Abstract: A bag making machine for manufacturing bags from an elongated film having print patterns repeatedly printed on one surface or two surfaces at a print pitch corresponding to a predetermined number of bags includes a processing unit configured to process the film for each length corresponding to the predetermined number of bags, a moving mechanism configured to move the processing unit, a shooting device, and an image processing device. The shooting device includes not less than one line sensor installed with a longitudinal direction of the line sensor extending along the widthwise direction of the film and obtains a linear image extending throughout a width of the film for each shooting operation. The image processing device sequentially receives the linear images from the shooting device and detects the actual length of the predetermined number of bags of the film based on an image extending throughout the width of the film.

Abstract: A structure of solder joint structure formed of zinc-based lead-free solder having excellent characteristics is disclosed. Between a first lead-free solder layer and a soldering pad, the following layers are formed: a tin-copper alloy layer formed on the pad; a first alloy layer formed of second lead-free layer of which main ingredients are tin and silver; and a second alloy layer formed between the first alloy layer and the first lead-free solder. This structure allows forming the solder joint structure formed of zinc-based lead-free solder having high joint strength.

Abstract: A structure of solder joint structure formed of zinc-based lead-free solder having excellent characteristics is disclosed. Between a first lead-free solder layer and a soldering pad, the following layers are formed: a tin-copper alloy layer formed on the pad; a first alloy layer formed of second lead-free layer of which main ingredients are tin and silver; and a second alloy layer formed between the first alloy layer and the first lead-free solder. This structure allows forming the solder joint structure formed of zinc-based lead-free solder having high joint strength.

Abstract: A structure of solder joint structure formed of zinc-based lead-free solder having excellent characteristics is disclosed. Between a first lead-free solder layer and a soldering pad, the following layers are formed: a tin-copper alloy layer formed on the pad; a first alloy layer formed of second lead-free layer of which main ingredients are tin and silver; and a second alloy layer formed between the first alloy layer and the first lead-free solder. This structure allows forming the solder joint structure formed of zinc-based lead-free solder having high joint strength.

Abstract: A floor heating panel made of wood, a heating element on the top of the wood, a covering layer placed over the heating element to cover the entire top surface of the wood, and a cushioning layer beneath the wood. The wood has on its bottom surface a row of slits to allow the wood to resiliently flex to a limited extent. The floor heating panel has two connectors that are slidably along one dimension of the heating panel between inner and outer stop elements.