Abstract: A cooling device for a portable electronic comprises a radiation plate and a fin for radiating the heat from the CPU. When the plug of an external power. supply is attached to the body of the portable electronic, the CPU may operate at a high clock frequency. The cooling device achieves a high cooling performance by operating a ventilation fan directed to the fin, for example. When the plug is removed from the body of the portable electronic, the CPU may operate at a low clock frequency. Power consumption can be reduced, so that the electric power stored in the built-in battery can be saved. The duration time of the operation can be extended. Calorific power generated at the CPU can also be reduced, so that the cooling device is adapted to suppress the rise in the temperature of the CPU without operation of the ventilation fan.

Abstract: The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.

Abstract: It is an object of the present invention to provide a cooling system capable of simultaneously cooling the electronic parts on a multichip module that is arranged so as to provide a predetermined function, wherein the cooling system can be easily and quickly attached to and detached from the module when necessary.

Abstract: The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.

Abstract: The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.

Abstract: Disclosed are novel pradimicin compounds which possess antifungal activity and, preferably, improved water solubility. The compounds of the invention are prepared by modifying the 4′-amino or 4′-alkylamino moieties of known pradimicin compounds.

Abstract: The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.

Abstract: The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.

Abstract: It is an object of the present invention to provide a cooling system capable of simultaneously cooling the electronic parts on a multichip module that is arranged so as to provide a predetermined function, wherein the cooling system can be easily and quickly attached to and detached from the module when necessary.

Abstract: An IC card adapted to be removably inserted into a slot of an IC card mountable device, including a card housing formed like a substantially rectangular card with an inside space defined therein, the card housing having a plurality of openings through a wall of the card housing; a printed wiring board accommodated in the card housing; and a plurality of electronic components mounted on the printed wiring board.

Abstract: A heat sink structure of a module substrate includes a plurality of stripe-like bottom regions extending in a longitudinal direction and repeated in a lateral direction with a predetermined pitch, a plurality of stripe-like top regions extending in said longitudinal direction and repeated in the lateral direction with said predetermined pitch, such that the stripe-like bottom regions and the stripe-like top regions are repeated alternately in the lateral direction, wherein the stripe-like top regions and the stripe-like bottom regions have respective lateral edges that are connected with each other by cooling fins.

Abstract: A semiconductor element cooling apparatus adapted to cool at least one semiconductor element mounted on a circuit substrate. The semiconductor element cooling apparatus includes a first mechanism for generating a coolant flow by flowing a coolant over a top surface of the semiconductor element, and a second mechanism for obliquely obstructing the coolant flowing over the semiconductor element from an upstream side towards a downstream side of the coolant flow.

Abstract: A multi-chip module includes a base board, a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, circuit elements mounted on a main surface of the thin-film multi-layer circuit board, and terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted.

Abstract: Disclosed are novel pradimicin compounds which possess antifungal activity and, preferably, improved water solubility. The compounds of the invention are prepared by modifying the 4'-amino or 4'-alkylamino moieties of known pradimicin compounds.

Abstract: A fibrous bone filler having an excellent biocompatibility. The bone filler comprises fibers containing hydroxyl apatite. The hydroxyl apatite is "intact", that is, the hydroxyl apatite substantially retains its hydroxyl groups.

Abstract: A method for melting and reducing chrome ore, which comprises charging chrome ore and carbonaceous material, and blowing in oxygen gas under a pressure ranging from 1 to 600 Torr, while molten metal is being stirred by a stirring gas blown in. In this method, a reaction vessel capable of allowing top blowing and bottom blowing onto the molten metal and decreasing pressure within the vessel is employed. Chrome ore and carbonaceous material can be used in the form of lumps or powder. When powdered ore and material are used, they can be injected through a lance or a tuyere into the vessel.

Abstract: A high-speed steel obtained by powder metallurgy processing wherein a chemical composition includes, by weight %,C: a quantity (%) which satisfies with the following formula ##EQU1## where Ceq=0.19+0.017 (W+2Mo)+0.22 VN, W, Mo and V are respectively the content (%) in steel______________________________________ Cr: 3-5% V: 6.0-8.5% Mo: 4-7.5% Co: 5-15% W: 5-7% N: 0.2-1.7% ______________________________________and the remainder is Fe, and (W+2Mo) is 15-20% is disclosed.

Abstract: A high-speed steel obtained by powder metallurgy processing having a chemical composition which includes, in weight %,C: a quantity (%) which satisfies the formulaCeq+0.15.ltoreq.C+12/14 N.ltoreq.Ceq+0.35where Ceq=0.19+0.017 (W+2Mo)+0.22V, andN, W, Mo and V are respectively the content (%) in steel______________________________________ Cr: 3-5% V: 4.0-6.0% Mo: 8-12% Co: 5-15% W: 8-14% N: 0.2-1.2% ______________________________________and the remainder is Fe, and (W+2Mo) is 27-32%, is disclosed.

Abstract: A nitrogen containing high speed steel produced by powder metallurgical process, which comprises at least 0.40% N, 3.0-15% V, C in an amount satisfying the relationship of 1.0 + 0.2V (%) .ltoreq. (C + N) .ltoreq. 1.5 + 0.2V (%), at least one element selected from the group consisting of up to 15% Cr, up to 10% Mo, up to 20% W, and up to 15% Co, with balance iron.