Abstract: An input unit 21 receives the input of conventional image-quality playback data adapted to terrestrial digital television broadcast and high image-quality playback data. A combining unit 22 combines the conventional image-quality playback data and the high image-quality playback data. A data configuration unit 23, on the basis of combined data obtained by combining the conventional image-quality playback data and the high image-quality playback data by means of the combining unit 22, generates data for one polarized antenna transmission and data for another polarized antenna transmission.

Abstract: An input unit 21 receives the input of conventional image-quality playback data adapted to terrestrial digital television broadcast and high image-quality playback data. A combining unit 22 combines the conventional image-quality playback data and the high image-quality playback data. A data configuration unit 23, on the basis of combined data obtained by combining the conventional image-quality playback data and the high image-quality playback data by means of the combining unit 22, generates data for one polarized antenna transmission and data for another polarized antenna transmission.

Abstract: An IC-card module (A) to be incorporated in an IC-card (B) includes a substrate (1), an IC chip (2) mounted on the substrate, and a protective member (4) bonded to the substrate (1) to cover the IC chip (2). A clearance (S) is provided between the protective member (4) and the IC chip (2) for avoiding direct contact of the protective member (4) with the IC chip (2). The clearance (S) is loaded with a filler (6) having a low modulus of elasticity, as required. The protective member (4) includes a reinforcing member (8).

Abstract: In the method of manufacturing an IC module (1) including a resin packaging process using upper and lower dies (5) for forming a cavity (50) while the dies are clamped, the resin packaging process is carried out by introducing a melted resin while a substrate (2) on which an IC chip (3) is placed and a coil (20A) which has a doughnut shape when observed from above and is flattened as a whole are housed in the cavity (50). When a substrate (2) on which an antenna coil (20) is patterned is to be packaged with a resin, the resin packaging process is carried out by forming a spacer (28) having an equal and almost equal height to the height of the cavity (50) on the substrate (2), housing it in the cavity (50), and introducing a melted resin. Instead of forming the spacer (28) on the substrate (2), a substrate (2) housed in a cavity (50) may be sucked. The manufacturing method can provide good protection of an IC chip and an antenna coil.

Abstract: A manufacturing method includes the steps of integrally fabricating a plurality of circuit elements (41) on a substrate (1a), forming electrode bumps (11) on electrode pads (11b) conducting with circuit elements (41), forming a scribe line or a scribe line mark (21a) at a prescribed position of substrate (1a), and sticking an anisotropically conductive film (30) to cover each of the electrode bumps (11) and the scribe line or the scribe line mark (21a). The step of forming the electrode bumps (11) and the step of forming the scribe line or the scribe line mark (21a) are performed simultaneously. The electrode bumps (11) and the scribe line or the scribe line mark (21a) are preferably formed of gold. By the manufacturing method, even when an anisotropically conductive film is stuck on a semiconductor wafer having a plurality of circuit elements formed, the circuit elements can be diced as desired.

Abstract: An IC module incorporated in an IC-card includes a substrate, an IC chip mounted on the substrate, and an antenna coil electrically connected to the IC chip. The antenna coil includes a conductive film which is patterned on a surface of the substrate, thereby facilitating fabrication of the IC module while realizing a thickness reduction of the IC module.

Abstract: A disc brake that is less likely to squeak during braking. A guide portion on a torque member has a point at which the force counteracting the braking force is produced. This point is disposed nearer to a line pass through the center of the disc than is a parallel line passing the center of the brake cylinder and extending tangentially to a circle concentric with the disc. Thus, due to the tangential force produced during braking, angular moment is produced in the same direction as the angular moment produced due to the braking force. The sum of these two angular moments act to restrain the rotation of the pads. The movement of the pads are thus strongly restrained, so that they are less likely to vibrate. Thus, it is possible to prevent squeaking of the brake resulting from vibrations of the pads.

Abstract: An integrated circuit and its using method. The integrated circuit having a serial-parallel converter and a driver unit is further provided with a setting circuit which is responsive to a selection signal value for setting the number of shift stages of the serial-parallel converter. When serial data consisting of a number of bits exceeding the setup stage count is input, the serial-parallel converter outputs data as overflow serial data in order starting at the first input bit of the serial data. A plurality of the integrated circuits are cascaded so that overflow serial data output from the integrated circuit at a preceding stage is supplied to the integrated circuit at the following stage as serial data to be converted into parallel data. The same selection signal value is supplied to each of the integrated circuits.

Abstract: A liquid crystal display device including a liquid crystal display panel having an electrode terminal, a circuit board having a driving circuit for the liquid crystal panel and a circuit terminal portion, and a connection wiring which is held in a flexible film and connects the electrode terminal with the circuit terminal portion, wherein the circuit terminal portion is located on the circuit board at a predetermined distance from a side edge of the circuit board; and the flexible film is held by a curable fixing member provided on the circuit board at a distance smaller than the predetermined distance from the side edge of the circuit board.

Abstract: An electronic part assembly composed of electronic parts wherein a projecting electrode formed on an electrode pad is pressed against a wiring pattern of a circuit board. A cover member a arranged so as to cover the electronic parts, and has a leg portion designed to be joined to the circuit board. A shape memory alloy member is arranged between the cover member and the electronic parts to press a reverse side surface so that electric connection between the projecting electrode and the wiring pattern can be maintained.

