Patents by Inventor Minoru Kawagishi

Minoru Kawagishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210205378
    Abstract: A lactic acid bacterial strain Enterococcus durans (E. durans) HS-08 or a processed product thereof is provided having IgA production promoting effects, immunostimulation, and antiallergic effects. The product also provides an inhibitory effect on proliferation of harmful bacteria and/or pathogenic bacteria, protective effect on the mucosa, enhancing effect on short chain fatty acid production, enhancing effect on organic acid production, upregulating effect on the expression of the GRP43 gene, modulating effect on plant growth, preventive effect on plant lodging, adjustment effect on the umami taste of plants, promoting effect on animal growth, or enhancement of immunity in animals.
    Type: Application
    Filed: April 1, 2019
    Publication date: July 8, 2021
    Inventors: Yoshihito Tanaka, Minoru Kawagishi, Masaru Sato, Saki Fujita
  • Patent number: 6135338
    Abstract: An ultrasonic horn that has a capillary attachment hole to hold a capillary therein so as to be used in wire bonding, including a perpendicular slit provided on the opposite side of the capillary attachment hole from the tip end of the ultrasonic horn. An area surrounding the capillary attachment hole is formed thin, and the slit is narrowed and tightened by a bolt so as to insure a stable capillary holding force and prevent deterioration in the holding force over time.
    Type: Grant
    Filed: October 12, 1998
    Date of Patent: October 24, 2000
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Ryuichi Kyomasu, Minoru Kawagishi, Mitsuaki Sakakura, Tadashi Akiike
  • Patent number: 5904286
    Abstract: An ultrasonic horn used in, for instance, wire bonding having a structure for holding a capillary therein, the capillary holding structure including an external screw section which protrudes from the end surface of the horn and a spacer mount which is larger in diameter than the external screw section and formed on the root portion of the external screw section. A ring-form spacer is mounted on the spacer mount, and the spacer has a shape that prevents the rotation of the spacer on the spacer mount and is formed so that its vertically opposing end portions are positioned above and below the capillary attachment hole, and the length between the horizontally opposing end portions of the spacer is shorter than the length of the vertically opposing end portions.
    Type: Grant
    Filed: August 21, 1997
    Date of Patent: May 18, 1999
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Minoru Kawagishi, Mitsuaki Sakakura, Tadashi Akiike
  • Patent number: 5540807
    Abstract: An ultrasonic horn of a bonding apparatus quipped with a bonding tool attached to one end of the horn and a vibration-generating source such as an electrostrictive strain element, magnetostrictor, etc. attached to a bonding arm that supports the bonding horn. The ultrasonic horn is further provided with a vertical vibration adjuster which adjusts the vertical component of the vibration of the ultrasonic horn, and the vertical vibration adjuster includes a projection, recess, etc. provided at the end of the horn.
    Type: Grant
    Filed: November 29, 1994
    Date of Patent: July 30, 1996
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Tadashi Akiike, Minoru Kawagishi, Mitsuaki Sakakura
  • Patent number: 5385288
    Abstract: A bonding apparatus used in manufacturing semiconductor devices, etc. including an ultrasonic horn mounted to a bonding arm of the bonding apparatus via a horn support. The ultrasonic horn is provided with a bonding tool at one end and a vibration-generating source at another end, and respective values of vibrational wavelengths on both sides of the horn support are set so that the value on the bonding tool side of the horn support is 7 or greater relative to a value of 3 on the opposite side of the horn support from the capillary. In other words, the distance from the horn support to the end of the vibration-generating source is set to be 1/4 of the wavelength, and the distance from the horn support to the end of the horn where the bonding tool is attached is set to be 3/4 of the wavelength.
    Type: Grant
    Filed: December 22, 1993
    Date of Patent: January 31, 1995
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Ryuichi Kyomasu, Mitsuaki Sakakura, Minoru Kawagishi, Tadashi Akiike
  • Patent number: 4989756
    Abstract: A paste-dispensing apparatus for bonding machines, etc., which constantly dispenses a fixed amount of paste, glue, etc. regardless of the amount remaining in a syringe and detects the amount of paste remaining in the syringe, including an air supply which supplies air under positive pressure to the syringe, a dispensing valve installed between the syringe and the air supply and connected to the syringe via a first pipe and to the air supply via a second pipe so that the syringe and the air supply communicate with each other when the paste is discharged, a first pressure sensor which measures the pressure inside the first pipe, a second pressure sensor which measures the pressure inside the second pipe, and a controller. Pressure values measured by the first and second pressure sensors are supplied to the controller so that the controller outputs a signal which actuates the dispensing valve so that the first and second pipes communiate when the paste is discharged.
    Type: Grant
    Filed: February 3, 1989
    Date of Patent: February 5, 1991
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Mitsuru Kagamihara, Minoru Kawagishi, Nobuto Yamazaki
  • Patent number: 4913763
    Abstract: A die bonding apparatus including a vertically moving block, a collet holder provided on the vertically moving block such that the collet holder itself freely moves up and down, a collet which holds a die to be bonded to a substrate and is installed in the collet holder, a first contact provided on the vertically moving block, and a second contact provided on the collet holder so that the second contact is pressed by a spring to make contact with the upper surface of the first contact. The position where rapid downward movement of the collet is stopped and the bonding load applied to the substrate are decided based upon a signal which is generated upon separation of the two contacts.
    Type: Grant
    Filed: December 22, 1988
    Date of Patent: April 3, 1990
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Nobuto Yamazaki, Minoru Kawagishi