of weld line and an appearance of tiger stripe and is used for automobile exterior parts and an automobile exterior part comprising the same, are provided.

Abstract: In a DPP-type tracking error signal (TE signal), an offset caused by the difference between the reflectance of a main-beam irradiated part and the reflectance of side-beam irradiated parts is appropriately compensated without individual normalization of an MPP signal and an SPP signal. An analog signal processing unit 40 produces the MPP, MPI, SPP, and SPI signals on the basis of the amounts of received reflected light of the main beam and side beams detected by a photo-detection unit 130, produces a DPP-type TE signal and a CE signal on the basis of the MPP and/or SPP signal, and outputs the analog signals of the TE, CE, MPI, and SPI signals.

Abstract: The present invention provides a resin composition suitable for molding a microscopic structure that has small cure shrinkage, good mold transfer properties and excellent properties for post-processing such as polishing processing and laser processing. Such a resin is a thermosetting resin composition comprising 95 to 35 wt % of a thermosetting resin and 5 to 65 wt % of organic filler having a particle size of 10 ?m or less. From such a resin, an ink ejecting apparatus having a microscopic structure, for example, a nozzle of a diameter of 30 ?m, is integrally molded.

Abstract: A method and a device for discharging a liquid specimen capable of controlling the sizes of substances in the liquid specimen. The device includes a cylinder having a discharge port for a liquid specimen and a supply port for the liquid specimen and discharging means for discharging the liquid specimen, and a means for generating a non-uniform electric field in an internal space of the cylinder is provided in the cylinder. Using this device for discharging a liquid specimen, the sizes of the target substances in the liquid specimen to be discharged can be controlled by discharging the liquid specimen while generating an appropriate non-uniform electric field in the internal space of the cylinder.

Abstract: The present invention provides a resin composition suitable for molding a microscopic structure that has small cure shrinkage, good mold transfer properties and excellent properties for post-processing such as polishing processing and laser processing. Such a resin is a thermosetting resin composition comprising 95 to 35 wt % of a thermosetting resin and 5 to 65 wt % of organic filler having a particle size of 10 &mgr;m or less. From such a resin, an ink ejecting apparatus having a microscopic structure, for example, a nozzle of a diameter of 30 &mgr;m, is integrally molded.

Abstract: The present invention provides a method that allows ultra-precisely bonding by which a complete sealingly bonded molded article can be produced in a simple manner. This method includes (1) fixing an injection molded article (a) at a position (predetermined bonding position) formed with a mold; (2) mounting and moving a molded article (b) to be bonded to the injection molded article (a) to the predetermined bonding position within the mold; (3) positioning the molded article (b) at the predetermined bonding position; and (4) closing the mold for bonding.

Abstract: A polydisperse propylene polymer characterized by being produced by polymerizing a propylene monomer or a mixed monomer of propylene and other olefin(s) by a multistage polymerization wherein the polymerization conditions are stepwise changed in the presence of a supported metallocene catalyst having a transition metal compound and an aluminoxane or a reaction product thereof supported on a finely particulate support, and an organoaluminum compound as a scavenger, and by having a ratio of a weight-average molecular weight to a number-average molecular weight (Mw/Mn) of 4.0 or higher, a melting point (Tm) of 165° C. or lower and a difference between the melting point (Tm) and a heat distortion temperature (HDT) of 30° C. or less.

Abstract: The invention relates to a polyolefin-based resin composition that is in an amount of 100 wt % in total. This composition includes (a) 60-66 wt % of a crystalline propylene-ethylene block copolymer, (b) 12-20 wt % of an ethylene-propylene copolymer rubber, and (c) 18-25 wt % of an inorganic filler. The block copolymer contains a first segment of a homopolymer of propylene and a second segment of a copolymer of propylene and ethylene, and has an isotactic pentad tacticity of at least 0.96. The ratio of the weight average molecular weight of the block copolymer to the number average molecular weight thereof is not greater than 6. The copolymer rubber contains therein 50-60 wt % of ethylene, and has a Mooney viscosity of from 45 to 55 at 125° C. The inorganic filler is one selected from the group consisting of a talc, a first combination of the talc and a glass fiber, and a second combination of the talc and a whisker. The talc has an average particle diameter of not greater than 2 &mgr;m.

