Patents by Inventor Minoru Kawai

Minoru Kawai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polytetrafluoroethylene resins that can be processed by shaping, shaped products thereof, and processes for producing the resins and shaped products
    Patent number: 9266984
    Abstract: A polytetrafluoroethylene resin comprising polytetrafluoroethylene having a two-dimensional branched structure in the molecule is produced by exposing polytetrafluoroethylene to an ionizing radiation at a dose of no more than 10 kGy.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: February 23, 2016
    Assignees: RAYTECH CORPORATION, DAIKIN INDUSTRIES, LTD.
    Inventors: Yoneho Tabata, Hideto Suzuki, Shigetoshi Ikeda, Minoru Iida, Minoru Kawai, Gen Kojima, Yasuhiko Sawada
  • POLYTETRAFLUOROETHYLENE RESINS THAT CAN BE PROCESSED BY SHAPING, SHAPED PRODUCTS THEREOF, AND PROCESSES FOR PRODUCING THE RESINS AND SHAPED PRODUCTS
    Publication number: 20110171403
    Abstract: A polytetrafluoroethylene resin comprising polytetrafluoroethylene having a two-dimensional branched structure in the molecule is produced by exposing polytetrafluoroethylene to an ionizing radiation at a dose of no more than 10 kGy.
    Type: Application
    Filed: September 30, 2009
    Publication date: July 14, 2011
    Inventors: Yoneho Tabata, Hideto Suzuki, Shigetoshi Ikeda, Minoru Iida, Minoru Kawai, Gen Kojima, Yasuhiko Sawada
  • Adjustable position fixing apparatus for instrument and the like
    Patent number: 5447149
    Abstract: An adjustable position fixing apparatus for fixing instruments such as an endoscope and an illuminator in a desired spatial position is provided. The adjustable position fixing apparatus for an instrument and the like comprises a cylinder communicating with a pressure fluid supplying machine, such as a compressor, through a switching device, a mount member for mounting an instrument and the like thereon, and an adjustable bending arm portion through which a linear element such as a wire extends. The arm portion is disposed between the cylinder and the mount member over an entire area or a part thereof. One end of the linear element is attached to a reciprocating rod of the cylinder and the other end is attached to the mount member.
    Type: Grant
    Filed: August 25, 1993
    Date of Patent: September 5, 1995
    Assignee: Kabushiki Kaisha Eier
    Inventors: Toru Kikawada, Minoru Kawai