Abstract: The improved liquid-crystal display device has a slit formed in part of the TAB area where the electrodes on the liquid-crystal display panel are connected to the output terminals on the TAB and the liquid-crystal display panel is bonded to the TAB by means of a first anisotropic conductive adhesive having a comparatively weak adhesive force, such as a thermoplastic anisotropic conductive adhesive, whereas a second anisotropic conductive adhesive having a comparatively strong adhesive force, such as a uv curable adhesive, is coated in the slit.

Abstract: In order to electrically connect the projecting electrodes of an LSI with a given wiring pattern on a circuit substrate, at least a portion of the electronic part is covered with a heat-shrinkable film member which in turn is fixedly mounted on the circuit substrate by adhesive at the opposite side or all the sides of the heat-shrinkable film member. When the heat-shrinkable film member is heated, the shrinkage of the heat-shrinkable film member presses the LSI against the circuit substrate under pressure. Thus, the bumps of the LSI can be electrically connected with the wiring pattern on the circuit substrate. Therefore, the LSI can be easily mounted on the circuit substrate or replaced by a new one.

Abstract: The improved liquid-crystal display device has a slit formed in part of the TAB area where the electrodes on the liquid-crystal display panel are connected to the output terminals on the TAB and the liquid-crystal display panel is bonded to the TAB by means of a first anisotropic conductive adhesive having a comparatively weak adhesive force, such as a thermoplastic anisotropic conductive adhesive, whereas a second anisotropic conductive adhesive having a comparatively strong adhesive force, such as a uv curable adhesive, is coated in the slit.

Abstract: In the disclosed semiconductor device mounting arrangement, an integrated circuit has an elastic body on one surface and protruding electrodes on the opposite surface and a support frame includes a pressing member to engage the elastic body directly so as to force the protruding electrodes into engagement with a wiring pattern formed on a substrate. In the disclosed semiconductor device mounting method, a liquid crystal display panel having an integrated circuit with protruding electrodes is placed on a wiring pattern and an elastic body is provided on the surface of the integrated circuit which is opposite from the protruding electrodes. The assembled components are positioned between a pressing portion and a base member of a support frame so that the elastic body is compressed and the reaction from the compression is utilized to engage the protruding electrodes with the wiring pattern.

Abstract: A carbon fiber chopped strands suitable for use in production of a composite with a matrix material, which have a circular or elliptical cross-section, wherein carbon fiber filaments are bundled by a sizing agent in an amount of from 1 to 10% by weight based on the chopped strand, and which have denseness of from 0.4 to 0.9 according to the formula below: ##EQU1## where D denotes the average diameter of the chopped strands, d denotes the average diameter of filaments constituting the chopped strand and N denotes the number of the filaments, and a method for production thereof by impregnating a carbon fiber strand with a sizing agent in an amount of from 1 to 10% by weight based on the total weight of the chopped strand to form a sized strand, and then cutting the sized strand, thereby giving the denseness of from 0.4 to 0.9 according to the formula (1).

Abstract: In a method of assembling an electronic part device and a circuit board, an electrode formed on the electronic part device and a conductive pattern formed on the circuit board so as to be opposite to the electrode are positioned, and a thermosetting resin sheet including a thermally shrinkable particle and provided between the electronic part device and the circuit board is hardened and shrunk.

Abstract: A display apparatus of plane type includes a display panel, a drive signal supplying board arranged opposite to the display panel at a predetermined space therefrom for supplying a drive signal for the display panel, a drive integrated circuit device mounted on the board through a flexible plate and connected to a connecting portion of the display panel through the flexible plate, a first polarizing plate arranged on the upper surface of the display panel, and a second polarizing plate arranged to the under surface of the display panel and extending to the under surface of the drive signal supplying board to be fixed thereto.

Abstract: A method for manufacturing activated carbon fibers is disclosed. The method is comprised of the steps of:(1) causing an acrylic fiber to contain therein a treating agent selected from the group consisting of phosphorus and boron compounds in a concentration of 0.01 to 0.3% by weight as phosphorus or boron based on the weight of the fiber;(2) preoxidizing the acrylic fiber in an oxidizing atmosphere at a temperature exceeding 200.degree. C. and giving a core ratio of 18% until the amount of bonded oxygen becomes not less than 15% by weight based on the weight of the fiber thereby producing a preoxidized fiber;(3) adjusting the concentration of the treating agent in the preoxidized fiber to a level in the range of 0.04 to 1% by weight based on the thus obtained preoxidized fiber; and(4) thereafter activating the fiber at a temperature in the range of 900.degree. to 1,300.degree. C. The resulting fiber has improved high strength, high adsorbing ability and high processibility.

Abstract: A fibrous activated carbon with a metal chelate compound supported thereon which is suitable for removal of toxic substances in gas. This activated carbon is obtained by attaching a solution or dispersion of the metal chelate compound onto the fibrous activated carbon followed by drying. Contacting the activated carbon with a toxic substance-containing gas provides very efficient removal of the toxic substance from the gas.