Abstract: Disclosed is a process for producing olefin polymers or copolymers which can freely regulates the molecular weight of the polymers or copolymers as well as novel olefin polymers or copolymers excellent in rigidity, heat-resisting property and transparency, moldings and compositions thereof which find a wide variety of applications in versatile industrial parts including containers, films, sheets, filaments or fibers, featured by (1) a process for producing olefin polymers or copolymers by the aid of a catalyst comprised predominantly of the compounds: (A) a transition metal compound of the formula: Q(C5H4−mR1m)(C5H4−nR2n)MXY, (B) an aluminoxane, (C) a fine particulate carrier, and (D) an organoaluminum compound; (2) olefin polymers or copolymers characterized by (a) a specific ratio of isotactic pentad, (b) 2,1- and 1.

Abstract: The present invention provides propylene/ethylene random copolymers characterized in that: an ethylene content (Ew) is 0.1-10 wt %, a relationship between an isolated ethylene content (E1) and the ethylene content (Ew) is represented by the following equation E1>0.85−0.01 Ew 2,1- and 1,3-propylene units present in a polymer chain are 0-1 mol %, a weight average molecular weight (Mw) is in the range of 40,000-1,000,000, and a ratio (Mw/Mn) of the weight average molecular weight (Mw) to a number average molecular weight(Mn) is in the range of 1.5-3.8. The copolymers are suitable for a base resin for a molding material for the production of a wide variety of molded articles which are high in randomness and excellent in stiffness, heat resistance and transparency.

Abstract: Disclosed is a polypropylene composition excellent in balance of low temperature impact-strength, rigidity, heat resistance and transparency, which is featured by comprising 20-95% by weight of a polypropylene defined in the following [I] and 5-80% by weight of a propylene-&agr;-olefin copolymer defined in the following [II]: [I] a polypropylene featured by having: (1) a ratio of isotactic pentad (mmmm) of 0.900-0.949, (2) the 2,1- and 1,3-propylene units in the polymer chain in the amount of 0-1 mole %, (3) a weight average molecular weight (Mw) of 40,000-1,000,000, (4) a ratio of a weight average molecular weight (Mw) to a number average molecular weight (Mn), i.e. (Mw)/(Mn) of 1.5-3.8, and (5) in case of elevating the temperature of o-dichlorobenzene continuously or stepwise up to given temperatures to measure the amount of eluted polypropylene at each temperature, the position of a main elution peak is 95-110° C.

Abstract: The invention relates to a polyolefin-based resin composition that is in an amount of 100 wt % in total. This composition includes (a) 60-66 wt % of a crystalline propylene-ethylene block copolymer, (b) 12-20 wt % of an ethylene-propylene copolymer rubber, and (c) 18-25 wt % of an inorganic filler. The block copolymer contains a first segment of a homopolymer of propylene and a second segment of a copolymer of propylene and ethylene, and has an isotactic pentad tacticity of at least 0.96. The ratio of the weight average molecular weight of the block copolymer to the number average molecular weight thereof is not greater than 6. The copolymer rubber contains therein 50-60 wt % of ethylene, and has a Mooney viscosity of from 45 to 55 at 125° C. The inorganic filler is one selected from the group consisting of a talc, a first combination of the talc and a glass fiber, and a second combination of the talc and a whisker. The talc has an average particle diameter of not greater than 2 &mgr;m.

Abstract: A rotary body of hard material with a plastic supporter and a method of manufacturing therefor, which essentially comprises a coating film coated with the rotary body and removed after molding so as to make a clearance between the rotary body and the supporter, so that rotation of the rotary body may be allowed smoothly. The method of this invention defines steps of molding, coating of film and removing of the film so as to obtain rotation of rotary body relative to the plastic supporter.

Abstract: A diaphragm for an electroacoustic transducer comprising stratiform mineral of layers into which a hardener or an agent for facilitating hardening is adsorbed between the layers, thermosetting resin monomer, and carbonfibers which constitute a composite material which is formed under heat and pressure. The diaphragm is increased in rigidity which is required as physical properties therefor and is easy in forming.

Abstract: A method of and apparatus for controlling automatic soldering system in which respective units of the automatic soldering system are controlled preparatorily to reduce the waiting time until main driving to zero. In the soldering driving time, the temperature of the work itself is precisely controlled to the predetermined value by means of directly measuring the temperature of the work and controlling the preheater to bring the soldering characteristic in the next soldering step into the most optimal value in compliance with the size and the like of the work to be soldered.